Winbond Electronics Corporation W9812G6JH-6I
- Part No.:
- W9812G6JH-6I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9812G6JH-6I.pdf
- Description:
- IC DRAM 128MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9812G6JH-6I from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V LVTTL interface, and industrial temperature range (–40°C to +85°C). It delivers 332 MB/s peak bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and legacy display subsystems.
For engineers reviewing the W9812G6JH-6I datasheet, W9812G6JH-6I pinout, W9812G6JH-6I application, or W9812G6JH-6I equivalent, key selection considerations include its TSOP-II 54-pin package, auto-precharge capability, self-refresh mode, and compatibility with standard SDRAM controllers requiring CL3 timing at 166 MHz.
Technical Context
This SDRAM implements four independent 2M-word banks with interleaved access to hide precharge latency. Its command decoder interprets RAS/CAS/WE combinations on every CLK rising edge to execute bank activate, read, write, precharge, auto-precharge, self-refresh, and power-down operations.
Internal timing is governed by programmable Mode Register settings for burst type (sequential/interleave), burst length, and CAS latency. Refresh is managed via 4K cycles per 64 ms, with CKE-controlled entry into self-refresh or power-down modes to reduce standby current to 2 mA max.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 4 banks × 16 bits = 16 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum data transfer rate of 332 MB/s (166 MHz × 2 bytes) |
| CAS Latency | CL = 3 - fixed 3-cycle delay between column address strobe and first valid data output |
| Burst Length | 1, 2, 4, 8, or full page - determines number of consecutive words transferred per read/write command |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments without derating |
| Supply Voltage | 3.3 V ± 0.3 V - requires separate VDD (core) and VDDQ (I/O) rails for noise isolation |
| Refresh Requirement | 4,096 cycles / 64 ms - mandates periodic refresh commands to retain data; tREF = 15.625 µs interval |
Pinout & Package
W9812G6JH-6I is housed in a RoHS-compliant, lead-free TSOP-II 54-pin package (400 mil width), with dedicated VDD/VSS and VDDQ/VSSQ power/ground pairs for signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A0–A8 used for column, A0–A11 for row |
| BS0, BS1 | Bank Select | Selects one of four internal banks during ACTIVATE or READ/WRITE command |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; LDQM/UDQM control byte masking for partial writes |
| CLK | System Clock | All commands latched on rising edge; defines timing reference for tAC, tRCD, tRP, etc. |
| CKE | Clock Enable | Low disables internal clock; enables power-down, self-refresh, and clock suspend modes |
| CS, RAS, CAS, WE | Command Control | Encoded command inputs; combination defines ACTIVATE, READ, WRITE, PRECHARGE, etc. |
| LDQM, UDQM | I/O Mask | High-Z output or blocked write for lower/upper 8-bit byte lanes during burst transfers |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh mode | Autonomous refresh with CKE low; eliminates external refresh controller overhead during low-power states |
| Auto-precharge | Automatic bank precharge triggered by A10 high during READ/WRITE; reduces command overhead and improves bandwidth efficiency |
| Programmable burst mode | Configurable sequential or interleave addressing via Mode Register; optimizes locality for video frame buffers or packet FIFOs |
| Industrial temperature grade | –40°C to +85°C operation with no performance degradation; validated across full voltage and timing margins |
| LVTTL-compatible interface | 3.3V signaling with VIH ≥ 2.0 V and VIL ≤ 0.8 V; interoperable with FPGA and ASIC SDRAM controllers without level shifters |
Applications
| Industrial HMI Display Buffer | Legacy Network Router Packet Memory |
|---|---|
Use Scenario: Storing frame buffers for 800×480 TFT LCD panels in factory-floor HMIs with ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Primary SDRAM buffer interfaced directly to ARM9 or MIPS-based display controller; provides burst-4 reads at 166 MHz with CL3 timing. Use Value: TSOP-II package enables compact PCB layout; industrial temp rating ensures reliability in uncooled enclosures; auto-precharge minimizes command latency between pixel line fetches. |
Use Scenario: Temporary storage of Ethernet packets in legacy 10/100 Mbps switch ASICs where cost-sensitive, pin-compatible SDRAM is required. IC Role / Device Role / Timing Role: External packet buffer for QoS queue management; operates under standard JEDEC SDRAM protocol with tRCD = 20 ns and tRP = 20 ns. Use Value: 16-bit bus width matches common switch fabric data paths; full-page burst supports efficient DMA transfers; self-refresh extends uptime during traffic lulls. |
| Medical Diagnostic Imaging Subsystem | Automated Test Equipment (ATE) Pattern Memory |
Use Scenario: Capturing and staging ultrasound scan line data before DSP processing in portable diagnostic devices. IC Role / Device Role / Timing Role: High-bandwidth intermediate memory between ADC interface and FIR filter engine; uses burst-8 reads with interleave addressing. Use Value: 332 MB/s throughput meets real-time line-rate requirements; –40°C to +85°C rating supports battery-powered field use; LDQM/UDQM enable selective write masking for partial line updates. |
Use Scenario: Storing test vector sequences in benchtop ATE systems requiring deterministic, low-jitter memory access. IC Role / Device Role / Timing Role: Pattern RAM for digital I/O channel drivers; synchronized to system clock with precise tAC < 5.4 ns (–6I grade). Use Value: CL3 timing guarantees predictable read latency; TSOP-II footprint simplifies socket-based upgrade paths; 4K/64ms refresh ensures data retention during extended test cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16160J-6BLI | Same 16Mbit, 16-bit, TSOP-54, 166 MHz/CL3; 3.3V core/I/O; identical pinout and timing | Drop-in replacement with same industrial temp range and JEDEC compliance | Validated pin-to-pin alternative with identical AC/DC specs and command set |
| MT48LC16M16A2P-6A:G | 16Mbit, 16-bit, TSOP-54, 166 MHz/CL3; requires VDD = VDDQ (no split rail); tRC = 50 ns vs. 45 ns | Suitable for cost-optimized designs where unified supply simplifies power design | Functional alternative with minor timing margin differences; verify tRC and tRAS in target controller |
Compared with W9812G6JH-6I, IS42S16160J-6BLI offers identical electrical and mechanical compatibility, while MT48LC16M16A2P-6A:G trades split-rail flexibility for simpler power delivery but requires validation of longer tRC in timing-critical systems.
Availability
W9812G6JH-6I is available at Aetrix Electronics and suitable for industrial HMI, legacy networking equipment, medical imaging subsystems, and automated test equipment requiring stable component supply across extended temperature ranges.
Supply support for W9812G6JH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in memory ICs, flash products, and microcontrollers, with over 30 years of DRAM design heritage.
W9812G6JH-6I belongs to Winbond's legacy SDRAM product line targeting cost-sensitive, industrial-grade applications where JEDEC-compliant 3.3V SDRAM with proven reliability is required.
FAQ
What is the maximum operating frequency and CAS latency of the W9812G6JH-6I?
The W9812G6JH-6I is rated for 166 MHz operation with a fixed CAS latency of 3. This means the device outputs the first valid data word exactly three clock cycles after the column address is latched. The -6I suffix explicitly denotes industrial temperature qualification (–40°C to +85°C) at this speed grade, and all timing parameters-including tRCD, tRP, and tRC-are guaranteed across that full range for the W9812G6JH-6I.
Does the W9812G6JH-6I support self-refresh mode, and how is it activated?
Yes, the W9812G6JH-6I supports self-refresh mode. It is activated by asserting CS, RAS, CAS, and WE low while holding CKE low on the rising edge of CLK. Once entered, the W9812G6JH-6I autonomously executes refresh cycles without external command intervention, maintaining data integrity while reducing system-level power consumption. CKE must remain low throughout self-refresh, and exit requires returning CKE high followed by tXSR delay before issuing new commands.
What package type and pin count does the W9812G6JH-6I use?
The W9812G6JH-6I uses a TSOP-II (Thin Small Outline Package, Type II) with 54 pins and a 400-mil body width. It is lead-free and RoHS compliant. Pin assignments include 16 data lines (DQ0–DQ15), 12 address lines (A0–A11), two bank select lines (BS0, BS1), and dedicated control signals (CLK, CKE, CS, RAS, CAS, WE, LDQM, UDQM), plus segregated VDD/VDDQ and VSS/VSSQ power/ground pairs.
Can the W9812G6JH-6I be used as a direct replacement for the W9812G6JH-6?
Yes, the W9812G6JH-6I is a functional and pin-compatible extension of the W9812G6JH-6, sharing identical speed grade (166 MHz/CL3), electrical specifications, and timing parameters. The sole difference is the extended industrial temperature range (–40°C to +85°C for W9812G6JH-6I versus 0°C to +70°C for W9812G6JH-6). No PCB or firmware changes are required when upgrading to W9812G6JH-6I in thermally demanding environments.
What burst lengths and addressing modes does the W9812G6JH-6I support?
The W9812G6JH-6I supports burst lengths of 1, 2, 4, 8, or full page, configurable via the Mode Register. It offers two burst addressing modes: sequential (incrementing column address) and interleave (bit-inverted column address sequence), both selectable at initialization. These modes allow optimization for spatial locality (e.g., video line buffers) or cache-line access patterns, and are fully supported in all operational states of the W9812G6JH-6I.
W9812G6JH-6I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
W9812G6JH-6I FAQ
1.How can I place an order for W9812G6JH-6I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9812G6JH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9812G6JH-6I reliable?
The price and inventory of W9812G6JH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6JH-6I is usually 5 days.
3.What payment methods are accepted for W9812G6JH-6I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6JH-6I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9812G6JH-6I?
W9812G6JH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9812G6JH-6I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9812G6JH-6I?
For technical support, including W9812G6JH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6JH-6I requirements.
6.How does Aetrix verify that W9812G6JH-6I is sourced from the original manufacturer or authorized distributors?
All W9812G6JH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6JH-6I meets industry standards.
7.What is the process for return or replacement of W9812G6JH-6I?
All W9812G6JH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6JH-6I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9812G6JH-6I part is unused and in its original packaging.
Return procedure for W9812G6JH-6I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9812G6JH-6I Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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