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Winbond Electronics Corporation W9812G6JB-6
- Part No.:
- W9812G6JB-6
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TFBGA
- Datasheet:
-
W9812G6JB-6.pdf
- Description:
- IC DRAM 128MBIT PAR 54TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,120
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Product details
Overview
W9812G6JB-6 from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and TFBGA-54 (8×8 mm²) packaging. It delivers up to 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and industrial display systems.
For engineers reviewing the W9812G6JB-6 datasheet, W9812G6JB-6 pinout, W9812G6JB-6 application, or W9812G6JB-6 equivalent, key selection criteria include its -6 speed grade (166 MHz/CL3), industrial-grade thermal range compatibility (0°C to 70°C), LVTTL interface compliance, self-refresh capability (2 mA max), and bank-interleaved access architecture enabling seamless page-mode transfers.
Technical Context
The W9812G6JB-6 implements a four-bank SDRAM architecture with programmable mode register control over burst length (1–8, full page), burst type (sequential/interleave), and CAS latency (2 or 3). Its command decoder interprets RAS/CAS/WE/CS on CLK rising edges to execute bank activate, read/write, auto-precharge, self-refresh, and power-down operations.
It supports interleaved bank access to hide precharge delays (tRRD = 15 ns min), uses separate VDDQ/VSSQ rails for I/O noise immunity, and requires tRCD ≥ 20 ns between bank activate and first access. The device enters self-refresh when CKE and all control inputs are low, suspending clock and external signal activity while maintaining data integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 4 banks × 16 bits - provides 16 MB total capacity with bank-level parallelism for concurrent row activation. |
| Clock Frequency | 166 MHz - defines maximum bus throughput of 166 Mwords/s with CL3 timing constraints. |
| CAS Latency | CL = 3 - mandates 3-clock delay between column address strobe and first valid data output in read cycles. |
| Burst Length | 1, 2, 4, 8, or full page - enables flexible data fetch granularity optimized for sequential streaming or random access patterns. |
| Refresh Rate | 4,096 cycles / 64 ms - ensures data retention without host intervention; supports auto- and self-refresh modes. |
| Supply Voltage | VDD = VDDQ = 3.0–3.6 V - compatible with standard 3.3V LVTTL logic interfaces and requires decoupling per JEDEC SDRAM guidelines. |
| Operating Temperature | 0°C to 70°C - validated for commercial-grade operation in industrial HMI, networking, and multimedia processing applications. |
Pinout & Package
W9812G6JB-6 is packaged in a RoHS-compliant, lead-free TFBGA-54 (8 mm × 8 mm) with 0.8 mm ball pitch. Ball layout follows JEDEC MO-245 standard for SDRAM BGA packages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A10 controls all-bank vs. bank-select precharge during command decode. |
| BS0, BS1 | Bank Select | Selects one of four internal banks during row activation or column access; enables interleaved bank operation. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial-word writes. |
| /CS, /RAS, /CAS, /WE | Command Control | Active-low command inputs decoded on CLK rising edge to define operation (activate, read, write, precharge, etc.). |
| CLK, CKE | Timing Control | CLK synchronizes all inputs; CKE gates internal clock - low enables power-down, self-refresh, or clock suspend modes. |
| LDQM, UDQM | Data Mask | Input/output mask pins - high during read places DQ in Hi-Z; high during write blocks corresponding byte write. |
| VDD, VDDQ, VSS, VSSQ | Power/Ground | VDD/VSS power core logic; VDDQ/VSSQ isolate I/O drivers to reduce switching noise on data bus. |
Key Features
| Feature | Design Value |
|---|---|
| Four-bank architecture | Enables bank interleaving to overlap precharge and active periods, reducing effective access latency in burst-intensive workloads. |
| Programmable mode register | Allows runtime configuration of burst length, burst type (sequential/interleave), and CAS latency to match system timing requirements. |
| Auto-precharge support | Automatically initiates bank precharge after read/write burst completion when A10 is asserted, simplifying controller sequencing. |
| Self-refresh mode | Retains data with only CKE held low - consumes ≤2 mA, eliminating need for external refresh controller during standby. |
| LVTTL-compatible interface | Ensures direct interoperability with FPGA, ASIC, and microcontroller memory controllers without level-shifting circuitry. |
Applications
| Industrial HMI Panels | Network Router Buffers |
|---|---|
Use Scenario: Real-time rendering of GUI elements and touch response in factory-floor HMIs with ARM-based SoCs. IC Role / Device Role / Timing Role: Primary frame buffer and working memory for display controller, accessed via burst-length-4 reads with CL3 timing. Use Value: Four-bank interleaving sustains >130 MB/s sustained bandwidth under mixed read/write loads typical of animated UI updates. | Use Scenario: Packet buffering in Layer 3 enterprise routers handling 100+ Mbps traffic with deep queueing requirements. IC Role / Device Role / Timing Role: Shared packet memory for ingress/egress queues, managed by network processor with auto-precharge enabled. Use Value: Auto-precharge reduces command overhead per packet write, increasing effective buffer utilization by ~18% versus manual precharge schemes. |
| Medical Imaging Displays | Video Surveillance Encoders |
Use Scenario: High-resolution DICOM image caching and zoom/pan operations in diagnostic monitors. IC Role / Device Role / Timing Role: Frame store for 1280×1024@60Hz RGB interface, using full-page bursts for rapid screen refresh. Use Value: Full-page burst mode achieves 92% bus utilization efficiency, minimizing idle cycles during large-block transfers. | Use Scenario: Real-time H.264 encoding buffer in multi-channel IP camera SoCs with dual-stream output. IC Role / Device Role / Timing Role: Intermediate line buffer and macroblock storage for encoder pipeline, accessed with burst-length-8 writes. Use Value: Separate VDDQ/VSSQ rails suppress I/O noise during simultaneous encode/decode operations, preserving signal integrity on 16-bit DQ bus. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-6BLI | Same 2M×4×16 organization, 166 MHz/CL3, but in 54-ball TFBGA with identical pinout and timing; supports extended temperature (-40°C to 85°C). | Valid for industrial designs requiring wider thermal margin; no PCB change needed if board supports -40°C operation. | Select IS42S16100E-6BLI when extended temperature qualification and second-source availability are required. |
| MT48LC16M16A2P-6A | 16M×16 organization (256 Mb), same 166 MHz/CL3 spec, but in 54-ball TSOP-II package - different footprint and thermal profile. | Suitable for space-constrained designs where BGA is not feasible; requires PCB redesign due to TSOP-II vs. TFBGA mechanical mismatch. | Choose MT48LC16M16A2P-6A only when TFBGA assembly is unavailable and board layout allows TSOP-II placement. |
Compared with W9812G6JB-6, IS42S16100E-6BLI offers drop-in compatibility with broader temperature support, while MT42LC16M16A2P-6A provides higher density in a legacy package but demands layout revision and lacks self-refresh current optimization.
Availability
W9812G6JB-6 is available at Aetrix Electronics and suitable for industrial HMI panels, network router buffers, and medical imaging displays requiring stable component supply across multi-year production cycles.
Supply support for W9812G6JB-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and analog ICs, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.
The W9812G6JB-6 belongs to Winbond's legacy SDRAM product line designed for cost-sensitive, high-reliability embedded systems where predictable timing, low-power self-refresh, and LVTTL compatibility are critical.
FAQ
What is the maximum operating frequency and CAS latency supported by W9812G6JB-6?
The W9812G6JB-6 is rated for 166 MHz operation with CAS Latency 3 (CL3) at 3.3V supply and 0°C to 70°C ambient temperature. It also supports CL2 operation per datasheet specifications, though CL3 is the guaranteed timing for the -6 speed grade. The device does not support CL1 or frequencies above 166 MHz.
Does W9812G6JB-6 support self-refresh mode, and what is its typical current draw in that state?
Yes, W9812G6JB-6 supports self-refresh mode, entered via the Self Refresh Command (CS=RAS=CAS=WE=low, CKE=low on CLK rising edge). Its maximum current draw in self-refresh is 2 mA, as specified in the Order Information table for the -6 variant, enabling low-power standby in battery-backed or energy-conscious systems.
What package type and ball count does W9812G6JB-6 use, and is it RoHS compliant?
W9812G6JB-6 uses a TFBGA-54 package with 8 mm × 8 mm body size and 0.8 mm ball pitch. It is manufactured with lead-free materials and fully complies with RoHS Directive 2011/65/EU, as explicitly stated in the Features section of the datasheet.
Can W9812G6JB-6 be used interchangeably with W9812G6JB-6I in a commercial-temperature design?
No - W9812G6JB-6I is qualified for -40°C to 85°C operation and has tighter parametric tolerances over that extended range, while W9812G6JB-6 is specified only for 0°C to 70°C. Substituting W9812G6JB-6I into a commercial design is acceptable, but using W9812G6JB-6 in place of -6I may violate thermal margin requirements in industrial environments.
What are the valid burst length options for W9812G6JB-6, and how are they configured?
W9812G6JB-6 supports burst lengths of 1, 2, 4, 8, and full page, configured via the Mode Register Set command. The burst length is encoded in A0–A2 bits during mode register programming, and burst type (sequential or interleave) is set separately using A3. These settings persist until reprogrammed or reset.
W9812G6JB-6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TFBGA (8x8)
W9812G6JB-6 FAQ
1.How can I place an order for W9812G6JB-6 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9812G6JB-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9812G6JB-6 reliable?
The price and inventory of W9812G6JB-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6JB-6 is usually 5 days.
3.What payment methods are accepted for W9812G6JB-6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6JB-6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9812G6JB-6?
W9812G6JB-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9812G6JB-6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9812G6JB-6?
For technical support, including W9812G6JB-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6JB-6 requirements.
6.How does Aetrix verify that W9812G6JB-6 is sourced from the original manufacturer or authorized distributors?
All W9812G6JB-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6JB-6 meets industry standards.
7.What is the process for return or replacement of W9812G6JB-6?
All W9812G6JB-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6JB-6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9812G6JB-6 part is unused and in its original packaging.
Return procedure for W9812G6JB-6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9812G6JB-6 Tags
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