Winbond Electronics Corporation W9812G2KB-6

Overview

W9812G2KB-6 from Winbond is a 3.3V synchronous DRAM IC organized as 1M × 4 banks × 32 bits (128 Mbit total), supporting 166 MHz operation with CAS Latency 3, LVTTL interface, and dual-die-package (DDP) construction for embedded main memory in industrial controllers and legacy computing systems.

For engineers reviewing the W9812G2KB-6 datasheet, W9812G2KB-6 pinout, W9812G2KB-6 application, or W9812G2KB-6 equivalent, key selection considerations include its TFBGA-90 package, burst lengths of 1/2/4/8/full-page, auto-precharge capability, self-refresh current ≤4 mA, and -6 grade temperature range (0°C to 70°C).

Technical Context

This SDRAM implements four independent 32-bit banks with interleaved access to hide precharge latency. It uses multiplexed address pins (A0–A11) for row/column addressing, bank selection via BS0/BS1, and command decoding synchronized to CLK rising edges with CKE-controlled clock enable.

Functional operation relies on programmable Mode Register configuration for burst type (sequential/interleave), burst length, and CAS latency. Critical timing parameters include tRCD ≥20 ns, tRP ≥20 ns, tRC ≥60 ns, and tREF = 64 ms requiring 4K refresh cycles - all guaranteed under 166 MHz / CL3 conditions for the -6 grade.

Key Specifications

Pinout & Package

W9812G2KB-6 is housed in a 90-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package measuring 8 mm × 13 mm with 0.8 mm ball pitch. The package integrates two identical 64M-bit SDRAM dies (each 4M × 16) in a Dual-Die-Package (DDP) configuration, sharing control and address signals while maintaining independent DQ buses.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Compared with IS42S16160B-6TLI and MT48LC16M16A2P-6A:G, W9812G2KB-6 offers unique space savings via TFBGA-90 DDP packaging while maintaining identical 166 MHz/CL3 performance - making it optimal for compact industrial modules where board area is constrained but legacy SDRAM timing compliance is mandatory.

Availability

W9812G2KB-6 is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, and legacy PC platform memory upgrades requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for W9812G2KB-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, PSRAM, and SDRAM for industrial, automotive, and consumer applications.

The W9812G2KB series belongs to Winbond's legacy SDRAM product line designed specifically for cost-sensitive, space-constrained embedded systems requiring proven 3.3V LVTTL timing compliance and long-term manufacturability.

FAQ

What is the memory organization and total capacity of the W9812G2KB-6?

The W9812G2KB-6 is organized as 1M words × 4 banks × 32 bits, delivering a total capacity of 128 Mbit (16 MB). This structure enables efficient bank-interleaved access and supports standard SDRAM controller interfaces used in industrial microprocessors and FPGAs. Each of the four internal banks operates independently, allowing concurrent row activation and column access across banks to maximize bandwidth utilization in the W9812G2KB-6.

Does the W9812G2KB-6 support both sequential and interleave burst modes?

Yes, the W9812G2KB-6 supports both sequential and interleave burst addressing modes, which are configured via the Mode Register Set command. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleave mode toggles specific address bits (A0–A2 depending on burst length) to optimize cache-line alignment. This flexibility allows the W9812G2KB-6 to match varying data access patterns in embedded applications such as video frame buffering and packet processing.

What is the operating temperature range for the W9812G2KB-6 grade?

The W9812G2KB-6 grade is specified for operation from 0°C to 70°C ambient temperature. This commercial-industrial range suits applications like factory automation controllers, test equipment, and legacy computing platforms where extended thermal margins are not required. For wider temperature operation, the pin-compatible W9812G2KB-6I variant supports –40°C to +85°C and shares identical electrical and timing specifications with the W9812G2KB-6 except for thermal qualification.

How does the Dual-Die-Package (DDP) architecture affect PCB layout for the W9812G2KB-6?

The W9812G2KB-6 integrates two 64M-bit SDRAM dies in a single TFBGA-90 package, sharing all control, clock, and address signals while maintaining independent DQ0–DQ15 and DQ16–DQ31 buses. This eliminates the need for two separate SDRAM packages and associated routing complexity. PCB layout must observe strict length matching within each 16-bit DQ group and maintain controlled impedance for CLK, DQS (if used), and command/address nets - consistent with standard SDRAM layout practices applied to the W9812G2KB-6.

What refresh mechanism does the W9812G2KB-6 require to retain data?

The W9812G2KB-6 requires 4,096 refresh cycles every 64 ms (tREF = 64 ms) to retain stored data. It supports both Auto-Refresh (external controller issues REFRESH commands) and Self-Refresh (internal oscillator maintains refresh during CKE-low state with ≤4 mA current). During Self-Refresh, the W9812G2KB-6 suspends all external interface activity and disables its internal clock, making it ideal for low-power suspend modes in battery-backed systems.