My Inquiry
My Account
Winbond Electronics Corporation W9812G6KB-6I TR
- Part No.:
- W9812G6KB-6I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TFBGA
- Datasheet:
-
W9812G6KB-6I TR.pdf
- Description:
- IC DRAM 128MBIT LVTTL 54TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,796
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W9812G6KB-6I TR from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V supply, and TFBGA-54 (8×8 mm²) packaging. It delivers up to 166 million words/second bandwidth and supports auto-precharge, self-refresh, and burst lengths of 1/2/4/8/full page for embedded main memory in industrial control systems.
For engineers reviewing the W9812G6KB-6I TR datasheet, W9812G6KB-6I TR pinout, W9812G6KB-6I TR application, or W9812G6KB-6I TR equivalent, key selection criteria include industrial temperature support (−40°C to +85°C), LVTTL interface compatibility, TFBGA-54 ball mapping, and CAS latency configuration via mode register.
Technical Context
This SDRAM implements four independent 2M-word banks with interleaved access capability to hide precharge delays. Its command decoder interprets RAS/CAS/WE/CS on CLK rising edges to execute bank activate, read/write, precharge, auto-precharge, self-refresh, and power-down operations - all synchronized to a single 166 MHz clock.
The device uses multiplexed address pins A0–A11 (row/column shared), BS0/BS1 for bank selection, and LDQM/UDQM for byte-level write masking. Internal timing parameters - including tRCD = 20 ns, tRP = 20 ns, and tRC = 60 ns - are fixed for the -6I speed grade and enforced by on-die control logic without external timing compensation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 4 banks × 16 bits = 128 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum data throughput and minimum clock period (6.02 ns) |
| CAS Latency | CL = 3 - requires 3-clock delay between column command and first valid read data output |
| Burst Length | 1, 2, 4, 8, or full page - determines number of consecutive data transfers per read/write command |
| Operating Temperature | −40°C to +85°C - validated for industrial environments without derating |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL I/O and requires separate VDDQ/VSSQ for DQ noise isolation |
| Refresh Requirement | 4K cycles / 64 ms - mandates periodic refresh commands to retain data; no self-refresh above 85°C |
Pinout & Package
Package: TFBGA-54 (8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant lead-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A10 controls all-bank precharge when high during command |
| BS0, BS1 | Bank Select | Binary-encoded selection of one of four internal banks during activate or access |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDQM/UDQM |
| /CS, /RAS, /CAS, /WE | Command Control | Active-low command inputs decoded synchronously on CLK rising edge |
| CLK, CKE | Clock Interface | CLK provides timing reference; CKE enables/disables clock domain (low = power-down/self-refresh) |
| LDQM, UDQM | Data Mask | High during read places DQ outputs in Hi-Z; high during write blocks corresponding byte writes |
| VDD, VSS | Core Power/Ground | 3.3 V supply and return for logic circuitry and input buffers |
| VDDQ, VSSQ | I/O Power/Ground | Separate 3.3 V supply/ground for DQ drivers to minimize switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temp Range | Rated for continuous operation from −40°C to +85°C, enabling use in factory automation and outdoor equipment |
| Programmable Burst Mode | Configurable sequential or interleave addressing via mode register - optimizes cache-line fetch efficiency |
| Auto-Precharge Support | Automatic bank precharge triggered by A10 high during read/write - reduces software overhead and improves bandwidth utilization |
| Low-Power Self-Refresh | Self-refresh current ≤2 mA at 85°C - maintains data retention during host sleep without external refresh controller |
| LVTTL-Compatible Interface | Direct connection to 3.3 V microcontrollers and FPGAs without level-shifting - simplifies PCB routing and BOM |
Applications
| Industrial HMI Panels | Network Edge Routers |
|---|---|
Use Scenario: Touch-enabled operator interfaces in manufacturing cells requiring local display buffering and real-time status updates. IC Role / Device Role / Timing Role: Main system memory for ARM-based SoC running Linux GUI stack; handles frame buffer, firmware, and runtime variables. Use Value: 166 MHz bandwidth sustains 60 Hz video refresh at 1024×768 resolution; industrial temp rating ensures reliability in uncooled enclosures. | Use Scenario: Packet buffering and forwarding tables in compact Layer 3 switches deployed in telecom cabinets. IC Role / Device Role / Timing Role: Shared packet memory for multi-port Ethernet MACs; supports concurrent read/write across banks via interleaving. Use Value: Four-bank architecture enables pipelined access to reduce latency between ingress/egress queues; auto-precharge minimizes command overhead. |
| Medical Diagnostic Devices | Automated Test Equipment |
Use Scenario: Image acquisition subsystems capturing ultrasound or X-ray frames before compression and transmission. IC Role / Device Role / Timing Role: High-speed frame store interfacing directly to ADC/DAC controllers and DMA engines. Use Value: Full-page burst mode delivers contiguous 16-bit pixel data at peak rate; self-refresh preserves image buffers during standby. | Use Scenario: Real-time pattern generation and response capture in semiconductor ATE platforms with tight timing margins. IC Role / Device Role / Timing Role: On-board memory for waveform storage and comparison logic in FPGA-based test sequencers. Use Value: CL3 timing and tRCD = 20 ns enable deterministic sub-6 ns clock-to-data alignment; TFBGA-54 footprint fits dense probe card layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16160J-6BLI | Same 2M×4×16 organization, 166 MHz, CL3, TFBGA-54, but with extended voltage range (2.5–3.6 V) and higher self-refresh current (3 mA @ 85°C) | Supports mixed-voltage designs; slightly higher power in self-refresh mode | Choose if board uses 2.5 V I/O or requires wider supply tolerance |
| MT48LC16M16A2P-6A:G | Identical pinout and timing, but rated only to 70°C ambient and uses TSOP-54 package instead of TFBGA-54 | Not suitable for sealed industrial enclosures; requires more PCB area | Choose only for cost-sensitive commercial applications with adequate thermal management |
Compared with IS42S16160J-6BLI and MT48LC16M16A2P-6A:G, the W9812G6KB-6I TR offers identical performance and industrial temperature support in a space-saving TFBGA package, with lower self-refresh current than the ISSI part and broader thermal qualification than the Micron part.
Availability
W9812G6KB-6I TR is available at Aetrix Electronics and suitable for industrial HMI panels, network edge routers, medical diagnostic devices, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9812G6KB-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontroller solutions for industrial, automotive, and computing markets.
The W9812G6KB series belongs to Winbond's industrial-grade SDRAM product line, designed specifically for reliable main memory in resource-constrained embedded systems operating under wide temperature and voltage variations.
FAQ
What is the maximum operating frequency and CAS latency supported by W9812G6KB-6I TR?
The W9812G6KB-6I TR is rated for 166 MHz operation with CAS Latency 3 (CL3) at −40°C to +85°C. It does not support CL2 at this speed grade; CL2 is only specified for the -6 speed grade at 0°C to 70°C. The device requires tRCD = 20 ns and tRP = 20 ns, which are fixed for the -6I variant and enforced by internal timing logic.
Does W9812G6KB-6I TR support self-refresh above 85°C ambient temperature?
No, W9812G6KB-6I TR does not support self-refresh operation above 85°C case temperature. The datasheet explicitly states "Not support self refresh function with TCASE > 85°C". For operation up to 105°C, the -6J variant must be used, which specifies 5 mA max self-refresh current at that temperature.
What package type and ball count does W9812G6KB-6I TR use?
W9812G6KB-6I TR uses a TFBGA-54 package measuring 8 mm × 8 mm with 0.8 mm ball pitch. It contains 54 solder balls arranged in a grid pattern, including 12 address balls (A0–A11), 2 bank select (BS0/BS1), 16 data (DQ0–DQ15), 4 control (/CS, /RAS, /CAS, /WE), 2 data masks (LDQM/UDQM), 2 clocks (CLK/CKE), 5 power/ground (VDD/VSS/VDDQ/VSSQ), and 2 no-connect (NC) balls.
How is bank selection implemented on W9812G6KB-6I TR?
Bank selection on W9812G6KB-6I TR is performed using two dedicated input pins: BS0 and BS1. These pins are sampled during the bank activate command to select one of four internal banks (Bank 0 to Bank 3) in binary encoding (BS1,BS0 = 00,01,10,11). They are also used during precharge commands to determine whether a single bank or all banks are precharged, depending on the A10 state.
Can W9812G6KB-6I TR operate with a 2.5 V supply voltage?
No, W9812G6KB-6I TR requires a nominal 3.3 V supply with tolerance of ±0.3 V (3.0 V to 3.6 V). It is not compatible with 2.5 V systems. The device uses LVTTL-compatible input thresholds and separate VDDQ/VSSQ rails optimized for 3.3 V I/O signaling; operation outside the specified voltage range may cause functional failure or accelerated wear.
W9812G6KB-6I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- LVTTL
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TFBGA (8x8)
W9812G6KB-6I TR FAQ
1.How can I place an order for W9812G6KB-6I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9812G6KB-6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9812G6KB-6I TR reliable?
The price and inventory of W9812G6KB-6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6KB-6I TR is usually 5 days.
3.What payment methods are accepted for W9812G6KB-6I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6KB-6I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9812G6KB-6I TR?
W9812G6KB-6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9812G6KB-6I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9812G6KB-6I TR?
For technical support, including W9812G6KB-6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6KB-6I TR requirements.
6.How does Aetrix verify that W9812G6KB-6I TR is sourced from the original manufacturer or authorized distributors?
All W9812G6KB-6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6KB-6I TR meets industry standards.
7.What is the process for return or replacement of W9812G6KB-6I TR?
All W9812G6KB-6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6KB-6I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9812G6KB-6I TR part is unused and in its original packaging.
Return procedure for W9812G6KB-6I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9812G6KB-6I TR Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
