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Winbond Electronics Corporation W9812G6IH-6

Part No.:
W9812G6IH-6
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
54-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9812G6IH-6.pdf
Description:
IC DRAM 128MBIT PAR 54TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,841

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Product details

Overview

W9812G6IH-6 from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V LVTTL interface, and TSOP II-54 package. It delivers 166 million words/second bandwidth and supports burst lengths of 1–8 and full-page, enabling high-throughput memory access in embedded controllers and legacy industrial systems.

For engineers reviewing the W9812G6IH-6 datasheet, W9812G6IH-6 pinout, W9812G6IH-6 application, or W9812G6IH-6 equivalent, key selection criteria include its 166 MHz/CL3 timing compliance, 4K refresh cycles per 64 ms, self-refresh capability, TSOP II-54 mechanical footprint, and support for interleaved bank operations to hide precharge latency.

Technical Context

This SDRAM implements a fully synchronous architecture with programmable mode register control over burst length (1, 2, 4, 8, full page), burst type (sequential or interleave), and CAS latency (2 or 3). Its four internal banks enable true interleaving-allowing one bank to be accessed while another precharges-reducing effective access latency.

It supports auto-precharge (via A10 high during read/write), controlled precharge, self-refresh (CKE low), and power-down modes. All command decoding occurs on the rising edge of CLK; DQ masking is managed independently via LDQM and UDQM for byte-level write control.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 2,097,152 words × 4 banks × 16 bits = 67,108,864 bits (8 MB)
Max Clock Frequency 166 MHz - defines maximum sustained data transfer rate of 166 Mwords/s
CAS Latency CL = 3 - fixed 3-clock delay between column address strobe and first valid data output
Burst Length Programmable 1, 2, 4, 8, or full-page - determines consecutive column accesses per command
Refresh Requirement 4,096 cycles / 64 ms - mandates refresh controller intervention every ~15.6 µs per row
Supply Voltage 3.3 V ± 0.3 V - requires stable LVTTL-compatible power rail; VDD and VDDQ are separated
Operating Temperature 0°C to +70°C - commercial-grade thermal specification for W9812G6IH-6 variant
Package TSOP II, 54-pin, 400 mil - surface-mount, RoHS-compliant lead-free package with defined pin pitch and body dimensions

Pinout & Package

W9812G6IH-6 uses a 54-pin TSOP II (Type II) thin small-outline package, 400 mil wide, with lead-free RoHS-compliant construction. Pin 1 is located at the bottom-left corner when the marking side faces up and the notch is oriented left.

Pin/Terminal Circuit Role Design Meaning
A0–A11 Address Input (Multiplexed) Row/column address inputs; A0–A11 used for row, A0–A8 for column; A10 controls auto-precharge
BS0, BS1 Bank Select Selects one of four internal banks during ACTIVATE or PRECHARGE commands
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; driven by internal buffers powered by VDDQ/VSSQ
LDQM, UDQM Lower/Upper Data Mask Byte-level write masking: LDQM masks DQ0–DQ7, UDQM masks DQ8–DQ15
CS, RAS, CAS, WE Command Control Four active-low control signals defining all operations (e.g., CS+RAS+CAS+WE = Mode Register Set)
CLK, CKE Clock Interface CLK synchronizes all inputs; CKE enables/disables clock domain - low enters Self Refresh or Power Down
VDD, VDDQ, VSS, VSSQ Power/Ground VDD/VSS for core logic; VDDQ/VSSQ isolated for I/O buffers to reduce switching noise coupling
NC No Connect Pins 36 and 40 are unconnected - must remain floating or tied to no net

Key Features

Feature Design Value
Interleaved Bank Architecture Enables continuous data streaming across 4 banks without waiting for tRP, improving effective bandwidth
Programmable Burst Mode Supports sequential or interleave addressing - critical for optimizing cache line fetches in CPU interfaces
Auto-Precharge Capability Automatically initiates precharge after burst completion when A10=high - eliminates explicit PRECHARGE command overhead
Self-Refresh Mode Retains data with only CKE held low; internal oscillator manages refresh - essential for low-power suspend states
LVTTL-Compatible Interface 3.3V signaling with defined VIH/VIL thresholds ensures interoperability with legacy microcontrollers and FPGAs
Separate I/O Power Rails VDDQ/VSSQ isolation reduces data bus noise and improves signal integrity during high-speed bursts

Applications

Industrial HMI Controller Legacy Networking Switch

Use Scenario: A panel-mounted human-machine interface running real-time UI rendering and serial protocol stacks on an ARM9-based SoC.

IC Role / Device Role / Timing Role: Main system memory providing 16-bit wide data path for instruction and framebuffer storage with deterministic CL3 latency.

Use Value: Interleaved bank operation sustains >120 MB/s effective bandwidth under mixed read/write loads typical of GUI refresh and event handling.

Use Scenario: Layer-2 Ethernet switch ASIC requiring external buffer memory for packet queuing and header parsing.

IC Role / Device Role / Timing Role: Shared packet buffer supporting concurrent ingress/egress DMA channels with burst-length-4 reads/writes.

Use Value: Auto-precharge (A10=high) reduces command overhead per packet, enabling sub-100 ns average access time across multiple queues.

Medical Diagnostic Display Automated Test Equipment (ATE)

Use Scenario: High-resolution monochrome display subsystem in ultrasound imaging equipment with strict EMI limits.

IC Role / Device Role / Timing Role: Frame buffer memory interfaced to FPGA video controller using LVTTL timing and separated VDDQ/VSSQ rails.

Use Value: Isolated I/O power domains suppress switching noise that could interfere with analog front-end signal acquisition.

Use Scenario: Boundary-scan controller board performing high-speed digital pattern generation and capture.

IC Role / Device Role / Timing Role: Pattern storage memory synchronized to 166 MHz test clock, supporting burst-length-8 writes for stimulus loading.

Use Value: Full-page burst capability allows rapid initialization of multi-MB test vectors without command pipeline stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS42S16100E-6BLI Same 2M×4×16 organization, 166 MHz/CL3, TSOP-54, but supports extended temperature (–40°C to +85°C) Valid for industrial environments where W9812G6IH-6's 0°C–70°C range is insufficient Select if ambient operating temperature exceeds +70°C or requires automotive qualification traceability
MT48LC16M16A2P-6A Identical speed grade (166 MHz/CL3), same density and bus width, but uses 54-pin TSOP-II with different pinout (e.g., DQ ordering, VDDQ placement) Requires PCB layout revision due to non-pin-compatible pin mapping and power rail routing differences Choose only when redesigning for Micron's long-term supply assurance and JEDEC-compliant timing margins

Compared with W9812G6IH-6, IS42S16100E-6BLI extends temperature range without changing footprint or timing, while MT48LC16M16A2P-6A offers identical performance but demands board-level rework due to incompatible pin assignment and power delivery structure.

Availability

W9812G6IH-6 is available at Aetrix Electronics and suitable for industrial HMI controllers, legacy networking switches, medical diagnostic displays, and automated test equipment requiring stable component supply across extended production lifecycles.

Supply support for W9812G6IH-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and trusted computing solutions, with global manufacturing and distribution infrastructure.

W9812G6IH-6 belongs to Winbond's legacy SDR SDRAM product line, designed specifically for cost-sensitive, long-lifecycle embedded systems requiring proven 3.3V LVTTL compatibility and TSOP II mechanical fit.

FAQ

What is the maximum operating frequency and CAS latency of the W9812G6IH-6?

The W9812G6IH-6 is rated for 166 MHz maximum clock frequency with CAS Latency 3 (CL3). This means the device requires exactly three clock cycles between issuing a column address strobe (CAS) and the appearance of the first valid data word on DQ pins. Its AC timing parameters-including tAC, tRCD, and tRP-are guaranteed only under these conditions, and it is not rated for 200 MHz operation like the -5 variant.

Does the W9812G6IH-6 support self-refresh mode, and how is it activated?

Yes, the W9812G6IH-6 supports self-refresh mode. It is activated by asserting CS, RAS, CAS, and WE low while holding CKE low on the rising edge of CLK. Once entered, the SDRAM internally manages all refresh cycles without external clock or command input-only CKE must remain low. Exit occurs when CKE returns high, followed by tXSR delay before new commands are accepted.

What is the purpose of the LDQM and UDQM pins on the W9812G6IH-6?

LDQM (Lower Data Mask) and UDQM (Upper Data Mask) provide byte-level write masking for the 16-bit DQ bus. LDQM controls DQ0–DQ7, and UDQM controls DQ8–DQ15. When sampled high during a write cycle, the corresponding byte lane is blocked with zero latency-enabling partial-word writes without read-modify-write overhead. During reads, they place the masked byte outputs in high-impedance state.

Can the W9812G6IH-6 be used in automotive applications?

No-the W9812G6IH-6 is specified for 0°C to +70°C operation and is not qualified for automotive use. Winbond offers the W9812G6IH-6A variant, which is explicitly rated for –40°C to +85°C and undergoes additional AEC-Q100 stress testing. Substituting W9812G6IH-6 in automotive designs risks data retention failure or timing violation outside its validated temperature envelope.

How does auto-precharge work on the W9812G6IH-6, and what pin controls it?

Auto-precharge on the W9812G6IH-6 is enabled by driving A10 high during a READ or WRITE command. When activated, the SDRAM automatically initiates precharge of the accessed bank shortly before burst completion-eliminating the need for a separate PRECHARGE command. For reads, precharge starts tCL clocks before burst end; for writes, it begins two clocks after final data-in (tWR), followed by tRP before reactivation.

W9812G6IH-6 Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
54-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-TSOP II

W9812G6IH-6 FAQ

1.How can I place an order for W9812G6IH-6 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9812G6IH-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9812G6IH-6 reliable?

The price and inventory of W9812G6IH-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6IH-6 is usually 5 days.

3.What payment methods are accepted for W9812G6IH-6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6IH-6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9812G6IH-6?

W9812G6IH-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9812G6IH-6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9812G6IH-6?

For technical support, including W9812G6IH-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6IH-6 requirements.

6.How does Aetrix verify that W9812G6IH-6 is sourced from the original manufacturer or authorized distributors?

All W9812G6IH-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6IH-6 meets industry standards.

7.What is the process for return or replacement of W9812G6IH-6?

All W9812G6IH-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6IH-6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9812G6IH-6 part is unused and in its original packaging.

Return procedure for W9812G6IH-6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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