My Inquiry
My Account
Winbond Electronics Corporation W9812G6KH-5
- Part No.:
- W9812G6KH-5
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9812G6KH-5.pdf
- Description:
- IC DRAM 128MBIT LVTTL 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,434
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W9812G6KH-5 from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 200 MHz with CAS Latency 3, 3.3V LVTTL interface, and TSOP II-54 package. It delivers up to 200M words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and industrial display systems.
For engineers reviewing the W9812G6KH-5 datasheet, W9812G6KH-5 pinout, W9812G6KH-5 application, or W9812G6KH-5 equivalent, key selection criteria include its -5 speed grade (200MHz/CL3), 0°C to 70°C commercial temperature range, self-refresh capability (2mA max), and TSOP II-54 pin mapping with separate VDDQ/VSSQ rails for I/O noise isolation.
Technical Context
This SDRAM implements four independent 2M-word banks with interleaved access to hide precharge latency, enabling continuous burst transfers across bank boundaries. Its programmable Mode Register configures burst type (sequential/interleave), length, and CAS latency-critical for optimizing throughput in real-time video frame buffers and network packet buffers.
Command decoding is fully synchronous to CLK, with all operations (ACTIVATE, READ, WRITE, PRECHARGE, AUTO-PRECHARGE, SELF REFRESH) defined by RAS/CAS/WE/CS logic levels sampled on the rising clock edge. The device requires eight CBR auto-refresh cycles after mode register initialization and supports power-down and clock-suspend modes for dynamic power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 4 banks × 16 bits = 128 Mbit total capacity |
| Max Clock Frequency | 200 MHz - enables 400 MT/s data rate with double-data-rate-compatible timing |
| CAS Latency | CL = 3 - fixed 3-cycle read latency at 200 MHz, defining minimum tRCD and tRP timing margins |
| Burst Length | 1, 2, 4, 8, or full page - selectable via Mode Register to match DMA transfer sizes |
| Supply Voltage | 3.3V ± 0.3V - requires dedicated VDD (core) and VDDQ (I/O) rails with decoupling |
| Refresh Requirement | 4K cycles / 64 ms @ 0°C–70°C - mandates periodic refresh controller intervention |
| Package | TSOP II-54, 400 mil - surface-mount footprint compatible with standard PCB reflow profiles |
| Operating Temperature | 0°C to 70°C - commercial-grade thermal envelope for non-extended-environment applications |
Pinout & Package
W9812G6KH-5 uses a 54-pin TSOP II (Thin Small Outline Package, Type II) with 400-mil body width, lead-free and RoHS-compliant construction. Pin 1 is located at bottom-left corner when notch faces upward; pins are numbered counter-clockwise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A0–A11 for row, A0–A8 for column during burst |
| BS0, BS1 | Bank Select | Selects one of four internal banks during ACTIVATE or READ/WRITE command execution |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; LDQM/UDQM control byte masking for partial writes |
| CS, RAS, CAS, WE | Command Control | Four active-low control signals defining all operations via synchronous command decoder |
| CLK, CKE | Timing Control | CLK synchronizes all inputs; CKE gates internal clock to enter Power Down or Self Refresh |
| LDQM, UDQM | I/O Mask | Low-active masks for lower/upper 8-bit data bytes during read (Hi-Z) or write (block) |
| VDD, VSS | Core Power/Ground | 3.3V supply and return for logic circuitry and input buffers |
| VDDQ, VSSQ | I/O Power/Ground | Isolated 3.3V supply and return for output drivers to reduce switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Mode Register | Configures burst length, CAS latency, and burst type (sequential/interleave) without hardware change |
| Auto-precharge Support | Enables automatic bank precharge after read/write via A10 high, reducing command overhead in streaming applications |
| Separate I/O Power Rails | VDDQ/VSSQ isolation minimizes data bus noise and improves signal integrity in high-speed parallel interfaces |
| Self Refresh Mode | Autonomous refresh at 2mA max current preserves data during host sleep, critical for low-power embedded systems |
| Interleaved Bank Access | Overlapping ACTIVATE–READ sequences across banks hide tRP/tRC delays, sustaining >80% bus utilization |
| Byte Write Masking | LDQM/UDQM enable precise 8-bit write control, avoiding read-modify-write cycles in partial updates |
Applications
| Industrial HMI Display Buffer | Network Packet Buffer |
|---|---|
Use Scenario: Storing frame buffers for 800×480 TFT LCD panels in factory-floor HMIs with real-time UI updates. IC Role / Device Role / Timing Role: Primary SDRAM acting as dual-port frame buffer, accepting pixel writes from MCU and feeding parallel RGB interface at 25 MHz pixel clock. Use Value: 200 MHz clock and CL3 latency ensure sub-20 ns effective access time per 16-bit word, supporting 60 Hz refresh without frame tearing. |
Use Scenario: Temporary storage of Ethernet frames in industrial gateways before protocol processing or forwarding. IC Role / Device Role / Timing Role: High-bandwidth packet buffer interfacing with MAC controller via 16-bit synchronous bus, absorbing bursty 100 Mbps traffic. Use Value: 4-bank interleaving and full-page burst support sustain >150 MB/s sustained write throughput, preventing packet loss under line-rate load. |
| Embedded Media Decoder | Real-Time PLC Data Log |
Use Scenario: Frame-level buffering for MPEG-2 video decode in set-top boxes or digital signage players. IC Role / Device Role / Timing Role: External memory for decoded YUV 4:2:0 macroblocks, accessed sequentially by video engine with burst-8 reads. Use Value: Interleaved burst mode and programmable sequential addressing align with macroblock raster scan, eliminating address calculation overhead. |
Use Scenario: Circular buffer for timestamped sensor data in programmable logic controllers with deterministic logging intervals. IC Role / Device Role / Timing Role: Non-volatile-adjacent RAM for high-speed data capture, written continuously via DMA and read out during maintenance windows. Use Value: Auto-precharge and low-latency CL3 operation allow back-to-back writes at 200 MHz, guaranteeing microsecond-level sample jitter < 1 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-5BLI | Same 2M×4×16 organization, 200 MHz/CL3, but 54-pin TSOP II with different pinout (e.g., A10/AP function differs) | Requires PCB layout revision due to non-identical address/control pin mapping and VDDQ placement | Valid alternative only with board redesign; verify tRCD/tRP compatibility against target controller timing budget |
| MT48LC16M16A2P-6A | 16M×16 organization (256 Mbit), 166 MHz/CL3, 54-pin TSOP II, higher density but slower speed grade | Suitable for designs needing larger buffer space but tolerant of 166 MHz clock and relaxed timing margins | Drop-in replacement only if system clock is ≤166 MHz and firmware supports extended row/column addressing |
Compared with IS42S16100E-5BLI and MT48LC16M16A2P-6A, W9812G6KH-5 offers the highest clock rate (200 MHz) in its density class and strict commercial-temperature validation, making it optimal for cost-sensitive, high-throughput embedded systems where timing margin is constrained.
Availability
W9812G6KH-5 is available at Aetrix Electronics and suitable for industrial HMI displays, network packet buffers, embedded media decoders, and real-time PLC data loggers requiring stable component supply and long-term manufacturability.
Supply support for W9812G6KH-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and trusted computing solutions, with over 30 years of DRAM design heritage.
W9812G6KH-5 belongs to Winbond's legacy SDR SDRAM product line, engineered for cost-effective, pin-compatible memory expansion in resource-constrained microcontroller-based systems and industrial controllers.
FAQ
What is the maximum operating frequency and CAS latency of the W9812G6KH-5?
The W9812G6KH-5 is rated for 200 MHz operation with a fixed CAS latency of 3. This means that after issuing a READ command, valid data appears on DQ0–DQ15 exactly three clock cycles later. The -5 speed grade guarantees this timing across the full 0°C to 70°C commercial temperature range and 3.3V ±0.3V supply, as verified in the AC characteristics table of the official datasheet.
Does the W9812G6KH-5 support self-refresh mode, and what is its typical current draw?
Yes, the W9812G6KH-5 supports self-refresh mode, which maintains data integrity without external refresh commands. At 0°C to 70°C, its maximum self-refresh current is 2 mA, as specified in the Order Information table. This low current enables extended sleep states in battery-backed or energy-conscious embedded systems while preserving memory contents.
What package type and pin count does the W9812G6KH-5 use?
The W9812G6KH-5 is packaged in a 54-pin TSOP II (Thin Small Outline Package, Type II) with 400-mil body width. It uses lead-free, RoHS-compliant materials and features separate VDDQ/VSSQ rails for I/O power isolation. Pin configuration matches industry-standard SDR SDRAM layouts, including dedicated LDQM/UDQM for byte masking and BS0/BS1 for bank selection.
How many banks and what memory organization does the W9812G6KH-5 implement?
The W9812G6KH-5 implements four independent memory banks, each organized as 2,097,152 words × 16 bits. Total capacity is 128 Mbit (2M × 4 banks × 16 bits). This 4-bank architecture enables true interleaved access-allowing an ACTIVATE in one bank while reading from another-to hide precharge and row-cycle delays and sustain high effective bandwidth.
Can the W9812G6KH-5 be used in systems requiring extended temperature operation?
No-the W9812G6KH-5 is specified only for 0°C to 70°C commercial operation. For extended temperature ranges, Winbond offers variants such as W9812G6KH-5I (-40°C to 85°C) and W9812G6KH-5J (-40°C to 105°C), which differ in self-refresh current (5 mA for -5J) and qualification testing but share identical pinout, timing, and functional behavior with the W9812G6KH-5.
W9812G6KH-5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- LVTTL
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
W9812G6KH-5 FAQ
1.How can I place an order for W9812G6KH-5 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9812G6KH-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9812G6KH-5 reliable?
The price and inventory of W9812G6KH-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6KH-5 is usually 5 days.
3.What payment methods are accepted for W9812G6KH-5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6KH-5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9812G6KH-5?
W9812G6KH-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9812G6KH-5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9812G6KH-5?
For technical support, including W9812G6KH-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6KH-5 requirements.
6.How does Aetrix verify that W9812G6KH-5 is sourced from the original manufacturer or authorized distributors?
All W9812G6KH-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6KH-5 meets industry standards.
7.What is the process for return or replacement of W9812G6KH-5?
All W9812G6KH-5 units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6KH-5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9812G6KH-5 part is unused and in its original packaging.
Return procedure for W9812G6KH-5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9812G6KH-5 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
