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Winbond Electronics Corporation W9816G6IH-6I
- Part No.:
- W9816G6IH-6I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 50-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9816G6IH-6I.pdf
- Description:
- IC DRAM 16MBIT PAR 50TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,033
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Product details
Overview
W9816G6IH-6I from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (–40°C to +85°C), used as main memory in embedded controllers and legacy communication baseband subsystems.
For engineers reviewing the W9816G6IH-6I datasheet, W9816G6IH-6I pinout, W9816G6IH-6I application, or W9816G6IH-6I equivalent, key selection criteria include burst length configurability (1/2/4/8/full page), dual-bank interleaving support, LVTTL interface compatibility, and self-refresh current ≤2 mA under industrial conditions.
Technical Context
This SDRAM implements fully synchronous operation latched on the rising edge of CLK, with programmable Mode Register controlling burst type (sequential/interleave), burst length, and CAS latency. It supports auto-precharge and controlled precharge, enabling efficient bank interleaving to hide tRCD and tRP delays.
Functional modes include Power Down (CKE-driven), Self Refresh (CS/RAS/CAS/WE low, CKE low), Clock Suspend (CKE low during active bank), and Burst Stop (for full-page bursts only). All banks must be precharged before Mode Register Set, and eight Auto Refresh cycles are required post-initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 2 banks × 16 bits = 16 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum sustained data throughput of 332 MB/s (166M × 2 bytes) |
| CAS Latency | CL = 3 - fixed read access latency of 3 clock cycles after column address strobe |
| Burst Length | Programmable 1, 2, 4, 8, or full page - determines consecutive data words per read/write command |
| Refresh Requirement | 4,096 cycles / 64 ms - mandates refresh every 15.625 µs per row for data retention |
| Supply Voltage | 3.3 V ± 0.3 V - requires stable LVTTL-compatible power rail; VCCQ separated for I/O noise immunity |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments without derating |
| Self-Refresh Current | ≤2 mA - enables low-power retention mode during system sleep states |
Pinout & Package
W9816G6IH-6I uses a 50-pin, 400-mil TSOP II (Type II) package with lead-free, RoHS-compliant construction. Pin layout follows JEDEC-standard SDRAM pinout for 16-bit x2-bank configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Input | Multiplexed row/column address lines; A0–A10 for row, A0–A7 for column |
| BA | Bank Select | 2-bit select for one of two internal banks during ACTIVATE or READ/WRITE |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; LDQM/UDQM control byte masking per transfer |
| CS | Chip Select | Enables command decoder; when high, all commands ignored except Deselect |
| RAS, CAS, WE | Command Strobes | Combined with CS and clock edge to decode ACTIVATE, READ, WRITE, PRECHARGE, etc. |
| CLK | System Clock | Rising-edge-synchronized timing reference for all command and data transfers |
| CKE | Clock Enable | Controls entry/exit of Power Down, Clock Suspend, and Self Refresh modes |
| LDQM/UDQM | I/O Mask | Low/high byte mask: high = tri-state output or block write input with zero latency |
| VCC / VSS | Core Power/Ground | 3.3V supply and return for logic and input buffers |
| VCCQ / VSSQ | I/O Power/Ground | Separated 3.3V supply and return dedicated to DQ drivers for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Burst Mode | Configurable sequential or interleave addressing per Mode Register, enabling optimized access patterns for streaming vs. random workloads |
| Dual-Bank Interleaving | Enables back-to-back reads/writes across banks (e.g., Bank 0 read while Bank 1 precharges), hiding tRP and improving effective bandwidth |
| Auto-Precharge Support | A10-high during READ/WRITE triggers automatic bank precharge after burst completion, reducing software overhead and command scheduling complexity |
| LVTTL-Compatible Interface | Direct connection to 3.3V microcontrollers and FPGAs without level-shifting; meets JEDEC JESD8-15A electrical specs |
| Industrial Temperature Range | Guaranteed functionality from –40°C to +85°C with no performance degradation, validated per JESD22-A108 |
| Separate I/O Power Rails | VCCQ/VSSQ isolation minimizes switching noise coupling from DQ drivers into core logic, improving signal integrity in dense PCB layouts |
Applications
| Industrial HMI Controller Memory | Legacy Telecom Baseband Buffer |
|---|---|
Use Scenario: Real-time display rendering and touch response buffering in factory-floor HMIs with ARM9-based SoCs. IC Role / Device Role / Timing Role: Primary working memory interfaced directly to processor AXI/AHB bus; provides burst-aligned pixel and command data. Use Value: 166 MHz clock and CL3 latency enable sub-100 ns average read access; dual-bank interleaving sustains >280 MB/s effective bandwidth during GUI frame updates. |
Use Scenario: Channel aggregation buffer in TD-SCDMA/LTE legacy baseband units requiring deterministic latency and thermal resilience. IC Role / Device Role / Timing Role: Shared data buffer between DSP cores and RF front-end controllers; operates in synchronous burst mode with auto-precharge. Use Value: –40°C to +85°C rating ensures uninterrupted operation in uncooled outdoor cabinets; ≤2 mA self-refresh current extends backup battery life during brownouts. |
| Medical Imaging Subsystem Frame Store | Automotive Infotainment Head Unit RAM |
Use Scenario: Temporary storage of ultrasound scan line buffers in portable diagnostic devices with discrete FPGA-based image processors. IC Role / Device Role / Timing Role: Low-latency frame buffer supporting burst-length-4 reads aligned to pixel clock domains; managed via external memory controller FSM. Use Value: Full-page burst capability allows rapid loading of 2D scanline segments; separate VCCQ/VSSQ rails suppress EMI-induced artifacts in analog signal paths. |
Use Scenario: Application runtime memory in automotive head units based on older NXP i.MX27/28 platforms requiring pin-compatible SDRAM upgrade. IC Role / Device Role / Timing Role: Drop-in replacement for obsolete -6 speed grade parts; identical TSOP-II footprint and command set. Use Value: Same 166 MHz/CL3 timing and industrial temp rating as W9816G6IH-6A, but with cost-optimized qualification-no revalidation needed for existing designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-6BLI | Same 512K×2×16 organization, 166 MHz, CL3, TSOP-54; higher self-refresh current (3.5 mA) and wider VCC range (2.5–3.6 V) | Validated for extended-temperature FPGA interfaces; lacks explicit industrial temp documentation for -40°C startup | Select if broader voltage tolerance or FPGA vendor reference design alignment is prioritized over minimal self-refresh current |
| MT48LC16M16A2P-6A:G | 16M×16-bit (256Mbit), 166 MHz, CL3, TSOP-54; requires PCB redesign due to larger density and different pinout (e.g., A11 present) | Used in newer infotainment platforms needing higher memory capacity; not pin-compatible with W9816G6IH-6I | Choose only when board revision permits footprint change and firmware supports extended row/column addressing |
Compared with IS42S16100E-6BLI and MT48LC16M16A2P-6A:G, W9816G6IH-6I offers the lowest self-refresh current (≤2 mA) and guaranteed –40°C cold-start behavior in a legacy 50-pin TSOP-II form factor, making it optimal for cost-sensitive, thermally constrained industrial replacements where capacity and pinout must remain unchanged.
Availability
W9816G6IH-6I is available at Aetrix Electronics and suitable for industrial HMI controllers, legacy telecom baseband units, medical imaging subsystems, and automotive infotainment head units requiring stable component supply across extended temperature ranges.
Supply support for W9816G6IH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and trusted computing solutions, with over 30 years of DRAM design heritage.
The W9816G6IH series belongs to Winbond's legacy synchronous DRAM product line, engineered for cost-effective, thermally robust main memory in resource-constrained embedded systems where long-term availability and JEDEC compliance are critical.
FAQ
What is the maximum operating frequency and CAS latency supported by W9816G6IH-6I?
W9816G6IH-6I is rated for 166 MHz operation with CAS Latency 3. This means the device guarantees read data valid 3 clock cycles after the column address is latched. The -6I suffix explicitly denotes industrial temperature qualification (–40°C to +85°C) at this speed/latency combination, and no higher-frequency binning (e.g., -5 grade) is available for this part number.
Does W9816G6IH-6I support both sequential and interleaved burst addressing modes?
Yes, W9816G6IH-6I supports both sequential and interleaved burst addressing, configured via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2); interleaved mode toggles lower address bits (A0–A2 depending on burst length) to optimize cache-line access patterns. This flexibility is confirmed in Section 7.5 and Table 2–3 of the official datasheet.
What is the purpose of the separate VCCQ and VSSQ pins on W9816G6IH-6I?
VCCQ and VSSQ provide dedicated power and ground for the DQ input/output buffers only, electrically isolating them from the core logic supply (VCC/VSS). This separation reduces switching noise coupling from data bus activity into sensitive internal circuitry, improving signal integrity and timing margin-especially critical in high-speed, multi-layer PCB designs with shared power planes.
Can W9816G6IH-6I enter self-refresh mode, and what is the maximum current draw in that state?
Yes, W9816G6IH-6I supports Self Refresh mode entered via CS/RAS/CAS/WE low and CKE low at the clock edge. In this state, the device maintains data without external refresh commands and draws ≤2 mA, as specified in the "AVAILABLE PART NUMBER" table and Section 2 FEATURES. This enables ultra-low-power retention during system suspend cycles.
Is W9816G6IH-6I pin-compatible with other speed grades in the same family, such as W9816G6IH-6 or W9816G6IH-6A?
Yes, W9816G6IH-6I is pin-compatible and functionally identical to W9816G6IH-6 and W9816G6IH-6A in terms of pinout, command set, timing parameters, and electrical interface. The sole differences are temperature qualification (–40°C to +85°C for -6I/-6A vs. 0°C to +70°C for -6) and automotive stress screening for -6A; no PCB or firmware changes are required for substitution among these variants.
W9816G6IH-6I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 50-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 50-TSOP II
W9816G6IH-6I FAQ
1.How can I place an order for W9816G6IH-6I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9816G6IH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9816G6IH-6I reliable?
The price and inventory of W9816G6IH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6IH-6I is usually 5 days.
3.What payment methods are accepted for W9816G6IH-6I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6IH-6I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9816G6IH-6I?
W9816G6IH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9816G6IH-6I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9816G6IH-6I?
For technical support, including W9816G6IH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6IH-6I requirements.
6.How does Aetrix verify that W9816G6IH-6I is sourced from the original manufacturer or authorized distributors?
All W9816G6IH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6IH-6I meets industry standards.
7.What is the process for return or replacement of W9816G6IH-6I?
All W9816G6IH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6IH-6I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9816G6IH-6I part is unused and in its original packaging.
Return procedure for W9816G6IH-6I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9816G6IH-6I Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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