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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9812G6JB-6 TR

Name: W9812G6JB-6 TR
Brand: Winbond Electronics Corporation
SKU: W9812G6JB-6 TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9812G6JB-6 TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TFBGA

Datasheet:: W9812G6JB-6 TR.pdf

Description:: IC DRAM 128MBIT PAR 54TFBGA

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Product details

Overview

W9812G6JB-6 TR from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V LVTTL interface, and TFBGA-54 (8×8 mm²) package. It delivers up to 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and industrial display systems.

For engineers reviewing the W9812G6JB-6 TR datasheet, W9812G6JB-6 TR pinout, W9812G6JB-6 TR application, or W9812G6JB-6 TR equivalent, key selection criteria include its -6 speed grade (166 MHz/CL3), industrial-grade thermal range compatibility (via -6I variant), self-refresh capability (2 mA max), and bank-interleaved access architecture enabling seamless page-mode transfers in real-time video frame buffers.

Technical Context

This SDRAM implements a four-bank architecture with programmable mode register control over burst length (1–8, full page), burst type (sequential/interleaved), and CAS latency (2 or 3). Its command decoder interprets RAS/CAS/WE/CS on CLK rising edges to execute bank activate, read/write, auto-precharge, self-refresh, and power-down operations.

It features separate VDDQ/VSSQ I/O power domains for noise immunity, dual DQM masking (LDQM/UDQM) for byte-level write control, and tRRD/tRC timing constraints that enforce minimum inter-bank and intra-bank activation intervals-critical for deterministic latency in deterministic real-time systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	2,097,152 words × 4 banks × 16 bits = 67,108,864 bits (8 MB)
Max Clock Frequency	166 MHz - defines maximum sustained data transfer rate of 166 Mwords/s
CAS Latency	CL = 3 - fixed 3-clock delay between column address strobe and first valid data output
Burst Length	Programmable 1, 2, 4, 8, or full page - enables optimized sequential access within active row
Refresh Requirement	4,096 cycles / 64 ms - mandates refresh controller support for DRAM retention
Supply Voltage	VDD = VDDQ = 3.3 V ± 0.3 V - requires stable 3.3V LVTTL-compatible power domain
Operating Temperature	0°C to 70°C (commercial grade) - validated for non-industrial ambient environments
Package	TFBGA-54, 8×8 mm², RoHS-compliant lead-free - surface-mount compatible with fine-pitch PCB routing

Pinout & Package

W9812G6JB-6 TR uses a 54-ball TFBGA package (8×8 mm²) with LVTTL-compatible ball pitch and RoHS-compliant lead-free finish. Ball assignments follow JEDEC-standard SDRAM layout with dedicated address, bank select, command, clock, data, and power/ground terminals.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge when asserted during command
BS0, BS1	Bank Select	Selects one of four internal banks during ACTIVATE or READ/WRITE command execution
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte masking via LDQM/UDQM
/CS, /RAS, /CAS, /WE	Command Control	Active-low command inputs decoded on CLK rising edge to define operation (e.g., ACTIVATE, READ)
CLK, CKE	Timing Control	CLK synchronizes all inputs; CKE gates internal clock - low enables Power Down/Self Refresh modes
LDQM, UDQM	Data Mask	High during read disables DQ output drivers (Hi-Z); high during write blocks corresponding byte write
VDD, VDDQ, VSS, VSSQ	Power/Ground	VDD/VSS for core logic; VDDQ/VSSQ isolated for I/O buffers to suppress switching noise on data bus

Key Features

Feature	Design Value
Four-bank interleaving	Enables concurrent row activation across banks to hide tRCD/tRP delays and sustain burst throughput
Auto-precharge	Automatically initiates bank precharge after burst completion when A10=high, reducing software overhead
Self-refresh mode	Retains data with only CKE held low; consumes ≤2 mA - essential for low-power suspend states
Programmable burst mode	Supports both sequential and interleaved column addressing per Mode Register setting for optimal access pattern alignment
LVTTL-compatible interface	Ensures direct compatibility with 3.3V microcontrollers, FPGAs, and ASICs without level-shifting circuitry

Applications

Industrial HMI Display Buffer	Network Router Packet Buffer
Use Scenario: Stores frame buffer data for 800×480 TFT displays in factory-floor HMIs requiring continuous update at 60 Hz. IC Role / Device Role / Timing Role: Primary SDRAM acting as double-buffered pixel memory with burst reads aligned to display controller DMA requests. Use Value: 166 MHz clock and CL3 latency ensure sub-16.7 ms frame load time; four-bank interleaving prevents display tearing during simultaneous GUI rendering and sensor data logging.	Use Scenario: Temporarily stores incoming/outgoing Ethernet packets in Layer 3 switches handling 100 Mbps traffic bursts. IC Role / Device Role / Timing Role: Shared packet buffer accessed by ingress/egress engines with bank-level arbitration to avoid contention. Use Value: Auto-precharge and burst writes minimize command overhead per packet; 8 MB capacity supports ≥1,200 average-size packets before congestion triggers backpressure.
Medical Imaging Data Cache	Automotive ADAS Preprocessing Buffer
Use Scenario: Buffers raw ultrasound scan-line data before FPGA-based beamforming in portable diagnostic devices. IC Role / Device Role / Timing Role: High-bandwidth streaming memory interfaced directly to FPGA DDR controller with precise tRCD/tRP compliance. Use Value: Full-page burst mode enables single-command loading of 2 kB scan lines; self-refresh maintains image integrity during battery-powered standby.	Use Scenario: Holds intermediate feature maps from CNN accelerators in lane-departure warning ECUs processing 30 fps camera input. IC Role / Device Role / Timing Role: Low-latency working memory for vision pipeline stages, synchronized to camera frame clock via CLK input. Use Value: CL3 timing guarantees deterministic 3-cycle read response critical for real-time object detection; TFBGA-54 footprint fits constrained automotive PCB layouts.

Industrial HMI Display Buffer

Network Router Packet Buffer

Use Scenario: Stores frame buffer data for 800×480 TFT displays in factory-floor HMIs requiring continuous update at 60 Hz.

IC Role / Device Role / Timing Role: Primary SDRAM acting as double-buffered pixel memory with burst reads aligned to display controller DMA requests.

Use Value: 166 MHz clock and CL3 latency ensure sub-16.7 ms frame load time; four-bank interleaving prevents display tearing during simultaneous GUI rendering and sensor data logging.

Use Scenario: Temporarily stores incoming/outgoing Ethernet packets in Layer 3 switches handling 100 Mbps traffic bursts.

IC Role / Device Role / Timing Role: Shared packet buffer accessed by ingress/egress engines with bank-level arbitration to avoid contention.

Use Value: Auto-precharge and burst writes minimize command overhead per packet; 8 MB capacity supports ≥1,200 average-size packets before congestion triggers backpressure.

Medical Imaging Data Cache

Automotive ADAS Preprocessing Buffer

Use Scenario: Buffers raw ultrasound scan-line data before FPGA-based beamforming in portable diagnostic devices.

IC Role / Device Role / Timing Role: High-bandwidth streaming memory interfaced directly to FPGA DDR controller with precise tRCD/tRP compliance.

Use Value: Full-page burst mode enables single-command loading of 2 kB scan lines; self-refresh maintains image integrity during battery-powered standby.

Use Scenario: Holds intermediate feature maps from CNN accelerators in lane-departure warning ECUs processing 30 fps camera input.

IC Role / Device Role / Timing Role: Low-latency working memory for vision pipeline stages, synchronized to camera frame clock via CLK input.

Use Value: CL3 timing guarantees deterministic 3-cycle read response critical for real-time object detection; TFBGA-54 footprint fits constrained automotive PCB layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same 2M×4×16 organization, 166 MHz/CL3, but 54-ball TFBGA with identical pinout and timing	Qualified for extended temperature (-40°C to 85°C) and higher reliability screening	Preferred for industrial or automotive designs requiring guaranteed operation beyond 70°C ambient
MT48LC16M16A2P-6A:L	Functionally identical 2M×4×16 SDRAM, same 166 MHz/CL3 spec, but 54-ball TSOP-II package (not BGA)	Requires PCB redesign due to different footprint and signal routing; no RoHS exemption needed	Used where legacy TSOP layout reuse or manual rework feasibility outweighs BGA assembly benefits

Compared with W9812G6JB-6 TR, IS42S16100E-6BLI offers extended temperature qualification without layout change, while MT48LC16M16A2P-6A:L provides identical electrical behavior in a through-hole-compatible TSOP package-making the latter suitable for prototyping or cost-sensitive consumer applications where thermal margin is less critical.

Availability

W9812G6JB-6 TR is available at Aetrix Electronics and suitable for industrial HMI display buffers, network packet buffers, and medical imaging data caches requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for W9812G6JB-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontroller solutions for industrial, computing, and communications markets.

The W9812G6JB series belongs to Winbond's standard SDRAM product line, designed specifically for cost-sensitive, high-reliability embedded systems requiring proven 3.3V SDRAM performance with industrial-grade variants.

FAQ

What is the maximum operating frequency and CAS latency supported by W9812G6JB-6 TR?

W9812G6JB-6 TR is rated for 166 MHz operation with CAS Latency 3 (CL3) under commercial temperature conditions (0°C to 70°C). This timing is guaranteed per JEDEC SDRAM specifications and verified in the device's AC characteristics table. The -6 speed grade designation explicitly confirms this 166 MHz/CL3 performance bin. W9812G6JB-6 TR does not support CL2 at 166 MHz; CL2 operation is only specified for lower-speed grades like -75.

Does W9812G6JB-6 TR support self-refresh mode, and what is its typical current draw?

Yes, W9812G6JB-6 TR supports self-refresh mode, entering it when CS, RAS, CAS, and WE are low with CKE low and WE high on a CLK rising edge. In self-refresh, it consumes ≤2 mA - a value confirmed in the Order Information table and Electrical Characteristics section. This low-current state allows W9812G6JB-6 TR to retain memory contents during system sleep without external refresh controller intervention.

What package type and ball count does W9812G6JB-6 TR use, and is it RoHS compliant?

W9812G6JB-6 TR uses a 54-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package measuring 8 mm × 8 mm. The package employs lead-free materials and is fully RoHS compliant, as stated in the Features section. Ball configuration and mechanical dimensions are detailed in Sections 4 and 12 of the datasheet, confirming compatibility with standard SDRAM BGA assembly processes.

Can W9812G6JB-6 TR be used in systems requiring extended temperature operation?

No - W9812G6JB-6 TR is specified only for 0°C to 70°C (commercial grade). For extended temperature operation (-40°C to 85°C), the pin-compatible W9812G6JB-6I variant must be selected. The -6I suffix denotes industrial qualification, including additional testing and screening; W9812G6JB-6 TR itself is not characterized or warranted for operation outside its published 0°C–70°C range.

What are the supported burst lengths and addressing modes for W9812G6JB-6 TR?

W9812G6JB-6 TR supports burst lengths of 1, 2, 4, 8, and full page, configurable via the Mode Register. It implements both sequential and interleaved column addressing modes - the former increments A0–A8 linearly, the latter toggles LSBs per burst cycle as defined in Tables 2 and 3. These modes are selected during Mode Register Set and directly impact how consecutive DQ outputs map to memory locations during burst reads/writes.

W9812G6JB-6 TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TFBGA (8x8)

W9812G6JB-6 TR FAQ

1.How can I place an order for W9812G6JB-6 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9812G6JB-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9812G6JB-6 TR reliable?

The price and inventory of W9812G6JB-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6JB-6 TR is usually 5 days.

3.What payment methods are accepted for W9812G6JB-6 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6JB-6 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9812G6JB-6 TR?

W9812G6JB-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9812G6JB-6 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9812G6JB-6 TR?

For technical support, including W9812G6JB-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6JB-6 TR requirements.

6.How does Aetrix verify that W9812G6JB-6 TR is sourced from the original manufacturer or authorized distributors?

All W9812G6JB-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6JB-6 TR meets industry standards.

7.What is the process for return or replacement of W9812G6JB-6 TR?

All W9812G6JB-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6JB-6 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9812G6JB-6 TR part is unused and in its original packaging.

Return procedure for W9812G6JB-6 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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