Winbond Electronics Corporation W9812G2KB-6I TR

Overview

W9812G2KB-6I TR from Winbond is a 1M × 4 banks × 32-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (–40°C to +85°C); it delivers up to 166M words/sec bandwidth and supports burst lengths of 1, 2, 4, 8, or full page in sequential or interleave mode for main memory in embedded controllers and industrial HMIs.

For engineers reviewing the W9812G2KB-6I TR datasheet, W9812G2KB-6I TR pinout, W9812G2KB-6I TR application, or W9812G2KB-6I TR equivalent, key selection criteria include its dual-die-package (DDP) architecture, TFBGA-90 (8×13 mm²) RoHS-compliant封装, LVTTL interface compatibility, auto-precharge capability, and industrial-grade thermal reliability.

Technical Context

This SDRAM implements a four-bank architecture with programmable Mode Register control over burst length, CAS latency (CL2/CL3), and burst type (sequential/interleave). Its dual-die-package integrates two independent 64M-bit (4M×16) SDRAM dies sharing common control and clock signals but with separate DQ buses (DQ[15:0] and DQ[31:16]) and dedicated DQM lines per 16-bit segment.

Functional operation relies on precise timing coordination: Bank Activate requires tRCD ≥ 20 ns before Read/Write; Auto-precharge is triggered by A10 high during command latching; Self Refresh mode suspends external clocks while maintaining data integrity via internal refresh counters; and Power Down mode gates input buffers when CKE is low - all compliant with JEDEC Standard No. 22-A.

Key Specifications

Pinout & Package

W9812G2KB-6I TR uses a TFBGA-90 package (8 mm × 13 mm, 0.8 mm pitch) with lead-free, RoHS-compliant construction. Ball layout supports dual-die operation with shared control signals and segregated I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Compared with IS42S16160B-6BLI and MT48LC16M16A2P-6A:G, W9812G2KB-6I TR uniquely delivers 32-bit bus width and dual-die integration in a compact TFBGA-90 package, reducing board area and interconnect complexity for high-throughput embedded memory subsystems - especially where industrial temperature range and LVTTL compatibility are mandatory.

Availability

W9812G2KB-6I TR is available at Aetrix Electronics and suitable for industrial HMI systems, embedded vision controllers, railway onboard computers, and medical diagnostic terminals requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W9812G2KB-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, PSRAM, and SDRAM for industrial, automotive, and consumer applications.

The W9812G2KB series belongs to Winbond's industrial-grade SDRAM product line, designed specifically for embedded systems demanding reliable, high-bandwidth memory with extended temperature operation and JEDEC-compliant timing behavior.

FAQ

What is the memory organization and total capacity of the W9812G2KB-6I TR?

The W9812G2KB-6I TR is organized as 1M words × 4 banks × 32 bits, delivering a total capacity of 128 Mbit (16 MB). This configuration arises from its Dual-Die-Package architecture, where two 64M-bit (4M×16) SDRAM dies are integrated into a single TFBGA-90 package - enabling efficient 32-bit data transfers without requiring two discrete memory chips. Each die operates independently under shared control signals.

Does the W9812G2KB-6I TR support CAS Latency 2, and how is it configured?

Yes, the W9812G2KB-6I TR supports both CAS Latency 2 and CAS Latency 3, selectable via the Mode Register Set command. The CL setting is programmed using address bits A0–A2 during the Mode Register initialization cycle. While the -6I speed grade is specified for 166 MHz/CL3 operation, CL2 mode is electrically supported and may be used at reduced frequencies or with tighter timing margins - subject to validation against the device's AC characteristics table in the official datasheet.

How does the dual-die architecture of the W9812G2KB-6I TR affect signal routing and termination?

The dual-die architecture of the W9812G2KB-6I TR shares critical control signals (CLK, CKE, CS#, RAS#, CAS#, WE#, A[11:0], BS[1:0]) between both dies but separates the data and mask paths: DQ[15:0]/DQM0/DQM1 serve the lower die, while DQ[31:16]/DQM2/DQM3 serve the upper die. This requires independent termination networks for each 16-bit segment - typically 40–50 Ω series resistors near the controller for DQ lines and parallel AC termination at the SDRAM end for CLK/CKE. Shared control nets must be length-matched across both dies' loading points.

Can the W9812G2KB-6I TR operate in Self Refresh mode without external clock input?

Yes, the W9812G2KB-6I TR fully supports Self Refresh mode with CKE held low and all other control signals inactive. In this state, the internal refresh counter sustains memory retention without external clocking - the CLK input is effectively disabled, and power consumption drops significantly. Exit from Self Refresh requires CKE to return high, followed by a tXSR delay (≥100 ns) before issuing any new command. This capability is essential for battery-backed or low-power standby operation in portable industrial devices.

What is the significance of the "TR" suffix in W9812G2KB-6I TR?

The "TR" suffix in W9812G2KB-6I TR denotes tape-and-reel packaging - indicating the part is supplied in industry-standard EIA-481 compliant reels, typically containing 1,000 units per reel. This format is optimized for automated SMT placement and ensures consistent handling, moisture sensitivity level (MSL) compliance (per J-STD-020), and traceability throughout manufacturing. The TR variant shares identical electrical, thermal, and functional specifications with the tray-packaged version (W9812G2KB-6I).