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Winbond Electronics Corporation W9816G6JB-6I
- Part No.:
- W9816G6JB-6I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W9816G6JB-6I.pdf
- Description:
- IC DRAM 16MBIT 60-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,635
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Product details
Overview
W9816G6JB-6I from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, supporting LVTTL interface and auto-precharge, designed for main memory in industrial embedded systems requiring extended temperature operation.
For engineers reviewing the W9816G6JB-6I datasheet, W9816G6JB-6I pinout, W9816G6JB-6I application, or W9816G6JB-6I equivalent, key selection considerations include industrial-grade temperature support (–40°C to +85°C), VFBGA-60 package compatibility, burst length configurability (1/2/4/8/full page), and self-refresh current ≤2 mA.
Technical Context
This SDRAM implements dual-bank interleaving to hide precharge latency and supports programmable mode register settings for burst type (sequential/interleave), burst length, and CAS latency. It uses multiplexed address pins (A0–A10) with bank address (BA) to select one of two internal banks.
Command decoding is fully synchronous to CLK edge, with control signals CS#, RAS#, CAS#, and WE# defining operations including Bank Activate, Read/Write, Auto-precharge, Self-Refresh, and Power Down. DQ masking via LDQM/UDQM enables byte-level write control with zero-latency blocking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 2 banks × 16 bits = 16 Mbit total capacity |
| Max Clock Frequency | 166 MHz - determines maximum sustained data throughput of 332 MByte/s (16-bit bus) |
| CAS Latency | CL = 3 - defines fixed 3-clock-cycle delay between column command and first valid read data |
| Burst Length | Programmable 1, 2, 4, 8, or full-page - enables efficient sequential access within open row |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments without derating |
| Supply Voltage | 3.0 V to 3.6 V (VDD/VDDQ) - compatible with standard 3.3 V LVTTL logic domains |
| Self-Refresh Current | ≤2 mA - enables low-power retention during system sleep without external refresh controller |
| Refresh Requirement | 2,048 cycles per 32 ms - mandates minimum refresh rate of 64 µs per row |
Pinout & Package
VFBGA-60 package with 0.65 mm ball pitch, RoHS-compliant lead-free construction; 60-ball layout includes dedicated power/ground separation (VDD/VSS for core, VDDQ/VSSQ for I/O) to minimize switching noise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Multiplexed Address | Row/column address inputs shared across banks; A0–A10 used for row, A0–A7 for column |
| BA | Bank Address | Selects one of two internal banks during ACTIVATE or READ/WRITE command |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with separate input/output paths controlled by LDQM/UDQM |
| CS#, RAS#, CAS#, WE# | Command Control | Active-low command inputs decoded synchronously on CLK rising edge |
| CLK, CKE | Clock Interface | CLK provides timing reference; CKE enables/disables clock domain (Power Down/Self-Refresh entry) |
| LDQM / UDQM | I/O Mask | Low-active mask signals controlling lower/upper 8-bit byte writes and tri-stating outputs during reads |
| VDD, VSS, VDDQ, VSSQ | Power/Ground | Separated core and I/O supplies reduce noise coupling and improve signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Range | –40°C to +85°C operation guaranteed - eliminates need for thermal margining in harsh environments |
| Programmable Burst Mode | Configurable sequential or interleave addressing - optimizes bandwidth for streaming vs. random-access patterns |
| Auto-Precharge Support | Automatic bank closure triggered by A10 high during READ/WRITE - reduces software overhead and improves efficiency |
| Separate I/O Power Rails | VDDQ/VSSQ isolation - suppresses I/O switching noise from affecting core logic timing stability |
| Low-Power Self-Refresh | ≤2 mA current draw - extends battery life in portable/embedded systems during idle periods |
| LVTTL-Compatible Interface | VIH ≥ 2.0 V, VIL ≤ 0.8 V - ensures interoperability with legacy 3.3 V microcontrollers and FPGAs |
Applications
| Industrial HMI Display Controller | Network Router Packet Buffer |
|---|---|
Use Scenario: Real-time rendering of GUI elements and video overlays in factory-floor HMIs with fanless cooling. IC Role / Device Role / Timing Role: Main system memory for ARM Cortex-A series SoC, providing burst-accessed frame buffer and application code storage. Use Value: Dual-bank interleaving sustains >90% bus utilization during simultaneous display refresh and user input processing. |
Use Scenario: Temporary storage of Ethernet frames in Layer 3 routing hardware with deterministic latency requirements. IC Role / Device Role / Timing Role: Shared packet buffer between ingress/egress engines, accessed via DMA with precise tRCD/tRP timing compliance. Use Value: CAS Latency 3 and 166 MHz clock enable sub-20 ns average read access time for forwarding decision pipelines. |
| Medical Imaging Data Acquisition | Automated Test Equipment (ATE) Pattern Memory |
Use Scenario: Capturing raw sensor data from ultrasound transducer arrays before DSP-based beamforming. IC Role / Device Role / Timing Role: High-throughput acquisition buffer synchronized to ADC sampling clock via external controller. Use Value: Full-page burst mode delivers continuous 16-bit data streams at 332 MByte/s without gaps or wait states. |
Use Scenario: Storing digital stimulus/response vectors for semiconductor wafer probing with nanosecond timing resolution. IC Role / Device Role / Timing Role: Pattern memory mapped directly to FPGA logic, accessed with cycle-accurate read/write control. Use Value: Programmable mode register allows runtime adjustment of burst length to match test vector depth and timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16160J-6BLI | Same 16Mbit organization, 166 MHz, –40°C to +85°C, but uses TSOP-54 package and lacks VDDQ/VSSQ separation | Preferred where PCB space permits larger footprint and board-level noise control suffices | Choose IS42S16160J-6BLI only if VFBGA assembly capability is unavailable and thermal profile allows TSOP |
| MT48LC16M16A2P-6A:G | Identical speed grade and temperature range, but requires 3.3 V ± 0.3 V supply (no 2.7 V min) and has different AC timing parameters (e.g., tRCD = 20 ns vs. 18 ns) | Suitable for designs already using Micron's DDR SDRAM ecosystem and toolchain | Select MT48LC16M16A2P-6A:G when migrating from existing Micron-based platforms and tRCD margin is sufficient |
Compared with W9816G6JB-6I, IS42S16160J-6BLI trades VFBGA miniaturization and I/O rail isolation for TSOP manufacturability, while MT48LC16M16A2P-6A:G offers broader vendor support but tighter voltage tolerance and slightly relaxed timing margins.
Availability
W9816G6JB-6I is available at Aetrix Electronics and suitable for industrial HMI, network infrastructure, medical imaging, automated test equipment, and embedded control applications requiring stable component supply across extended temperature ranges.
Supply support for W9816G6JB-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, PSRAM, and SDRAM for embedded and industrial markets.
The W9816G6JB series targets cost-sensitive, reliability-critical applications needing industrial-grade SDRAM with simplified power architecture and robust command-set compatibility.
FAQ
What is the maximum operating frequency of the W9816G6JB-6I?
The W9816G6JB-6I is rated for up to 166 MHz operation with CAS Latency 3. This speed grade is validated across the full industrial temperature range (–40°C to +85°C) and requires compliance with tRCD ≥ 18 ns, tRP ≥ 18 ns, and tRC ≥ 42 ns as specified in the official Winbond datasheet revision A01.
Does the W9816G6JB-6I support both sequential and interleaved burst modes?
Yes, the W9816G6JB-6I supports both sequential and interleaved burst addressing modes, configured via the Mode Register Set command. The burst type selection directly affects column address sequencing during burst transfers and is essential for optimizing bandwidth in applications with predictable vs. scattered access patterns.
How does the W9816G6JB-6I handle power-down and self-refresh states?
The W9816G6JB-6I enters Power Down mode when CKE is driven low while all banks are idle, reducing dynamic power consumption. Self-Refresh mode is entered via a dedicated command (CS#, RAS#, CAS# low, WE# high) and maintains data integrity with ≤2 mA current draw, enabling long-duration retention without external refresh control.
What is the purpose of the LDQM and UDQM pins on the W9816G6JB-6I?
LDQM (Lower Data Queue Mask) and UDQM (Upper Data Queue Mask) provide byte-level write masking for the 16-bit DQ bus. When asserted high during a write cycle, each masks its respective 8-bit lane with zero latency; during reads, they place the corresponding output drivers in high-impedance state after CAS latency delay.
Can the W9816G6JB-6I be used as a direct replacement for the W9816G6JB-6?
No - while both share identical speed grade (166 MHz/CL3), the W9816G6JB-6I is qualified for –40°C to +85°C operation, whereas the W9816G6JB-6 is commercial-grade (0°C to +70°C). Substituting W9816G6JB-6I into a design originally specifying W9816G6JB-6 is safe; reverse substitution violates temperature specifications and may cause functional failure under cold conditions.
W9816G6JB-6I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- -
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-VFBGA (6.4x10.1)
W9816G6JB-6I FAQ
1.How can I place an order for W9816G6JB-6I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9816G6JB-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9816G6JB-6I reliable?
The price and inventory of W9816G6JB-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JB-6I is usually 5 days.
3.What payment methods are accepted for W9816G6JB-6I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JB-6I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9816G6JB-6I?
W9816G6JB-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9816G6JB-6I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9816G6JB-6I?
For technical support, including W9816G6JB-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JB-6I requirements.
6.How does Aetrix verify that W9816G6JB-6I is sourced from the original manufacturer or authorized distributors?
All W9816G6JB-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JB-6I meets industry standards.
7.What is the process for return or replacement of W9816G6JB-6I?
All W9816G6JB-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JB-6I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9816G6JB-6I part is unused and in its original packaging.
Return procedure for W9816G6JB-6I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9816G6JB-6I Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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Microchip Technology
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STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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