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Winbond Electronics Corporation W9812G6KH-6 TR
- Part No.:
- W9812G6KH-6 TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9812G6KH-6 TR.pdf
- Description:
- IC DRAM 128MBIT LVTTL 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:3,083
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Product details
Overview
W9812G6KH-6 TR from Winbond is a 2M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V LVTTL interface, and TSOP II-54 package. It delivers 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and industrial HMIs.
For engineers reviewing the W9812G6KH-6 TR datasheet, W9812G6KH-6 TR pinout, W9812G6KH-6 TR application, or W9812G6KH-6 TR equivalent, key selection criteria include its -6 speed grade (166 MHz/CL3), TSOP II-54 mechanical compatibility, self-refresh capability at ≤85°C, and support for auto-precharge and interleaved bank access to hide row-to-row latency.
Technical Context
This SDRAM implements four independent 512K-word banks with shared address/command bus and multiplexed row/column addressing. Internal refresh counter and programmable mode register enable dynamic control of burst type (sequential/interleaved), burst length, and CAS latency.
It uses LVTTL-compatible inputs and separate VDDQ/VSSQ rails for I/O noise isolation. Power-down and clock-suspend modes reduce active current to 2 mA (typical), while self-refresh maintains data integrity during system sleep-subject to temperature limits (-40°C to +85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 4 banks × 16 bits = 67,108,864 bits (8 MB) |
| Clock Frequency | 166 MHz - defines maximum command rate and sustained bandwidth |
| CAS Latency | CL = 3 - fixed 3-cycle delay between column address strobe and first valid read data |
| Burst Length | 1, 2, 4, 8, or full page - determines consecutive data words per read/write command |
| Supply Voltage | 3.3 V ± 0.3 V - requires stable LVTTL-compliant power rail with separate VDDQ |
| Refresh Rate | 4K cycles / 64 ms @ TA ≤ 85°C - mandates periodic refresh commands to retain data |
| Operating Temperature | 0°C to 70°C - validated for commercial-grade industrial control and display systems |
Pinout & Package
W9812G6KH-6 TR is housed in a RoHS-compliant, lead-free TSOP II-54 package (400 mil width), with 54 pins arranged in two rows. Pin functions are fully defined per JEDEC-standard SDRAM interface timing and signal grouping.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A0–A8 used for column, A0–A11 for row |
| BS0, BS1 | Bank Select | Binary-encoded selection of one of four internal banks during activate/read/write |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; LDQM/UDQM control byte masking on reads/writes |
| CS, RAS, CAS, WE | Command Control | Four active-low control signals defining all operations (activate, read, write, precharge, etc.) |
| CLK, CKE | Timing Interface | Single-ended clock input and clock-enable signal controlling all synchronous operations |
| LDQM, UDQM | I/O Mask | Lower/upper byte mask; tri-states DQ outputs or blocks write data with zero latency |
| VDD, VDDQ, VSS, VSSQ | Power/Ground | Dual-supply architecture: VDD/VSS for core logic, VDDQ/VSSQ for I/O buffers to reduce switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Interleaved Bank Access | Enables continuous data streaming across banks by overlapping activate/precharge/read cycles |
| Programmable Mode Register | Configures burst length, burst type (sequential/interleave), and CAS latency at initialization |
| Auto-Precharge Support | Automatically initiates bank precharge after burst completion when A10 = high, reducing manual command overhead |
| Self-Refresh Mode | Maintains data retention without external refresh commands during low-power states (valid ≤85°C) |
| Power-Down Mode | Reduces standby current to ~2 mA by gating internal clocks and input receivers while preserving state |
Applications
| Industrial HMI Display Buffer | Embedded Controller Main Memory |
|---|---|
Use Scenario: Real-time rendering of GUI elements and video overlays in panel-mounted HMIs with ARM Cortex-A5/A7 SoCs. IC Role / Device Role / Timing Role: Primary frame buffer memory interfaced via 16-bit SDRAM controller with burst-length-4 sequential reads. Use Value: 166 MHz clock and CL3 latency deliver 664 MB/s peak bandwidth sufficient for 1024×600@60Hz RGB565 display refresh. |
Use Scenario: Runtime code and data storage for real-time motion control firmware running on dual-core Cortex-M7 microcontrollers. IC Role / Device Role / Timing Role: External main memory supporting instruction fetch and DMA-based sensor data buffering. Use Value: Four-bank architecture enables concurrent background refresh and foreground access, minimizing CPU wait states during burst writes from ADC streams. |
| Network Router Packet Buffer | Medical Diagnostic Imaging Cache |
Use Scenario: Temporary storage of Ethernet packet payloads in Layer-3 routing engines with QoS prioritization logic. IC Role / Device Role / Timing Role: Shared packet buffer accessed by multiple DMA channels with interleaved bank arbitration. Use Value: Auto-precharge and burst-stop commands allow rapid context switching between priority queues without full bank precharge delays. |
Use Scenario: Intermediate image frame caching in portable ultrasound devices using FPGA-accelerated beamforming pipelines. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory for real-time pixel reordering and compression. Use Value: TSOP II-54 footprint ensures mechanical compatibility with legacy medical PCBs; 0°C–70°C rating meets clinical ambient requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-6BLI | Same 2M×4×16 organization, 166 MHz/CL3, but in 54-pin TSOP II with different AC timing margins (tRCD = 20 ns vs. 22 ns) | Valid for drop-in replacement where tRCD裕度 is ≥22 ns; not qualified for self-refresh above 85°C | Select if sourcing from ISSI distribution channels or requiring extended temp validation (-40°C to +85°C) |
| MT48LC16M16A2P-6A:J | Identical speed grade and pinout, but Micron part has tighter tRC (60 ns vs. 66 ns) and higher IDD2 current (110 mA vs. 95 mA) | Requires minor layout review for power delivery; supports same burst modes and mode register configuration | Choose when long-term Micron supply assurance is required or for designs already using MT48LC family reference schematics |
Compared with IS42S16100E-6BLI and MT48LC16M16A2P-6A:J, the W9812G6KH-6 TR offers identical functional compatibility and mechanical fit but lower active current and broader commercial temperature margin, making it optimal for cost-sensitive, thermally constrained embedded systems.
Availability
W9812G6KH-6 TR is available at Aetrix Electronics and suitable for industrial HMIs, embedded controllers, network edge devices, and medical imaging subsystems requiring stable component supply, long-lifecycle availability, and RoHS-compliant packaging.
Supply support for W9812G6KH-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.
The W9812G6KH series belongs to Winbond's standard SDRAM product line, designed specifically for cost-effective, high-reliability memory expansion in industrial and consumer embedded systems requiring JEDEC-compliant timing and robust thermal performance.
FAQ
What is the maximum operating frequency and CAS latency supported by the W9812G6KH-6 TR?
The W9812G6KH-6 TR is rated for 166 MHz operation with a fixed CAS latency of 3. This means the device requires exactly three clock cycles between assertion of the Column Address Strobe (CAS) and the appearance of valid read data on DQ pins. Its -6 speed grade is validated per JEDEC SDRAM timing specifications under 0°C to 70°C ambient conditions, and it does not support CL2 operation.
Does the W9812G6KH-6 TR support self-refresh mode, and what are its temperature limitations?
Yes, the W9812G6KH-6 TR supports self-refresh mode to maintain data integrity without external refresh commands. However, self-refresh is only guaranteed to operate correctly at junction temperatures up to +85°C. The datasheet explicitly states "Not support self refresh function with TA > 85°C", meaning it must be disabled or avoided in systems exceeding that threshold, such as automotive under-hood applications.
What package type and pin count does the W9812G6KH-6 TR use, and is it RoHS compliant?
The W9812G6KH-6 TR uses a 54-pin Thin Small Outline Package (TSOP II) with 400 mil body width. It is manufactured using lead-free materials and fully complies with RoHS Directive 2011/65/EU. Pin assignments follow JEDEC-standard SDRAM layout, including dedicated VDDQ/VSSQ rails for I/O noise isolation and NC pins at positions 36 and 40.
How does the W9812G6KH-6 TR handle burst termination and bank precharging?
The W9812G6KH-6 TR supports both explicit precharge commands (via CS/RAS/WE low, CAS high) and auto-precharge (by setting A10 high during read/write). It also implements a Burst Stop command (CS/WE low, RAS/CAS high) to terminate full-page bursts early while keeping the bank open. Auto-precharge cannot be used with full-page bursts, and Burst Stop is illegal for non-full-page lengths.
Can the W9812G6KH-6 TR be used interchangeably with the -6I or -6J variants in a commercial-temperature design?
No - the W9812G6KH-6 TR is specified only for 0°C to 70°C operation. The -6I variant extends operation to -40°C to +85°C and increases self-refresh current to 2 mA (vs. 2 mA typical for -6), while the -6J variant supports -40°C to +105°C with 5 mA self-refresh current. Substituting -6I/-6J into a -6-design risks over-spec'ing thermal and power margins without functional benefit, and may incur unnecessary cost.
W9812G6KH-6 TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- LVTTL
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
W9812G6KH-6 TR FAQ
1.How can I place an order for W9812G6KH-6 TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9812G6KH-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9812G6KH-6 TR reliable?
The price and inventory of W9812G6KH-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9812G6KH-6 TR is usually 5 days.
3.What payment methods are accepted for W9812G6KH-6 TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9812G6KH-6 TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9812G6KH-6 TR?
W9812G6KH-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9812G6KH-6 TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9812G6KH-6 TR?
For technical support, including W9812G6KH-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9812G6KH-6 TR requirements.
6.How does Aetrix verify that W9812G6KH-6 TR is sourced from the original manufacturer or authorized distributors?
All W9812G6KH-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9812G6KH-6 TR meets industry standards.
7.What is the process for return or replacement of W9812G6KH-6 TR?
All W9812G6KH-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9812G6KH-6 TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9812G6KH-6 TR part is unused and in its original packaging.
Return procedure for W9812G6KH-6 TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9812G6KH-6 TR Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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