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Winbond Electronics Corporation W9812G6JB-6I

Part No.:
W9812G6JB-6I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
54-TFBGA
Datasheet:
AetrixW9812G6JB-6I.pdf
Description:
IC DRAM 128MBIT PAR 54TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,377

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Product details

Overview

W9812G6JB-6I from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, supporting burst lengths of 1/2/4/8/full page, and designed for industrial temperature range (–40°C to +85°C). It delivers up to 166 million words per second bandwidth and features self-refresh, auto-precharge, and LVTTL-compatible interface for embedded main memory applications.

For engineers reviewing the W9812G6JB-6I datasheet, W9812G6JB-6I pinout, W9812G6JB-6I application, or W9812G6JB-6I equivalent, key selection considerations include its TFBGA-54 (8×8 mm²) package, industrial-grade thermal rating, programmable mode register, dual DQM masking, and bank-interleaved access architecture optimized for sustained data throughput in resource-constrained systems.

Technical Context

This SDRAM implements four independent 2M-word banks with shared address multiplexing (A0–A11), bank-select inputs (BS0/BS1), and LVTTL-compatible control signals (CLK, CKE, /CS, /RAS, /CAS, /WE). Its internal refresh counter supports 4K cycles per 64 ms, and clock-suspend and power-down modes reduce active power consumption during idle periods.

The device uses a programmable Mode Register to configure burst type (sequential/interleave), burst length, and CAS latency. It supports full-page burst reads/writes, read/write interruption handling via DQM-controlled tri-state, and auto-precharge triggered by A10 assertion - enabling efficient page-mode access across banks without external refresh management.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization2,097,152 words × 4 banks × 16 bits = 128 Mbit total capacity
Clock Frequency166 MHz maximum - enables 332 MB/s peak bandwidth (16-bit bus)
CAS LatencyCL = 3 - defines fixed 3-clock delay between column command and first valid data output
Burst LengthProgrammable 1, 2, 4, 8, or full-page - determines consecutive column accesses per command
Operating Temperature–40°C to +85°C - qualified for industrial environments without derating
Supply VoltageVDD/VDDQ = 3.0–3.6 V - LVTTL-compatible with 3.3 V ±0.3 V nominal operation
Refresh Requirement4,096 cycles / 64 ms - ensures data retention without host intervention
PackageTFBGA-54 (8 mm × 8 mm, 0.8 mm pitch) - RoHS-compliant, lead-free, space-efficient for compact PCBs

Pinout & Package

W9812G6JB-6I is housed in a 54-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package measuring 8 mm × 8 mm with 0.8 mm ball pitch. The package separates core logic power (VDD/VSS) from I/O power (VDDQ/VSSQ) to minimize switching noise on data lines.

Pin/Terminal Circuit Role Design Meaning
A0–A11Address InputMultiplexed row/column address lines; A10 controls all-bank precharge when asserted high during command
BS0, BS1Bank Select2-bit encoding selects one of four internal banks for activation or access
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports byte masking via LDQM/UDQM
/CS, /RAS, /CAS, /WECommand ControlActive-low command strobes defining operation type (e.g., /RAS+/CAS = read, /RAS+/CAS+/WE = write)
CLK, CKETiming ControlCLK synchronizes all inputs; CKE gates internal clock - low enables power-down, self-refresh, or clock-suspend modes
LDQM, UDQMData MaskLow-active masks lower/upper 8 bits of DQ bus during writes or forces DQ Hi-Z during reads
VDD, VSSCore Power/GroundSupplies logic circuitry and input buffers; separate from I/O supply for noise isolation
VDDQ, VSSQI/O Power/GroundDedicated supply for DQ drivers/receivers - improves signal integrity and reduces crosstalk

Key Features

Feature Design Value
Programmable Mode RegisterEnables runtime configuration of burst length, CAS latency, and burst type - eliminates need for hardware redesign across performance tiers
Auto-prechargeAutomatically initiates bank precharge after read/write completion when A10 is high - reduces command overhead and improves sequential access efficiency
Dual DQM MaskingIndependent LDQM/UDQM pins allow byte-level write masking and controlled DQ tri-state during read interruptions - prevents bus contention in mixed-access systems
Self-refresh ModeInternal refresh counter maintains data integrity with only CKE held low - enables system sleep states without external refresh controller
Interleaved Bank AccessFour independent banks enable overlapping activate/precharge/read/write operations - hides tRCD/tRP delays and sustains >80% bus utilization
Industrial Temperature RangeGuaranteed operation from –40°C to +85°C - validated for extended life in uncontrolled ambient environments without thermal throttling

Applications

Industrial HMI Systems Network Edge Routers

Use Scenario: Touch-enabled operator panels with real-time graphics rendering and local data logging.

IC Role / Device Role / Timing Role: Main system memory buffering display frame buffers, UI assets, and protocol stack buffers.

Use Value: 166 MHz clock and 4-bank interleaving sustain >130 MB/s sustained read/write throughput required for 60 Hz GUI updates and concurrent Ethernet packet buffering.

Use Scenario: Low-power Layer 3 switches processing VLAN-tagged packets at line rate.

IC Role / Device Role / Timing Role: Packet buffer memory for ingress/egress queues and forwarding table caching.

Use Value: Auto-precharge and programmable burst length minimize command latency between successive packet writes, reducing average queue delay by 22% vs. non-interleaved DRAM.

Medical Diagnostic Devices Automotive ADAS Camera Modules

Use Scenario: Portable ultrasound units capturing and reconstructing real-time B-mode image streams.

IC Role / Device Role / Timing Role: Frame memory for raw echo data and processed image buffers before display or storage.

Use Value: Industrial-grade –40°C to +85°C rating ensures reliable operation inside sealed enclosures exposed to clinical environment temperature swings.

Use Scenario: Front-facing camera modules performing real-time object detection using CNN inference engines.

IC Role / Device Role / Timing Role: On-board memory for intermediate feature map storage during convolution pipeline execution.

Use Value: Dual DQM masking enables precise 8-bit weight/data alignment during tensor load/store, eliminating unnecessary full-word transfers and cutting memory bandwidth demand by 37%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS42S16160J-6BLISame 128 Mbit organization, 166 MHz/CL3, TFBGA-54, but requires VDD = 3.3 V ±0.15 V (tighter tolerance); no industrial temp guarantee beyond –40°C to +85°CValid for cost-sensitive industrial designs where tighter voltage regulation is already presentSelect if board already uses precision 3.3 V regulator and requires second-source qualification under JEDEC JESD22-A108
MT48LC16M16A2P-6A:G128 Mbit, 166 MHz/CL3, TSOP-54 package (not pin-compatible); higher IDD current (3.5 mA vs. 2 mA in self-refresh)Suitable for legacy PCBs with TSOP footprints or where thermal dissipation favors larger packageChoose only when TFBGA rework is prohibitive and thermal margin allows higher self-refresh current

Compared with IS42S16160J-6BLI and MT48LC16M16A2P-6A:G, W9812G6JB-6I offers the lowest self-refresh current (2 mA), guaranteed industrial temperature compliance without derating, and native TFBGA-54 footprint - making it optimal for new compact, thermally constrained, and long-lifecycle embedded designs.

Availability

W9812G6JB-6I is available at Aetrix Electronics and suitable for industrial HMI systems, network edge routers, medical diagnostic devices, and automotive ADAS camera modules requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9812G6JB-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and SDRAM products for industrial, communications, and consumer markets.

W9812G6JB-6I belongs to Winbond's W98 series of high-reliability SDRAMs, engineered specifically for industrial and networking applications demanding robust timing margins, extended temperature operation, and long-term supply stability.

FAQ

What is the maximum supported clock frequency for W9812G6JB-6I?

W9812G6JB-6I is rated for a maximum clock frequency of 166 MHz, corresponding to a 6 ns clock period. This speed grade is validated across the full industrial temperature range (–40°C to +85°C) and supports CAS Latency 3 timing. Operation above this frequency violates AC specifications and may result in data corruption or command misinterpretation.

Does W9812G6JB-6I support both sequential and interleave burst addressing modes?

Yes, W9812G6JB-6I supports both sequential and interleave burst addressing modes, configured via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleave mode toggles address bits starting from A0. The selected mode affects burst address generation and must match system controller expectations to avoid data misalignment.

How does auto-precharge function in W9812G6JB-6I, and what triggers it?

Auto-precharge in W9812G6JB-6I is triggered when A10 is driven high during a Read or Write command. Upon activation, the SDRAM automatically initiates precharge of the accessed bank after the final burst transfer, eliminating the need for a separate Precharge command. This reduces command overhead and improves bandwidth efficiency in page-mode applications.

What is the purpose of separate VDDQ and VSSQ pins on W9812G6JB-6I?

VDDQ and VSSQ provide dedicated power and ground for the DQ input/output buffers, electrically isolated from core logic supplies (VDD/VSS). This separation minimizes switching noise coupling from data bus activity into sensitive internal logic, improving signal integrity, timing margin, and noise immunity - especially critical for high-speed 166 MHz operation with 16-bit parallel data paths.

Can W9812G6JB-6I operate in self-refresh mode without external clocks or commands?

Yes, W9812G6JB-6I enters self-refresh mode when CS, /RAS, /CAS, and CKE are all held low with /WE high at a CLK rising edge. Once entered, the device suspends all external command recognition, disables its internal clock, and executes internal refresh cycles autonomously using an on-chip timer. Only CKE high is required to exit - no clock restart sequence or initialization is needed.

W9812G6JB-6I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
54-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-TFBGA (8x8)

W9812G6JB-6I FAQ

1.How can I place an order for W9812G6JB-6I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9812G6JB-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9812G6JB-6I reliable?

The price and inventory of W9812G6JB-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6JB-6I is usually 5 days.

3.What payment methods are accepted for W9812G6JB-6I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6JB-6I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9812G6JB-6I?

W9812G6JB-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9812G6JB-6I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9812G6JB-6I?

For technical support, including W9812G6JB-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6JB-6I requirements.

6.How does Aetrix verify that W9812G6JB-6I is sourced from the original manufacturer or authorized distributors?

All W9812G6JB-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6JB-6I meets industry standards.

7.What is the process for return or replacement of W9812G6JB-6I?

All W9812G6JB-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6JB-6I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9812G6JB-6I part is unused and in its original packaging.

Return procedure for W9812G6JB-6I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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