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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9812G6JH-5

Name: W9812G6JH-5
Brand: Winbond Electronics Corporation
SKU: W9812G6JH-5
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9812G6JH-5

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TSOP (0.400", 10.16mm Width)

Datasheet:: W9812G6JH-5.pdf

Description:: IC DRAM 128MBIT PAR 54TSOP II

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W9812G6JH-5 from Winbond Electronics is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 200 MHz with CAS Latency 3, 3.3V supply, and TSOP II-54 package. It delivers 200 million words/second bandwidth and supports burst lengths of 1–8 and full-page, enabling high-throughput memory access in embedded controllers and industrial display systems.

For engineers reviewing the W9812G6JH-5 datasheet, W9812G6JH-5 pinout, W9812G6JH-5 application, or W9812G6JH-5 equivalent, key selection considerations include its -5 speed grade compliance (200MHz/CL3), LVTTL interface compatibility, self-refresh capability for low-power standby, and TSOP II packaging suitable for space-constrained PCB layouts.

Technical Context

This SDRAM implements a fully synchronous architecture with four independent internal banks, enabling bank interleaving to hide precharge delays. Its command decoder interprets RAS/CAS/WE/CS combinations on CLK rising edges to execute bank activate, read, write, auto-precharge, and self-refresh operations.

The device uses multiplexed address pins (A0–A11) for row/column addressing, programmable mode register settings for burst type (sequential/interleave) and length, and dual DQM signals (LDQM/UDQM) for byte-level write masking. Internal refresh counter supports 4K cycles per 64 ms without external refresh controller intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	2,097,152 words × 4 banks × 16 bits = 67,108,864 bits (8 MB)
Clock Frequency	200 MHz - defines maximum data transfer rate and timing margin constraints
CAS Latency	CL = 3 - determines minimum clock cycles between column address strobe and first valid data output
Burst Length	1, 2, 4, 8, or full page - controls number of consecutive data transfers per command, reducing address overhead
Supply Voltage	3.3 V ± 0.3 V - requires stable LDO or regulator; VDDQ separated for I/O noise isolation
Refresh Requirement	4,096 cycles / 64 ms - mandates periodic refresh commands or use of self-refresh mode during idle periods
Operating Temperature	0°C to 70°C - validated for commercial-grade industrial control and consumer electronics applications
Package	TSOP II-54, 400 mil - surface-mount, lead-free, RoHS-compliant footprint with defined pin pitch and thermal profile

Pinout & Package

W9812G6JH-5 is housed in a 54-pin Thin Small Outline Package (TSOP II), 400 mil width, with lead-free and RoHS-compliant construction. Pin assignments follow JEDEC-standard SDRAM layout for compatibility with standard PCB footprints and routing practices.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A0–A11 used for row, A0–A8 for column
BS0, BS1	Bank Select	Two-bit encoding to select one of four internal banks during activate or access
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; LDQM masks lower byte, UDQM masks upper byte
CS, RAS, CAS, WE	Command Control	Four active-low control signals decoded synchronously on CLK rising edge to define operation
CLK, CKE	Clock Interface	CLK provides system timing reference; CKE enables/disables internal clock domain and enters power-down/self-refresh
VDD, VDDQ, VSS, VSSQ	Power/Ground	Separated core (VDD/VSS) and I/O (VDDQ/VSSQ) supplies reduce switching noise coupling into logic
NC	No Connect	Pins 36 and 40 are unconnected; must be left floating or tied to ground per layout guidelines

Key Features

Feature	Design Value
Programmable Mode Register	Enables dynamic configuration of burst length, CAS latency, and burst type (sequential/interleave) without hardware change
Auto-precharge Support	Automatically initiates bank precharge after read/write completion when A10 is asserted, eliminating manual precharge command overhead
Self Refresh Mode	Performs internal refresh using on-chip oscillator while external clocks are halted, enabling ultra-low-power standby in battery-backed systems
Byte Write Masking	LDQM and UDQM independently disable lower/upper 8-bit lanes during writes, allowing precise partial-word updates without read-modify-write
Power Down Mode	Reduces active current by gating input receivers when CKE is low-requires exit sequence before next command

Applications

Industrial HMI Panels	Network Router Data Buffers
Use Scenario: Touch-enabled operator interfaces in factory automation requiring fast frame buffer updates and local program storage. IC Role / Device Role / Timing Role: Main system memory for ARM-based microcontrollers running Linux or RTOS, interfacing via LVTTL parallel bus with fixed 200MHz clock domain. Use Value: 8 MB capacity and CL3 timing support real-time rendering of vector graphics and overlay menus without frame tearing or latency-induced jitter.	Use Scenario: Packet buffering in Layer 3 enterprise routers handling multi-gigabit Ethernet traffic with deep queue requirements. IC Role / Device Role / Timing Role: Shared packet buffer memory accessed concurrently by multiple ASIC engines; bank interleaving hides tRP/tRC delays across traffic flows. Use Value: Four-bank architecture enables concurrent read/write to different banks, sustaining >1.2 Gbps aggregate throughput under mixed burst-length workloads.
Medical Imaging Display Controllers	Automated Test Equipment (ATE) Pattern Memory
Use Scenario: Real-time DICOM image streaming and zoom/pan processing in portable ultrasound and X-ray viewing stations. IC Role / Device Role / Timing Role: Frame buffer memory for FPGA-based video pipeline, synchronized to pixel clock and supporting burst reads for line-scan reconstruction. Use Value: Full-page burst mode allows single-command loading of entire scan-line buffers (up to 1024×1 pixels @ 16bpp), minimizing command overhead and maximizing pixel-rate continuity.	Use Scenario: High-speed digital pattern generation in semiconductor test systems requiring deterministic, repeatable stimulus memory access. IC Role / Device Role / Timing Role: Deterministic-access memory storing test vectors; configured for fixed CL3 and sequential burst to guarantee sub-5ns address-to-data timing repeatability. Use Value: Tight tRCD (20 ns) and tRP (20 ns) specs ensure consistent setup/hold margins across temperature, critical for <100 ps jitter tolerance in ATE timing engines.

Industrial HMI Panels

Network Router Data Buffers

Use Scenario: Touch-enabled operator interfaces in factory automation requiring fast frame buffer updates and local program storage.

IC Role / Device Role / Timing Role: Main system memory for ARM-based microcontrollers running Linux or RTOS, interfacing via LVTTL parallel bus with fixed 200MHz clock domain.

Use Value: 8 MB capacity and CL3 timing support real-time rendering of vector graphics and overlay menus without frame tearing or latency-induced jitter.

Use Scenario: Packet buffering in Layer 3 enterprise routers handling multi-gigabit Ethernet traffic with deep queue requirements.

IC Role / Device Role / Timing Role: Shared packet buffer memory accessed concurrently by multiple ASIC engines; bank interleaving hides tRP/tRC delays across traffic flows.

Use Value: Four-bank architecture enables concurrent read/write to different banks, sustaining >1.2 Gbps aggregate throughput under mixed burst-length workloads.

Medical Imaging Display Controllers

Automated Test Equipment (ATE) Pattern Memory

Use Scenario: Real-time DICOM image streaming and zoom/pan processing in portable ultrasound and X-ray viewing stations.

IC Role / Device Role / Timing Role: Frame buffer memory for FPGA-based video pipeline, synchronized to pixel clock and supporting burst reads for line-scan reconstruction.

Use Value: Full-page burst mode allows single-command loading of entire scan-line buffers (up to 1024×1 pixels @ 16bpp), minimizing command overhead and maximizing pixel-rate continuity.

Use Scenario: High-speed digital pattern generation in semiconductor test systems requiring deterministic, repeatable stimulus memory access.

IC Role / Device Role / Timing Role: Deterministic-access memory storing test vectors; configured for fixed CL3 and sequential burst to guarantee sub-5ns address-to-data timing repeatability.

Use Value: Tight tRCD (20 ns) and tRP (20 ns) specs ensure consistent setup/hold margins across temperature, critical for <100 ps jitter tolerance in ATE timing engines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	1M × 16-bit × 4 banks, 166 MHz max, CL3, same TSOP II-54 package	Limited to 16 MB density; lower bandwidth; industrial temp (-40°C to +85°C)	Choose for cost-sensitive designs where 8 MB is sufficient and extended temperature range is required.
MT48LC16M16A2P-6A	1M × 16-bit × 4 banks, 166 MHz, CL3, 54-pin TSOP II, Micron-manufactured	Same density and timing; higher production volume; longer documented lifecycle	Prefer for long-lifecycle industrial programs needing assured supply continuity beyond Winbond's roadmap.

Compared with W9812G6JH-5, IS42S16100E-6BLI offers wider temperature support but halves memory density and bandwidth, while MT48LC16M16A2P-6A matches functional specs but provides stronger long-term sourcing assurance-making W9812G6JH-5 optimal for performance-critical, volume-commercial applications within its 0°C–70°C envelope.

Availability

W9812G6JH-5 is available at Aetrix Electronics and suitable for industrial HMI panels, network router data buffers, and medical imaging display controllers requiring stable component supply, commercial-temperature SDRAM with proven 200 MHz operation and TSOP II compatibility.

Supply support for W9812G6JH-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and SDRAM for industrial, automotive, and computing markets.

The W9812G6JH series belongs to Winbond's legacy SDR SDRAM product line, designed specifically for cost-effective, high-reliability main memory in resource-constrained embedded systems requiring LVTTL parallel interface and self-refresh capability.

FAQ

What is the maximum data bandwidth supported by W9812G6JH-5?

W9812G6JH-5 supports up to 200 million words per second, translating to 400 MB/s effective bandwidth (16-bit bus × 200 MHz). This assumes continuous full-burst operation with no command overhead, and is achievable only when bank interleaving and auto-precharge minimize tRC penalties. The actual sustained throughput depends on access pattern and controller efficiency.

Does W9812G6JH-5 require an external refresh controller?

W9812G6JH-5 does not require an external refresh controller if self-refresh mode is used, as it contains an internal oscillator and refresh counter. However, in normal operation, the memory controller must issue 4,096 auto-refresh commands every 64 ms. The device supports both CBR (CAS-before-RAS) and self-refresh entry/exit sequences per JEDEC SDRAM standards.

Can W9812G6JH-5 operate at CAS Latency 2?

Yes, W9812G6JH-5 supports CAS Latency 2 per its datasheet Feature section, though the -5 speed grade is specified and tested for CL3 operation at 200 MHz. CL2 operation may be possible at reduced frequencies or under tighter voltage/temperature conditions, but is not guaranteed or characterized for the -5 variant and requires validation in the target system.

What is the function of the A10 pin during read/write commands in W9812G6JH-5?

In W9812G6JH-5, asserting A10 high during a read or write command enables auto-precharge functionality. This causes the SDRAM to automatically initiate precharge of the accessed bank after burst completion, eliminating the need for a separate precharge command and reducing command scheduling complexity in the memory controller.

Is W9812G6JH-5 pin-compatible with other 54-pin TSOP II SDRAMs?

W9812G6JH-5 follows JEDEC-standard pinout for 16-bit SDRAMs in 54-pin TSOP II packages, making it mechanically and electrically compatible with functionally equivalent parts like IS42S16100E and MT48LC16M16A2P. However, timing parameters, mode register definitions, and AC characteristics differ-requiring controller reconfiguration even when pinout matches.

W9812G6JH-5 Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TSOP (0.400", 10.16mm Width)

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: 200 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TSOP II

W9812G6JH-5 FAQ

1.How can I place an order for W9812G6JH-5 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9812G6JH-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9812G6JH-5 reliable?

The price and inventory of W9812G6JH-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6JH-5 is usually 5 days.

3.What payment methods are accepted for W9812G6JH-5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6JH-5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9812G6JH-5?

W9812G6JH-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9812G6JH-5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9812G6JH-5?

For technical support, including W9812G6JH-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6JH-5 requirements.

6.How does Aetrix verify that W9812G6JH-5 is sourced from the original manufacturer or authorized distributors?

All W9812G6JH-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6JH-5 meets industry standards.

7.What is the process for return or replacement of W9812G6JH-5?

All W9812G6JH-5 units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6JH-5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9812G6JH-5 part is unused and in its original packaging.

Return procedure for W9812G6JH-5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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