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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9812G6KH-5I

Name: W9812G6KH-5I
Brand: Winbond Electronics Corporation
SKU: W9812G6KH-5I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9812G6KH-5I

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TSOP (0.400", 10.16mm Width)

Datasheet:: W9812G6KH-5I.pdf

Description:: IC DRAM 128MBIT LVTTL 54TSOP II

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Product details

Overview

W9812G6KH-5I from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 200 MHz with CAS Latency 3, 3.3V supply, and industrial temperature range (–40°C to +85°C). It delivers up to 200 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and industrial HMIs.

For engineers reviewing the W9812G6KH-5I datasheet, W9812G6KH-5I pinout, W9812G6KH-5I application, or W9812G6KH-5I equivalent, key selection criteria include its TSOP II-54 package, LVTTL interface compatibility, self-refresh capability at ≤85°C, and support for auto-precharge and interleaved bank access to minimize latency in real-time data acquisition systems.

Technical Context

The W9812G6KH-5I implements a four-bank architecture with independent row activation and column access, enabling true bank interleaving to hide tRCD and tRP delays. Its programmable Mode Register configures burst type (sequential/interleaved), length, and CAS latency - all critical for optimizing throughput in burst-intensive applications like video frame buffering.

It supports full command set compliance per JEDEC SDRAM standard: Bank Activate, Read/Write with auto-precharge, Burst Stop, Self Refresh (enabled only at TA ≤ 85°C), and Power Down mode. Clock Enable (CKE) controls entry/exit from low-power states, while LDQM/UDQM provide per-byte write masking and output tri-state control during read bursts.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	2,097,152 words × 4 banks × 16 bits = 64 Mbit total capacity
Max Clock Frequency	200 MHz - enables 400 MT/s data rate with double-data-rate-compatible timing
CAS Latency	CL = 3 - fixed latency for predictable read-to-data-valid timing in deterministic systems
Burst Length	1, 2, 4, 8, or full page - configurable via Mode Register to match processor/cache line size
Operating Voltage	3.3 V ± 0.3 V - compatible with legacy LVTTL logic families and industrial power rails
Temperature Range	–40°C to +85°C - qualified for extended industrial environments without derating
Refresh Requirement	4K cycles / 64 ms - ensures data retention under continuous operation at max temperature
Package	TSOP II-54, 400 mil - surface-mount compatible with standard reflow profiles and IPC-7351B footprints

Pinout & Package

W9812G6KH-5I uses a 54-pin Thin Small Outline Package (TSOP II), 400 mil body width, lead-free and RoHS-compliant. Pin functions are defined per JEDEC-standard SDRAM layout with dedicated address, control, data, and power/ground terminals.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A0–A11 used for row, A0–A8 for column addressing
BS0, BS1	Bank Select	Selects one of four internal banks during ACTIVATE or READ/WRITE commands
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte masking via LDQM/UDQM
LDQM, UDQM	I/O Mask	Tri-states lower/upper 8-bit data outputs during reads or blocks writes with zero latency
CS, RAS, CAS, WE	Command Control	Four primary control signals defining all operations (e.g., CS+RAS+CAS+WE = Mode Register Set)
CLK, CKE	Timing Control	CLK synchronizes all inputs; CKE gates clock domain entry into Power Down/Self Refresh modes
VDD, VDDQ, VSS, VSSQ	Power/Ground	Separated core (VDD/VSS) and I/O (VDDQ/VSSQ) supplies reduce switching noise on data paths

Key Features

Feature	Design Value
Interleaved Bank Access	Enables concurrent row activation across banks to eliminate precharge wait time between sequential page accesses
Programmable Burst Mode	Supports both sequential and interleave column addressing - critical for matching CPU cache-line fetch patterns
Auto-precharge	Automatically initiates bank precharge after burst completion when A10 = HIGH, reducing software overhead
Self Refresh Mode	Maintains data integrity with internal refresh counter while external clocks are halted - valid only at TA ≤ 85°C
Power Down Mode	Reduces standby current by gating input buffers when CKE = LOW; requires exit sequence before next command

Applications

Industrial HMI Display Buffer	Embedded Network Router Memory
Use Scenario: Storing frame buffers for 800×480 TFT LCD panels in factory-floor HMIs with real-time update requirements. IC Role / Device Role / Timing Role: Primary SDRAM serving as dual-port display memory, accepting pixel writes from ARM Cortex-M7 DMA while feeding parallel RGB output via dedicated controller interface. Use Value: 200 MHz clock and 4-bank interleaving sustain >150 MB/s sustained bandwidth needed for 60 Hz refresh without frame tearing.	Use Scenario: Packet buffering in Layer 3 industrial Ethernet switches handling 100 Mbps fieldbus traffic with QoS prioritization. IC Role / Device Role / Timing Role: Shared packet buffer memory accessed concurrently by ingress/egress MAC controllers using separate bank arbitration. Use Value: Auto-precharge and burst-length flexibility allow efficient storage of variable-size Ethernet frames (64–1518 bytes) without manual bank management.
Medical Imaging Data Acquisition	Automated Test Equipment (ATE) FIFO
Use Scenario: Capturing raw sensor streams from ultrasound transducer arrays at 25 MSPS with real-time FIR filtering. IC Role / Device Role / Timing Role: High-bandwidth circular buffer staging ADC samples before DSP engine processing; operates in burst-read mode with CL3 predictability. Use Value: 3.3V LVTTL compatibility simplifies interface to FPGA-based acquisition logic; –40°C to +85°C rating ensures reliability inside sealed diagnostic enclosures.	Use Scenario: Temporary storage of test vectors and response data in boundary-scan controllers performing JTAG chain validation. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory used as deep FIFO between pattern generator and comparator logic. Use Value: Fixed CL3 and precise tRCD/tRP specs enable cycle-accurate timing closure in 100 MHz test clock domains without margin padding.

Industrial HMI Display Buffer

Embedded Network Router Memory

Use Scenario: Storing frame buffers for 800×480 TFT LCD panels in factory-floor HMIs with real-time update requirements.

IC Role / Device Role / Timing Role: Primary SDRAM serving as dual-port display memory, accepting pixel writes from ARM Cortex-M7 DMA while feeding parallel RGB output via dedicated controller interface.

Use Value: 200 MHz clock and 4-bank interleaving sustain >150 MB/s sustained bandwidth needed for 60 Hz refresh without frame tearing.

Use Scenario: Packet buffering in Layer 3 industrial Ethernet switches handling 100 Mbps fieldbus traffic with QoS prioritization.

IC Role / Device Role / Timing Role: Shared packet buffer memory accessed concurrently by ingress/egress MAC controllers using separate bank arbitration.

Use Value: Auto-precharge and burst-length flexibility allow efficient storage of variable-size Ethernet frames (64–1518 bytes) without manual bank management.

Medical Imaging Data Acquisition

Automated Test Equipment (ATE) FIFO

Use Scenario: Capturing raw sensor streams from ultrasound transducer arrays at 25 MSPS with real-time FIR filtering.

IC Role / Device Role / Timing Role: High-bandwidth circular buffer staging ADC samples before DSP engine processing; operates in burst-read mode with CL3 predictability.

Use Value: 3.3V LVTTL compatibility simplifies interface to FPGA-based acquisition logic; –40°C to +85°C rating ensures reliability inside sealed diagnostic enclosures.

Use Scenario: Temporary storage of test vectors and response data in boundary-scan controllers performing JTAG chain validation.

IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory used as deep FIFO between pattern generator and comparator logic.

Use Value: Fixed CL3 and precise tRCD/tRP specs enable cycle-accurate timing closure in 100 MHz test clock domains without margin padding.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-5BLI	Same 2M×4×16 organization, 200 MHz/CL3, TSOP-54, but supports Self Refresh at 105°C (vs. W9812G6KH-5I limit of 85°C)	Required for extended-temperature systems where ambient exceeds 85°C and self-refresh must remain active	Select IS42S16100E-5BLI if operation above 85°C with self-refresh is mandatory; otherwise W9812G6KH-5I offers cost advantage
MT48LC16M16A2P-6A:G	16M×16 organization (256 Mbit), 166 MHz/CL3, same TSOP-54 footprint but higher density and slower speed grade	Suitable when larger memory capacity is needed and 200 MHz bandwidth is not required	Choose MT48LC16M16A2P-6A:G only if design requires >64 Mbit capacity; W9812G6KH-5I provides better bandwidth-per-watt in constrained 64 Mbit use cases

Compared with IS42S16100E-5BLI and MT48LC16M16A2P-6A:G, the W9812G6KH-5I delivers optimal balance of industrial temperature support, 200 MHz performance, and 64 Mbit density in TSOP-54 - making it preferred for cost-sensitive, thermally bounded embedded systems requiring deterministic SDRAM timing.

Availability

W9812G6KH-5I is available at Aetrix Electronics and suitable for industrial HMIs, medical data loggers, and network edge devices requiring stable component supply, long-lifecycle availability, and guaranteed industrial temperature performance.

Supply support for W9812G6KH-5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, PSRAM, and SDRAM for industrial, automotive, and consumer applications.

The W9812G6KH series belongs to Winbond's industrial-grade SDRAM product line, designed specifically for embedded systems demanding reliable, wide-temperature operation with JEDEC-compliant timing and low-power modes.

FAQ

What is the maximum operating frequency and CAS latency supported by W9812G6KH-5I?

The W9812G6KH-5I is rated for 200 MHz operation with CAS Latency 3 (CL3) at –40°C to +85°C. This timing is guaranteed per datasheet AC specifications and enables predictable tAC and tCAC delays essential for FPGA or microcontroller interface timing closure. The -5I speed grade does not support CL2 operation - only CL3 is specified and validated for this variant.

Does W9812G6KH-5I support self-refresh mode across its full temperature range?

No. W9812G6KH-5I supports self-refresh mode only at ambient temperatures ≤ 85°C, as explicitly stated in the datasheet Feature section ("Not support self refresh function with TA > 85°C"). At 105°C, self-refresh is disabled; external refresh must be maintained. This limitation applies strictly to the -5I grade - higher-grade variants like -5J support self-refresh up to 105°C.

What package type and pin count does W9812G6KH-5I use?

W9812G6KH-5I uses a 54-pin TSOP II (Thin Small Outline Package) with 400 mil body width, lead-free construction, and RoHS compliance. Pinout follows JEDEC-standard SDRAM layout, including dedicated DQ0–DQ15, A0–A11, BS0/BS1, and control signals (CS, RAS, CAS, WE, CKE, CLK), plus separated VDD/VDDQ and VSS/VSSQ rails.

Can W9812G6KH-5I be used as a direct replacement for W9812G6KH-6I in an existing design?

W9812G6KH-5I is not a drop-in replacement for W9812G6KH-6I due to differing speed grades: -5I runs at 200 MHz/CL3, while -6I is 166 MHz/CL3. Although pinout and voltage are identical, timing parameters (e.g., tRC, tRCD, tRP) are tighter for -5I. Using -5I in a -6I-designed system may cause setup/hold violations unless timing margins are re-verified; conversely, substituting -6I for -5I will reduce maximum achievable bandwidth.

What are the key differences between W9812G6KH-5I and W9812G6KH-5J?

The W9812G6KH-5I and W9812G6KH-5J share identical speed grade (200 MHz/CL3) and electrical specs, but differ in thermal qualification: -5I is rated for –40°C to +85°C, while -5J extends to +105°C and specifies higher max self-refresh current (5 mA vs. 2 mA). The -5J variant also enables self-refresh operation above 85°C - a critical distinction for under-hood or enclosed high-heat environments where the W9812G6KH-5I cannot maintain data retention autonomously.

W9812G6KH-5I Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TSOP (0.400", 10.16mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: LVTTL

Clock Frequency:: 200 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TSOP II

W9812G6KH-5I FAQ

1.How can I place an order for W9812G6KH-5I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9812G6KH-5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9812G6KH-5I reliable?

The price and inventory of W9812G6KH-5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6KH-5I is usually 5 days.

3.What payment methods are accepted for W9812G6KH-5I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6KH-5I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9812G6KH-5I?

W9812G6KH-5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9812G6KH-5I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9812G6KH-5I?

For technical support, including W9812G6KH-5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6KH-5I requirements.

6.How does Aetrix verify that W9812G6KH-5I is sourced from the original manufacturer or authorized distributors?

All W9812G6KH-5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6KH-5I meets industry standards.

7.What is the process for return or replacement of W9812G6KH-5I?

All W9812G6KH-5I units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6KH-5I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9812G6KH-5I part is unused and in its original packaging.

Return procedure for W9812G6KH-5I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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