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Winbond Electronics Corporation W9816G6JB-5 TR

Part No.:
W9816G6JB-5 TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW9816G6JB-5 TR.pdf
Description:
IC DRAM 16MBIT LVTTL 60VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,360

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Product details

Overview

W9816G6JB-5 TR from Winbond Electronics is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at up to 200 MHz with CAS Latency 3, supporting LVTTL interface and burst lengths of 1/2/4/8/full page, used as main memory in embedded controllers and industrial display systems.

For engineers reviewing the W9816G6JB-5 TR datasheet, W9816G6JB-5 TR pinout, W9816G6JB-5 TR application, or W9816G6JB-5 TR equivalent, key selection criteria include clock frequency grade (-5 = 200 MHz), VFBGA-60 package compatibility, self-refresh current (2 mA max), and support for auto-precharge and interleaved bank access in resource-constrained designs.

Technical Context

This SDRAM implements a dual-bank architecture with programmable mode register control over burst type (sequential/interleave), burst length, and CAS latency. It uses multiplexed address pins (A0–A10) and bank address (BA) to manage row/column access across two independent 512K-word banks.

Timing compliance includes tRCD ≥ 20 ns, tRP ≥ 20 ns, and tRC ≥ 60 ns at 200 MHz; it supports power-down mode (CKE-controlled), self-refresh (with CKE low), and clock suspend-enabling dynamic power management in battery-sensitive or thermally constrained applications.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization524,288 words × 2 banks × 16 bits = 16 Mbit total capacity; enables efficient page-mode access within each bank.
Clock Frequency200 MHz (−5 speed grade); delivers 200M words/sec peak bandwidth for real-time frame buffering.
CAS LatencyCL = 3 cycles; defines fixed read data valid delay after column address strobe, critical for timing budget allocation.
Burst Length1, 2, 4, 8, or full-page; determines consecutive data words per command, optimizing bus utilization in video or packet buffers.
Supply Voltage3.3 V ± 0.3 V; compatible with standard 3.3 V logic I/O domains without level-shifting circuitry.
Self-Refresh CurrentMax 2 mA; allows retention during system sleep states without external refresh controller intervention.
Operating Temperature0°C to 70°C; validated for commercial-grade industrial control and HMI applications.
PackageVFBGA-60, 0.65 mm pitch; compact footprint suitable for space-limited PCB layouts in portable equipment.

Pinout & Package

VFBGA-60 package with 0.65 mm ball pitch, RoHS-compliant lead-free construction. Ball grid arranged in 7×7 array with corner balls omitted; mechanical dimensions per JEDEC MO-240AB.

Pin/TerminalCircuit RoleDesign Meaning
A0–A10Address InputMultiplexed row/column address lines; A0–A10 used for row, A0–A7 for column in burst operations.
BABank AddressSelects one of two internal banks during ACTIVATE or READ/WRITE command execution.
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes.
CS#, RAS#, CAS#, WE#Command ControlActive-low command inputs defining operation type (e.g., RAS#/CAS#/WE# = L/H/L = WRITE).
CLK, CKEClock InterfaceCLK synchronizes all inputs; CKE enables/disables internal clock domain for power-down and self-refresh entry.
LDQM, UDQMData MaskLow-active masks for lower/upper 8-bit bytes; places DQ outputs in Hi-Z or blocks write data with zero latency.
VDD, VSS, VDDQ, VSSQPower/GroundSeparated core (VDD/VSS) and I/O (VDDQ/VSSQ) rails reduce switching noise and improve signal integrity.
NCNo Connect12 unconnected balls (e.g., G2, G6); must be left floating or tied to ground per layout guidelines.

Key Features

FeatureDesign Value
Interleaved Bank AccessEnables continuous data flow by alternating reads/writes between Bank #0 and Bank #1, hiding tRP precharge delay.
Programmable Mode RegisterConfigures burst length, CAS latency, and burst type (sequential/interleave) dynamically without hardware change.
Auto-Precharge SupportAutomatically initiates bank precharge after burst completion when A10 = high, reducing command overhead in streaming applications.
LVTTL-Compatible InterfaceDirect connection to 3.3 V microcontrollers and FPGAs without level translation, simplifying board design and BOM.
Low-Power Self-RefreshRetains data at 2 mA typical current during standby, enabling >100 ms retention in battery-backed systems.

Applications

Industrial HMI Display BufferEmbedded Network Router Memory

Use Scenario: Storing frame buffers and GUI assets in panel-mounted HMIs with ARM Cortex-A5/A7 SoCs.

IC Role / Device Role / Timing Role: Primary SDRAM for graphics layer rendering and touch response buffering, synchronized to 200 MHz system clock.

Use Value: 16-bit bus width and 200 MHz operation enable 320 MB/s throughput required for 1024×600@60 Hz RGB565 display updates.

Use Scenario: Packet buffering and forwarding table storage in fanless industrial Ethernet routers.

IC Role / Device Role / Timing Role: Shared memory for network stack and packet reassembly, accessed concurrently by CPU and DMA engines.

Use Value: Dual-bank interleaving reduces average access latency by ~30% versus single-bank SDRAM, improving throughput under bursty traffic loads.

Medical Diagnostic Imaging ModuleAutomated Test Equipment (ATE) Controller

Use Scenario: Capturing and staging ultrasound or X-ray sensor frames before compression and transmission.

IC Role / Device Role / Timing Role: High-speed acquisition buffer interfacing with ADC/DAC peripherals via FPGA fabric.

Use Value: Full-page burst mode supports rapid 512-word transfers from sensor FIFOs, minimizing dead time between acquisitions.

Use Scenario: Storing test pattern sequences and measurement result logs in modular ATE mainframes.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM replacement for deterministic pattern replay and real-time pass/fail analysis.

Use Value: Auto-refresh capability ensures data retention during 10+ second calibration pauses without external refresh logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS42S16100E-5BLISame 512K×2×16 organization, 200 MHz, CL3, but uses TSOP-54 package and requires 3.3 V only.Preferred where board-level height constraints allow TSOP; not drop-in due to different pinout and package.Select if legacy PCB layout uses TSOP-54 footprints or thermal dissipation favors exposed leads.
MT48LC16M16A2P-6A:G16 Mbit, 200 MHz, CL3, but rated for extended temperature (−40°C to +85°C) and higher self-refresh current (3 mA).Suitable for automotive or outdoor deployments requiring wider thermal margin and higher reliability.Choose when operating ambient exceeds 70°C or AEC-Q200 qualification is mandated.

Compared with W9816G6JB-5 TR, IS42S16100E-5BLI offers identical electrical timing but demands PCB redesign for TSOP-54, while MT48LC16M16A2P-6A:G trades 1 mA higher self-refresh current for industrial temperature range-making W9816G6JB-5 TR optimal for cost-sensitive commercial-grade embedded systems with strict height and power budgets.

Availability

W9816G6JB-5 TR is available at Aetrix Electronics and suitable for industrial HMI display buffers, embedded network router memory, and medical diagnostic imaging modules requiring stable component supply across multi-year production cycles.

Supply support for W9816G6JB-5 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, PSRAM, and SDRAM for embedded and industrial markets.

The W9816G6JB series targets cost-optimized, high-reliability SDRAM applications in commercial-grade industrial control, human-machine interfaces, and multimedia edge devices where density, speed, and power efficiency intersect.

FAQ

What is the maximum clock frequency supported by the W9816G6JB-5 TR?

The W9816G6JB-5 TR supports a maximum clock frequency of 200 MHz with CAS Latency 3. This speed grade is confirmed in the device's order information table and validated across AC characteristics including tAC (access time), tRCD (RAS-to-CAS delay), and tRC (RAS cycle time). Operation above 200 MHz is not guaranteed and may violate setup/hold timing margins specified in the datasheet.

Does the W9816G6JB-5 TR support both sequential and interleaved burst modes?

Yes, the W9816G6JB-5 TR supports both sequential and interleaved burst addressing modes, configured via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleaved mode toggles address bits for cache-friendly access patterns. The burst type is selected during Mode Register Set command and applies to all subsequent burst operations until reprogrammed.

What is the self-refresh current specification for the W9816G6JB-5 TR?

The W9816G6JB-5 TR has a maximum self-refresh current of 2 mA at 25°C, as specified in the Order Information table and Electrical Characteristics section. This value is measured under standard conditions (VDD = 3.3 V, TA = 25°C) and remains stable across the commercial temperature range (0°C to 70°C), enabling predictable power budgeting in low-power standby modes.

Can the W9816G6JB-5 TR be used with a 2.7 V supply?

No, the W9816G6JB-5 TR is rated for 3.3 V ± 0.3 V operation only, per its −5 speed grade specification. While later grades (−7/−7I) support 2.7 V–3.6 V, the −5 variant requires minimum 3.0 V and maximum 3.6 V on both VDD and VDDQ. Using 2.7 V will violate recommended DC operating conditions and may cause initialization failure or data corruption.

How many banks does the W9816G6JB-5 TR have, and how are they controlled?

The W9816G6JB-5 TR contains two internal banks (Bank #0 and Bank #1), selected using the BA (Bank Address) input pin. Each bank operates independently, allowing interleaved access-e.g., activating Bank #0 while Bank #1 is precharging-to hide tRP latency. Bank activation, precharge, and read/write commands all require explicit BA assertion to target the correct bank.

W9816G6JB-5 TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
LVTTL
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-VFBGA (6.4x10.1)

W9816G6JB-5 TR FAQ

1.How can I place an order for W9816G6JB-5 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9816G6JB-5 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9816G6JB-5 TR reliable?

The price and inventory of W9816G6JB-5 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JB-5 TR is usually 5 days.

3.What payment methods are accepted for W9816G6JB-5 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JB-5 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9816G6JB-5 TR?

W9816G6JB-5 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9816G6JB-5 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9816G6JB-5 TR?

For technical support, including W9816G6JB-5 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JB-5 TR requirements.

6.How does Aetrix verify that W9816G6JB-5 TR is sourced from the original manufacturer or authorized distributors?

All W9816G6JB-5 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JB-5 TR meets industry standards.

7.What is the process for return or replacement of W9816G6JB-5 TR?

All W9816G6JB-5 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JB-5 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9816G6JB-5 TR part is unused and in its original packaging.

Return procedure for W9816G6JB-5 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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