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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9812G6KB-6I

Name: W9812G6KB-6I
Brand: Winbond Electronics Corporation
SKU: W9812G6KB-6I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9812G6KB-6I

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TFBGA

Datasheet:: W9812G6KB-6I.pdf

Description:: IC DRAM 128MBIT LVTTL 54TFBGA

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Product details

Overview

W9812G6KB-6I from Winbond is a 2 M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, supporting sequential/interleaved burst lengths of 1–8, and designed for main memory in industrial embedded systems requiring -40°C to +85°C operation.

For engineers reviewing the W9812G6KB-6I datasheet, W9812G6KB-6I pinout, W9812G6KB-6I application, or W9812G6KB-6I equivalent, key selection criteria include industrial temperature support, TFBGA-54 package compatibility, LVTTL interface timing, self-refresh capability up to 85°C, and bank-interleaved burst access for sustained bandwidth in resource-constrained controllers.

Technical Context

This SDRAM implements a 4-bank architecture with programmable mode register control over burst length (1/2/4/8/full page), burst type (sequential or interleave), and CAS latency (2 or 3). It uses multiplexed address pins A0–A11 for row/column addressing, with A10 controlling all-bank precharge and auto-precharge activation.

It supports full command set compliance including Bank Activate, Read/Write with auto-precharge, Burst Stop, Self Refresh (valid ≤85°C), Power Down, and Clock Suspend modes. Refresh is managed via 4K cycles per 64 ms at -40°C to 85°C, with separate 4K/16 ms spec above 85°C for -6J grade only.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	2,097,152 words × 4 banks × 16 bits = 67,108,864 bits (8 MB)
Max Clock Frequency	166 MHz - enables 166M words/sec peak data rate with CL3 timing
CAS Latency	Configurable to 2 or 3 clock cycles - determines read data valid delay after column address
Burst Length	1, 2, 4, 8, or full-page - reduces address overhead and improves sequential throughput
Operating Temperature	-40°C to +85°C - qualified for industrial-grade embedded applications without derating
Supply Voltage	3.3 V ± 0.3 V - compatible with standard LVTTL logic interfaces and legacy 3.3 V system rails
Refresh Requirement	4K cycles / 64 ms - ensures data retention under worst-case thermal conditions within spec
Package	TFBGA-54 (8 mm × 8 mm, 0.8 mm pitch) - compact footprint for space-constrained PCB layouts

Pinout & Package

W9812G6KB-6I is housed in a RoHS-compliant, lead-free TFBGA-54 package (8 mm × 8 mm, 0.8 mm ball pitch), with VDDQ/VSSQ power/ground separation for improved I/O noise immunity and dedicated LDQM/UDQM pins for byte-level write masking.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge and auto-precharge enable
BS0, BS1	Bank Select	Selects one of four internal banks during activate or read/write commands
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports burst reads/writes with configurable latency
/CS, /RAS, /CAS, /WE	Command Control	Active-low command inputs decoded synchronously on CLK rising edge to execute bank, read, write, refresh, or mode operations
CLK, CKE	Clock Interface	CLK drives all synchronous operations; CKE enables/disables clock domain - low entry into Power Down or Self Refresh
LDQM, UDQM	Data Mask	Low-active masks for lower/upper 8-bit bytes during writes; places DQ outputs in Hi-Z during reads
VDD, VSS	Core Power/Ground	3.3 V supply and return for internal logic and input buffers
VDDQ, VSSQ	I/O Power/Ground	Separate 3.3 V supply/ground for DQ drivers to minimize switching noise coupling into core logic

Key Features

Feature	Design Value
Industrial Temperature Range	Guaranteed operation from -40°C to +85°C - eliminates thermal derating in harsh environments
Programmable Mode Register	Enables runtime configuration of burst length, burst type, and CAS latency to match host controller requirements
Interleaved Bank Access	Allows continuous data streaming across banks by hiding tRC and tRRD delays - critical for video frame buffers
Auto-precharge Support	Automatically initiates bank precharge after burst completion - simplifies memory controller state machine design
Self Refresh Mode	Retains data with minimal external control when CKE is held low - essential for low-power suspend states
LVTTL-Compatible Interface	Direct connection to legacy 3.3 V microcontrollers and FPGAs without level-shifting circuitry

Applications

Industrial HMI Display Buffer	Network Router Packet Buffer
Use Scenario: Storing frame buffer data for 800×480 TFT displays in factory-floor HMIs exposed to ambient temperatures from -25°C to 75°C. IC Role / Device Role / Timing Role: Main system memory providing burst-aligned pixel data to display controller via interleaved bank reads at 166 MHz. Use Value: 8 MB capacity and CL3 timing ensure smooth 60 Hz refresh with zero frame tearing; -40°C to +85°C rating guarantees reliability across seasonal thermal swings.	Use Scenario: Temporary storage of Ethernet packet headers and payload fragments in Layer 3 routing ASICs with deterministic latency budgets. IC Role / Device Role / Timing Role: Low-latency packet buffer supporting concurrent ingress/egress traffic using bank interleaving to hide precharge delays. Use Value: 4-bank architecture and programmable burst length allow >90% bus utilization under mixed read/write loads; TFBGA-54 footprint fits dense switch fabric layouts.
Medical Diagnostic Imaging Controller	Automotive ADAS Camera Preprocessor
Use Scenario: Frame buffering for ultrasound image acquisition subsystems where data integrity must be maintained across extended power-loss events. IC Role / Device Role / Timing Role: High-reliability memory holding raw scan-line data before DSP processing; leverages self-refresh during standby between imaging sessions. Use Value: Validated 4K/64 ms refresh ensures data retention during 10+ second idle periods; RoHS-compliant packaging meets medical device material traceability requirements.	Use Scenario: Real-time buffering of 1280×720 YUV422 video streams from surround-view cameras prior to FPGA-based stitching. IC Role / Device Role / Timing Role: Burst-oriented memory interfacing directly with MIPI CSI-2 bridge logic, using sequential burst mode for predictable pixel fetch timing. Use Value: CL3 latency and 166 MHz clock enable sub-15 ns per-pixel access; industrial temp grade avoids thermal throttling in engine-bay-mounted ECUs.

Industrial HMI Display Buffer

Network Router Packet Buffer

Use Scenario: Storing frame buffer data for 800×480 TFT displays in factory-floor HMIs exposed to ambient temperatures from -25°C to 75°C.

IC Role / Device Role / Timing Role: Main system memory providing burst-aligned pixel data to display controller via interleaved bank reads at 166 MHz.

Use Value: 8 MB capacity and CL3 timing ensure smooth 60 Hz refresh with zero frame tearing; -40°C to +85°C rating guarantees reliability across seasonal thermal swings.

Use Scenario: Temporary storage of Ethernet packet headers and payload fragments in Layer 3 routing ASICs with deterministic latency budgets.

IC Role / Device Role / Timing Role: Low-latency packet buffer supporting concurrent ingress/egress traffic using bank interleaving to hide precharge delays.

Use Value: 4-bank architecture and programmable burst length allow >90% bus utilization under mixed read/write loads; TFBGA-54 footprint fits dense switch fabric layouts.

Medical Diagnostic Imaging Controller

Automotive ADAS Camera Preprocessor

Use Scenario: Frame buffering for ultrasound image acquisition subsystems where data integrity must be maintained across extended power-loss events.

IC Role / Device Role / Timing Role: High-reliability memory holding raw scan-line data before DSP processing; leverages self-refresh during standby between imaging sessions.

Use Value: Validated 4K/64 ms refresh ensures data retention during 10+ second idle periods; RoHS-compliant packaging meets medical device material traceability requirements.

Use Scenario: Real-time buffering of 1280×720 YUV422 video streams from surround-view cameras prior to FPGA-based stitching.

IC Role / Device Role / Timing Role: Burst-oriented memory interfacing directly with MIPI CSI-2 bridge logic, using sequential burst mode for predictable pixel fetch timing.

Use Value: CL3 latency and 166 MHz clock enable sub-15 ns per-pixel access; industrial temp grade avoids thermal throttling in engine-bay-mounted ECUs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same 2M×4×16 organization, 166 MHz, CL3, TFBGA-54; differs in refresh interval (4K/64 ms same), but supports self-refresh up to 105°C	Valid for extended-temp automotive use cases where W9812G6KB-6I's 85°C limit is insufficient	Choose IS42S16100E-6BLI if system ambient exceeds 85°C or requires AEC-Q200 alignment
MT48LC16M16A2P-6A:L	Same density, speed, and voltage; uses TSOP-54 instead of TFBGA-54 and lacks industrial temp (-40°C to +85°C) guarantee (rated 0°C to 70°C)	Suitable for cost-sensitive consumer electronics where board space and thermal range are less constrained	Choose MT48LC16M16A2P-6A:L only for commercial-grade applications with no industrial thermal or footprint requirements

Compared with IS42S16100E-6BLI and MT48LC16M16A2P-6A:L, W9812G6KB-6I delivers identical performance in a smaller TFBGA package with guaranteed industrial temperature support - making it optimal for space-limited, thermally demanding embedded designs where TSOP footprint or extended-temp capability are unnecessary.

Availability

W9812G6KB-6I is available at Aetrix Electronics and suitable for industrial HMI, network infrastructure, medical imaging, and automotive ADAS applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for W9812G6KB-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, DDR SDRAM, and mobile RAM products for industrial, communications, and consumer markets.

W9812G6KB-6I belongs to Winbond's legacy SDR SDRAM product line, engineered for cost-effective, high-reliability main memory in resource-constrained embedded controllers and real-time signal processing systems.

FAQ

What is the maximum operating frequency and CAS latency supported by W9812G6KB-6I?

W9812G6KB-6I is rated for a maximum clock frequency of 166 MHz with CAS Latency 3. It also supports CAS Latency 2 at reduced timing margins. The -6I suffix confirms industrial-grade qualification across the full -40°C to +85°C temperature range at this speed grade, with all AC parameters validated per the official datasheet revision A02.

Does W9812G6KB-6I support self-refresh mode, and what are its limits?

Yes, W9812G6KB-6I supports self-refresh mode, but only up to +85°C case temperature. The datasheet explicitly states "Not support self refresh function with TCASE > 85°C", meaning self-refresh is disabled and invalid above that threshold. For applications requiring self-refresh beyond 85°C, the -6J variant (W9812G6KB-6J) must be used instead.

What package type and ball count does W9812G6KB-6I use?

W9812G6KB-6I uses a TFBGA-54 package measuring 8 mm × 8 mm with 0.8 mm ball pitch. It features 54 solder balls arranged in a grid pattern, including dedicated VDDQ/VSSQ planes for I/O noise isolation and dual DQM pins for byte-level write masking - confirmed in the Ball Configuration and Ball Description sections of the datasheet.

How many internal banks does W9812G6KB-6I have, and how are they selected?

W9812G6KB-6I has four independent internal banks. Bank selection is performed using the BS0 and BS1 input pins, which are sampled during the Bank Activate command. These two pins decode to select one of the four banks (Bank 0–3) for row activation or subsequent read/write operations - a key enabler of interleaved access to hide precharge delays.

What is the memory capacity and organization of W9812G6KB-6I?

W9812G6KB-6I is organized as 2,097,152 words × 4 banks × 16 bits, totaling 67,108,864 bits (8 MB). Each bank contains 524,288 words, and row/column addressing is multiplexed over A0–A11. This structure is explicitly stated in the General Description section and confirmed in the Block Diagram and Electrical Characteristics tables of the datasheet.

W9812G6KB-6I Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: LVTTL

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TFBGA (8x8)

W9812G6KB-6I FAQ

1.How can I place an order for W9812G6KB-6I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9812G6KB-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9812G6KB-6I reliable?

The price and inventory of W9812G6KB-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6KB-6I is usually 5 days.

3.What payment methods are accepted for W9812G6KB-6I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6KB-6I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9812G6KB-6I?

W9812G6KB-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9812G6KB-6I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9812G6KB-6I?

For technical support, including W9812G6KB-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6KB-6I requirements.

6.How does Aetrix verify that W9812G6KB-6I is sourced from the original manufacturer or authorized distributors?

All W9812G6KB-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6KB-6I meets industry standards.

7.What is the process for return or replacement of W9812G6KB-6I?

All W9812G6KB-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6KB-6I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9812G6KB-6I part is unused and in its original packaging.

Return procedure for W9812G6KB-6I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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