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Winbond Electronics Corporation W9816G6JB-6
- Part No.:
- W9816G6JB-6
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W9816G6JB-6.pdf
- Description:
- IC DRAM 16MBIT 60-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,795
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Product details
Overview
W9816G6JB-6 from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and VFBGA-60 (0.65 mm pitch) packaging. It delivers 332 MB/s peak bandwidth and supports burst lengths of 1/2/4/8/full page in sequential or interleave mode for embedded main memory applications.
For engineers reviewing the W9816G6JB-6 datasheet, W9816G6JB-6 pinout, W9816G6JB-6 application, or W9816G6JB-6 equivalent, key selection criteria include tRCD = 20 ns, tRP = 20 ns, tRC = 60 ns, self-refresh current ≤2 mA, and LVTTL-compatible interface timing compliance at industrial temperature range (0°C to 70°C).
Technical Context
This SDRAM implements dual-bank architecture with programmable Mode Register controlling burst length, CAS latency (CL2/CL3), and burst type (sequential/interleave). Internal refresh counter executes 2K cycles per 32 ms, and bank interleaving hides precharge latency during continuous access across banks.
It supports full command set including Bank Activate, Auto-precharge Read/Write, Burst Stop, Self-Refresh, and Power Down modes. Input/output masking via LDQM/UDQM enables byte-level write control, while CKE-gated clock suspend and power-down modes reduce active/idle power consumption without external refresh controller dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 2 banks × 16 bits = 16 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum data transfer rate of 332 MB/s (166 MHz × 2 bytes) |
| CAS Latency | CL3 - fixed 3-clock delay between column address strobe and first valid read data output |
| Burst Length | 1, 2, 4, 8, or full page - determines number of consecutive column accesses per command |
| Supply Voltage | 3.3V ±0.3V - requires stable LDO regulation; VDDQ separated for I/O noise immunity |
| Refresh Requirement | 2K cycles / 32 ms - mandates external or internal refresh controller support every 15.625 µs average interval |
| Operating Temperature | 0°C to 70°C - validated for commercial-grade embedded systems, not extended industrial |
| Package | VFBGA-60, 0.65 mm pitch - surface-mount footprint compatible with standard reflow profiles and RoHS-compliant assembly |
Pinout & Package
VFBGA-60 package with 0.65 mm ball pitch, lead-free and RoHS compliant. Ball layout optimized for signal integrity: dedicated VDD/VSS pairs per quadrant, separate VDDQ/VSSQ for I/O, and NC balls isolated or grounded per design guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Input | Multiplexed row/column address lines; A0–A10 used for row, A0–A7 for column addressing |
| BA | Bank Address | Selects one of two internal banks during ACTIVATE or READ/WRITE command execution |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes |
| CS#, RAS#, CAS#, WE# | Command Control | Active-low command decode inputs; define all operations (ACTIVATE, READ, WRITE, PRECHARGE, etc.) on CLK rising edge |
| CLK, CKE | Timing Control | CLK synchronizes all inputs; CKE enables/disables internal clock domain (Power Down, Self-Refresh entry/exit) |
| LDQM, UDQM | I/O Mask | Low-active masks lower/upper 8 bits of DQ bus during write; places outputs in Hi-Z during read |
| VDD, VSS | Core Power/Ground | 3.3V supply and return for logic circuitry and input buffers; must be decoupled locally |
| VDDQ, VSSQ | I/O Power/Ground | Separate 3.3V supply and return for output drivers to minimize switching noise coupling into core logic |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Mode Register | Enables runtime configuration of burst length, CAS latency, and burst type without hardware change |
| Auto-precharge Support | Automatically initiates bank precharge after burst completion when A10 = high, reducing software overhead |
| Dual-Bank Interleaving | Enables back-to-back read/write operations across banks, hiding tRP/tRCD delays and improving effective bandwidth |
| Byte Write Enable | LDQM/UDQM allow independent masking of lower/upper 8-bit lanes, enabling efficient 8-bit or 16-bit data updates |
| Self-Refresh Mode | Internal refresh counter maintains data retention with only CKE held low; no external clock or commands required |
| Power Down Mode | CKE gating disables internal clock and input receivers, cutting standby current while preserving row activation state |
Applications
| Industrial HMI Display Controller | Network Router Packet Buffer |
|---|---|
Use Scenario: Real-time rendering of GUI layers and video overlays in factory-floor HMIs with ARM-based SoCs. IC Role / Device Role / Timing Role: Primary system memory providing 16-bit wide data path to display engine and CPU bus interface. Use Value: CL3 timing and 166 MHz operation enable sub-100 ns average read latency for frame buffer access, supporting 60 Hz 800×480 displays with zero tearing. |
Use Scenario: Temporary storage of Ethernet frames in Layer 3 routing engines before forwarding decision and egress scheduling. IC Role / Device Role / Timing Role: High-throughput packet buffer interfacing with MAC controllers via synchronous 16-bit bus. Use Value: Dual-bank interleaving allows concurrent ingress buffering and egress readout, sustaining 332 MB/s line-rate traffic for 100 Mbps interfaces. |
| Medical Imaging Data Acquisition | POS Terminal Main Memory |
Use Scenario: Capturing and staging raw sensor data from ultrasound transducer arrays prior to DSP processing. IC Role / Device Role / Timing Role: Burst-capable memory for DMA-driven acquisition pipelines with minimal CPU intervention. Use Value: Full-page burst mode and auto-precharge reduce command overhead, enabling sustained 16-bit transfers at >300 MB/s for real-time beamforming buffers. |
Use Scenario: Running lightweight Linux OS and transaction firmware on ARM Cortex-A5/A7-based point-of-sale terminals. IC Role / Device Role / Timing Role: Cost-optimized main memory supporting boot ROM, kernel, and application code execution. Use Value: VFBGA-60 footprint minimizes PCB area; 0°C–70°C rating matches retail environment requirements; 2 mA self-refresh extends battery backup duration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-6BLI | Same 512K×2×16 organization, 166 MHz, CL3, but uses TSOP-54 package and requires 2.7–3.6V supply | TSOP-54 footprint incompatible with VFBGA-60 layout; higher board space and thermal resistance | Choose only if redesigning for through-hole or larger-pitch surface mount; not drop-in replacement |
| MT48LC16M16A2P-6A | Identical speed grade (-6A), same VFBGA-60 package, but Micron part has tRCD = 18 ns vs. Winbond's 20 ns | Slightly tighter timing allows margin for high-noise environments or marginal clock skew | Valid alternative where tRCD margin is critical; verify compatibility with existing PCB layout and power delivery |
Compared with W9816G6JB-6, IS42S16100E-6BLI trades package flexibility for voltage range adaptability, while MT48LC16M16A2P-6A offers tighter tRCD at identical speed grade-both require validation against system timing closure and thermal constraints.
Availability
W9816G6JB-6 is available at Aetrix Electronics and suitable for industrial HMI systems, network infrastructure equipment, medical data acquisition modules, and retail POS terminals requiring stable component supply across multi-year production cycles.
Supply support for W9816G6JB-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and SDRAM products for industrial, automotive, and consumer markets.
The W9816G6JB series targets cost-sensitive, high-reliability embedded systems requiring synchronous DRAM with industrial temperature support and compact VFBGA packaging.
FAQ
What is the maximum supported clock frequency for W9816G6JB-6?
W9816G6JB-6 is rated for operation up to 166 MHz with CAS Latency 3. This speed grade corresponds to a minimum tCK (clock period) of 6 ns and is validated under 3.3V ±0.3V supply and 0°C to 70°C ambient conditions. Exceeding this frequency may result in timing violations or data corruption.
Does W9816G6JB-6 support both sequential and interleave burst modes?
Yes, W9816G6JB-6 supports both sequential and interleave burst addressing modes, selectable via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleave mode toggles specific address bits (A0, A1, A2) to optimize cache line access patterns in processor-centric systems.
What is the self-refresh current specification for W9816G6JB-6?
W9816G6JB-6 specifies a maximum self-refresh current of 2 mA at 70°C. This value reflects worst-case power draw during self-refresh mode, where the internal refresh counter operates autonomously with CKE held low and all other control signals inactive.
Can W9816G6JB-6 operate with a 2.7V supply?
No, W9816G6JB-6 is specified only for 3.3V ±0.3V operation (i.e., 3.0V to 3.6V). The -6 speed grade belongs to the 3.3V family; 2.7V operation is reserved for -7/-7I grades. Using 2.7V will violate DC operating conditions and likely cause initialization failure or intermittent data errors.
How many address pins does W9816G6JB-6 use, and what do they control?
W9816G6JB-6 uses 11 address pins (A0–A10), multiplexed for both row and column addressing. During ACTIVATE, A0–A10 provide the 11-bit row address; during READ/WRITE, A0–A7 provide the 8-bit column address. BA selects between the two internal banks.
W9816G6JB-6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- -
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-VFBGA (6.4x10.1)
W9816G6JB-6 FAQ
1.How can I place an order for W9816G6JB-6 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9816G6JB-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9816G6JB-6 reliable?
The price and inventory of W9816G6JB-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JB-6 is usually 5 days.
3.What payment methods are accepted for W9816G6JB-6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JB-6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9816G6JB-6?
W9816G6JB-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9816G6JB-6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9816G6JB-6?
For technical support, including W9816G6JB-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JB-6 requirements.
6.How does Aetrix verify that W9816G6JB-6 is sourced from the original manufacturer or authorized distributors?
All W9816G6JB-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JB-6 meets industry standards.
7.What is the process for return or replacement of W9816G6JB-6?
All W9816G6JB-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JB-6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9816G6JB-6 part is unused and in its original packaging.
Return procedure for W9816G6JB-6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9816G6JB-6 Tags
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