Winbond Electronics Corporation W9816G6IH-6
- Part No.:
- W9816G6IH-6
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 50-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9816G6IH-6.pdf
- Description:
- IC DRAM 16MBIT PAR 50TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9816G6IH-6 from Winbond Electronics is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and TSOP II-50 package. It delivers up to 266 MB/s bandwidth and supports burst lengths of 1, 2, 4, 8, and full page for high-throughput memory buffering in embedded controllers and industrial display systems.
For engineers reviewing the W9816G6IH-6 datasheet, W9816G6IH-6 pinout, W9816G6IH-6 application, or W9816G6IH-6 equivalent, key selection criteria include its 166 MHz/CL3 timing compliance, dual-bank interleaving capability, LVTTL interface compatibility, self-refresh current ≤2 mA, and industrial-grade alternatives with extended temperature support.
Technical Context
This SDRAM implements fully synchronous operation latched on the rising edge of CLK, with programmable Mode Register control over burst type (sequential/interleave), burst length, and CAS latency. Its dual-bank architecture enables bank interleaving to hide precharge delays, supporting continuous data streaming across pages without bus idle cycles.
Command decoding relies on RAS/CAS/WE/CS combinations synchronized to CLK, with CKE enabling power management modes including Power Down and Self Refresh. The device uses separate VCCQ/VSSQ rails for I/O buffers to improve noise immunity, and supports auto-precharge, burst stop, and DQM-controlled byte masking for precise data integrity in mixed-read/write environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 2 banks × 16 bits = 16 Mbit total capacity; enables efficient 16-bit wide data path interfacing with microcontrollers and video processors. |
| Max Clock Frequency | 166 MHz (tCK = 6 ns); defines maximum sustained data transfer rate of 266 MB/s in burst mode. |
| CAS Latency | CL = 3 (also supports CL = 2); determines minimum clock cycles between column address strobe and first valid read data output. |
| Burst Length | 1, 2, 4, 8, or full page; configurable via Mode Register to match host controller burst requirements and optimize bandwidth utilization. |
| Supply Voltage | 3.3V ±0.3V (VCC and VCCQ); compatible with standard 3.3V logic systems without level-shifting circuitry. |
| Refresh Rate | 4,096 cycles / 64 ms (64 µs interval); ensures data retention without external refresh controller intervention. |
| Self-Refresh Current | ≤2 mA; enables low-power retention during system sleep states while maintaining memory contents. |
| Operating Temperature | 0°C to 70°C; validated for commercial-grade embedded applications including HMI panels and network gateways. |
Pinout & Package
W9816G6IH-6 is housed in a 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with lead-free, RoHS-compliant construction. Pin pitch is 0.5 mm, body width 10.16 mm, and height ≤1.2 mm - suitable for space-constrained PCB layouts in industrial and consumer electronics.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Input (Multiplexed) | Row/column address lines shared across access phases; A0–A10 used for row, A0–A7 for column addressing. |
| BA | Bank Select | Selects one of two internal banks during ACTIVATE or READ/WRITE commands to enable interleaved access. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes without read-modify-write overhead. |
| CS | Chip Select | Enables command decoder; when deasserted (high), all inputs are ignored and ongoing operations continue. |
| RAS, CAS, WE | Command Control | Combination-sampled at CLK rising edge to decode core operations: ACTIVATE, READ, WRITE, PRECHARGE, etc. |
| CLK | System Clock Input | Synchronizes all command, address, and data transfers; all operations referenced to rising edge only. |
| CKE | Clock Enable | Controls entry/exit from Power Down, Clock Suspend, and Self Refresh modes; low = clock gated. |
| LDQM / UDQM | I/O Mask | Low-active mask signals: LDQM masks DQ0–DQ7, UDQM masks DQ8–DQ15; enables byte-level write control. |
| VCC / VSS | Core Power / Ground | 3.3V supply and return for internal logic and input buffers; decoupling required per JEDEC SDRAM guidelines. |
| VCCQ / VSSQ | I/O Power / Ground | Separate 3.3V supply and ground for output drivers; isolates I/O noise from core logic for signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Mode Register | Configures burst length, CAS latency, and burst type (sequential/interleave) dynamically without hardware change. |
| Dual-Bank Interleaving | Allows back-to-back READ/WRITE operations across banks, eliminating tRC wait states and sustaining >90% bus utilization. |
| Auto-Precharge Support | Automatically initiates bank precharge after burst completion when A10 = high, reducing software overhead and command latency. |
| LVTTL-Compatible Interface | Direct connection to 3.3V microcontrollers and FPGAs without level shifters; meets JEDEC JESD8-15A electrical specs. |
| Byte-Level Write Masking | LDQM/UDQM pins provide zero-latency, cycle-accurate control over lower/upper byte writes - critical for register-mapped peripherals. |
| Self-Refresh Mode | Maintains data integrity with ≤2 mA current draw during system suspend; exits cleanly upon CKE reassertion with tXSR delay. |
Applications
| Industrial HMI Display Buffer | Network Router Packet Buffer |
|---|---|
|
Use Scenario: Storing frame buffers and GUI assets for 800×480 TFT displays in factory-floor HMIs with real-time update requirements. IC Role / Device Role / Timing Role: Primary SDRAM acting as double-buffered pixel memory, interfaced to ARM9-based SoC via 16-bit EBI with CL3 timing. Use Value: 166 MHz operation sustains 266 MB/s throughput needed for 60 Hz refresh of 24-bit color frames; dual-bank interleaving prevents display tearing during simultaneous UI rendering and comms processing. |
Use Scenario: Temporary storage of Ethernet packet payloads in Layer 3 enterprise routers handling 100 Mbps+ line rates. IC Role / Device Role / Timing Role: Shared packet buffer accessed by multiple DMA channels; configured with burst length 4 and auto-precharge for predictable latency. Use Value: Full-page burst capability enables rapid ingress/egress of jumbo frames; ≤2 mA self-refresh current supports energy-efficient standby during low-traffic periods without data loss. |
| Embedded Media Player Memory | Industrial PLC Data Log Buffer |
|
Use Scenario: Buffering decoded MP3/AAC audio streams and metadata in portable medical device playback modules. IC Role / Device Role / Timing Role: External memory mapped to DSP's EMIF; operates in sequential burst mode with CL2/CL3 selectable for jitter-sensitive audio timing. Use Value: 3.3V-only supply simplifies power design; LDQM/UDQM masking allows clean sample-aligned writes without corrupting adjacent stereo channel data. |
Use Scenario: Cyclic logging of sensor readings (temperature, pressure, vibration) in oil-and-gas PLCs requiring nonvolatile retention during brownouts. IC Role / Device Role / Timing Role: High-reliability buffer holding 10+ seconds of timestamped data before flash transfer; uses self-refresh during mains failure. Use Value: Validated 0°C to 70°C operation ensures stability in cabinet-mounted enclosures; 4K refresh/64 ms spec guarantees data integrity across 10-year field deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-6BLI | Same density (16 Mbit), 54-pin TSOP, 166 MHz/CL3, but requires 2.5V–3.6V VCC range and has higher self-refresh current (3.5 mA). | Supports -40°C to 85°C industrial temp range; better suited for outdoor or automotive-adjacent deployments. | Select when extended temperature range or broader voltage tolerance is required; verify PCB layout compatibility with 54-pin footprint. |
| MT48LC16M16A2P-6A | Identical organization and speed grade, but Micron part uses 54-pin TSOP and specifies tRC = 50 ns vs. Winbond's 45 ns; slightly looser timing margins. | Qualified for longer lifecycle availability and automotive PPAP; preferred for long-lifecycle industrial OEM programs. | Choose for supply chain diversification where identical functional behavior is acceptable and minor timing margin differences are accommodated in system timing budget. |
Compared with W9816G6IH-6, IS42S16100E-6BLI offers wider voltage tolerance and extended temperature support at the cost of higher self-refresh current, while MT48LC16M16A2P-6A provides automotive-grade qualification and longer production continuity but with relaxed tRC timing - both require board-level validation due to pin count and package differences.
Availability
W9816G6IH-6 is available at Aetrix Electronics and suitable for industrial HMI display buffers, network router packet buffers, and embedded media player memory requiring stable component supply, long-term lifecycle assurance, and commercial-temperature SDRAM performance.
Supply support for W9816G6IH-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR Flash, DDR/SDRAM, and voice/audio ICs, serving industrial, communications, and consumer markets since 1987.
The W98 series SDRAM product line targets cost-sensitive, high-reliability embedded systems requiring JEDEC-compliant synchronous DRAM with industrial temperature variants and long-lifecycle support.
FAQ
What is the maximum operating frequency and CAS latency supported by W9816G6IH-6?
W9816G6IH-6 is rated for 166 MHz operation with CAS Latency 3 (CL3), and also supports CL2 timing at reduced frequencies. Its tCK specification is 6 ns, and it complies with JEDEC Standard No. 21-C for SDRAM timing. This makes W9816G6IH-6 suitable for systems requiring deterministic 16-bit memory bandwidth up to 266 MB/s without overclocking.
Does W9816G6IH-6 support auto-precharge and how is it enabled?
Yes, W9816G6IH-6 supports auto-precharge: when A10 is driven high during a READ or WRITE command, the SDRAM automatically initiates precharge after burst completion. For reads, precharge begins before burst end based on CL; for writes, it starts two clocks after final data-in (tWR). This eliminates manual precharge commands and reduces controller overhead in W9816G6IH-6 implementations.
What package type and pin count does W9816G6IH-6 use?
W9816G6IH-6 uses a 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with 0.5 mm pitch and RoHS-compliant lead-free finish. Its mechanical dimensions conform to JEDEC MO-152AA, and it features separate VCCQ/VSSQ pins for I/O power isolation - a key layout requirement reflected in W9816G6IH-6 reference designs.
Can W9816G6IH-6 operate in self-refresh mode, and what is its typical current draw?
Yes, W9816G6IH-6 supports self-refresh mode entered via the Self Refresh Command (CS=RAS=CAS=WE=low, CKE=low), drawing ≤2 mA typical current. This allows W9816G6IH-6 to retain memory contents during system sleep or power-loss events without external refresh circuitry, making it ideal for battery-backed or energy-conscious embedded applications.
How does W9816G6IH-6 handle byte-level write masking?
W9816G6IH-6 implements byte-level write masking using LDQM (pins 14, 36) for DQ0–DQ7 and UDQM for DQ8–DQ15. When asserted high during a write cycle, each mask signal blocks corresponding byte writes with zero latency - enabling precise peripheral register updates or partial buffer writes without read-modify-write sequences in W9816G6IH-6 systems.
W9816G6IH-6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 50-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 50-TSOP II
W9816G6IH-6 FAQ
1.How can I place an order for W9816G6IH-6 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9816G6IH-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9816G6IH-6 reliable?
The price and inventory of W9816G6IH-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6IH-6 is usually 5 days.
3.What payment methods are accepted for W9816G6IH-6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6IH-6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9816G6IH-6?
W9816G6IH-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9816G6IH-6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9816G6IH-6?
For technical support, including W9816G6IH-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6IH-6 requirements.
6.How does Aetrix verify that W9816G6IH-6 is sourced from the original manufacturer or authorized distributors?
All W9816G6IH-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6IH-6 meets industry standards.
7.What is the process for return or replacement of W9816G6IH-6?
All W9816G6IH-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6IH-6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9816G6IH-6 part is unused and in its original packaging.
Return procedure for W9816G6IH-6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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