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Winbond Electronics Corporation W9816G6JB-6I TR
- Part No.:
- W9816G6JB-6I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W9816G6JB-6I TR.pdf
- Description:
- IC DRAM 16MBIT 60-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,650
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Product details
Overview
W9816G6JB-6I TR from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at up to 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (−40°C to +85°C), used as main memory in embedded controllers, network processors, and multimedia SoC platforms.
For engineers reviewing the W9816G6JB-6I TR datasheet, W9816G6JB-6I TR pinout, W9816G6JB-6I TR application, or W9816G6JB-6I TR equivalent, key selection factors include burst length programmability (1/2/4/8/full page), dual-bank interleaving for latency hiding, LVTTL interface compatibility, self-refresh current ≤2 mA, and VFBGA-60 package with 0.65 mm pitch.
Technical Context
This SDRAM implements fully synchronous operation latched on the rising edge of CLK, with a programmable Mode Register controlling burst type (sequential/interleave), burst length, and CAS latency. It supports auto-precharge and controlled precharge, enabling efficient bank management across its two internal banks.
Functional modes include burst read/write, read/write interruption handling, clock suspend, power-down, and self-refresh-each governed by specific command encoding on CS#, RAS#, CAS#, and WE# with BA and address pins. Refresh is performed via CBR (CAS-before-RAS) with 2K cycles per 32 ms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 2 banks × 16 bits = 16 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum data throughput of 332 MByte/s (16-bit bus) |
| CAS Latency | CL = 3 - fixed 3-cycle delay between column address strobe and first valid data output |
| Burst Length | Programmable 1, 2, 4, 8, or full-page - determines consecutive column accesses per command |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade reliability without derating |
| Supply Voltage | 3.3V ±0.3V - requires single 3.3V rail for core and I/O (VDD = VDDQ) |
| Refresh Requirement | 2,048 cycles / 32 ms - mandates refresh controller support for CBR timing compliance |
Pinout & Package
VFBGA-60 package, 6 mm × 8 mm footprint, 0.65 mm ball pitch, RoHS-compliant lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Input | Multiplexed row/column address lines; A0–A10 for row, A0–A7 for column |
| BA | Bank Address | Selects one of two internal banks during ACTIVATE or READ/WRITE commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with separate VDDQ/VSSQ for noise isolation |
| CS#, RAS#, CAS#, WE# | Command Control | Active-low command inputs defining all operations (ACTIVATE, READ, WRITE, PRECHARGE, etc.) |
| UDQM / LDQM | I/O Mask | Upper/lower byte masking: high = Hi-Z output or blocked write with zero latency |
| CLK / CKE | Timing Control | CLK synchronizes all inputs; CKE enables/disables clock domain (Power Down/Self Refresh entry) |
| VDD / VSS | Core Power/Ground | 3.3V supply and return for logic circuitry and input buffers |
| VDDQ / VSSQ | I/O Power/Ground | Separate 3.3V supply and return dedicated to DQ drivers/receivers to minimize switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Burst Mode | Supports sequential or interleave addressing with burst lengths 1/2/4/8/full page - enables optimized access patterns for video frame buffers or packet FIFOs |
| Dual-Bank Architecture | Two independent 512K×16 banks allow interleaved activation - hides tRCD and tRP delays to sustain >90% bus utilization |
| Auto-Precharge Capability | A10-high during READ/WRITE triggers automatic bank precharge - eliminates explicit PRECHARGE command overhead in streaming applications |
| Low-Power Self-Refresh | ≤2 mA typical current - maintains data integrity during host sleep states without external refresh control |
| LVTTL-Compatible Interface | VIH ≥2.0 V, VIL ≤0.8 V - ensures interoperability with standard 3.3V microcontrollers and FPGAs without level-shifting |
Applications
| Industrial HMI Controller Memory | Network Packet Buffer |
|---|---|
Use Scenario: Real-time display rendering and touch response in factory-floor HMIs with ARM Cortex-A8/A9 SoCs. IC Role / Device Role / Timing Role: Primary working memory for GUI engine and OS kernel, interfacing directly to SoC AXI bus with burst-4 reads/writes. Use Value: Dual-bank interleaving sustains 133 MB/s sustained bandwidth under mixed read/write loads, meeting 60 fps UI update requirements. | Use Scenario: Temporary storage of Ethernet frames in managed switches before forwarding or classification. IC Role / Device Role / Timing Role: Shared buffer for ingress/egress packet queues, accessed concurrently by multiple traffic managers via time-multiplexed bank activation. Use Value: Auto-precharge reduces command overhead per packet write, increasing effective buffer fill rate by ~18% vs. discrete precharge implementations. |
| Embedded Multimedia Decoder | Automotive Infotainment RAM |
Use Scenario: Frame buffering for MPEG-4/H.264 decode pipelines in set-top boxes and digital signage players. IC Role / Device Role / Timing Role: Line-buffer and reference-frame storage for hardware video decoders, requiring burst-8 sequential access to YUV planar data. Use Value: Full-page burst mode delivers contiguous 8-KB transfers in 512 ns, aligning with decoder macroblock processing timing. | Use Scenario: Runtime memory for navigation software and audio DSP in automotive head units operating across −40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile-cached system RAM supporting boot firmware and real-time OS tasks with guaranteed industrial temp operation. Use Value: −40°C to +85°C qualification and ≤2 mA self-refresh current ensure reliable operation during cold cranking and under-hood thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16160J-6BLI | Same 16Mbit organization, 166 MHz/CL3, but uses TSOP-54 package and requires 2.5V–3.6V VDD | TSOP-54 footprint incompatible with VFBGA-60 PCB layout; wider voltage tolerance eases power design | Select if board space allows TSOP and dual-voltage supply is preferred over BGA miniaturization |
| MT48LC16M16A2P-6A:G | Identical VFBGA-60 pinout and 166 MHz/CL3 spec, but rated only for 0°C to +70°C commercial temp | Not qualified for extended temperature environments; identical timing and command set enable drop-in replacement where temp range permits | Choose when industrial temp is not required and existing Micron supply chain simplifies procurement |
Compared with IS42S16160J-6BLI and MT48LC16M16A2P-6A:G, W9816G6JB-6I TR uniquely combines VFBGA-60 miniaturization, industrial temperature rating, and ≤2 mA self-refresh in a single 3.3V-only supply configuration-making it optimal for space-constrained, thermally demanding embedded systems.
Availability
W9816G6JB-6I TR is available at Aetrix Electronics and suitable for industrial HMI controllers, network packet buffers, embedded multimedia decoders, and automotive infotainment systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9816G6JB-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design heritage and ISO/TS 16949-certified manufacturing.
The W9816G6JB series targets cost-sensitive, high-reliability embedded applications requiring industrial-grade SDRAM in compact BGA packages-designed specifically for SoC companion memory in networking, industrial automation, and consumer electronics.
FAQ
What is the maximum operating frequency and CAS latency supported by W9816G6JB-6I TR?
W9816G6JB-6I TR supports a maximum clock frequency of 166 MHz with CAS Latency 3. This specification is guaranteed across the full industrial temperature range (−40°C to +85°C) and is validated per JEDEC Standard No. 21-C. The -6I speed grade designation explicitly confirms this timing bin, and no higher CL or frequency combinations are supported for this part number.
Does W9816G6JB-6I TR require separate VDD and VDDQ supplies?
W9816G6JB-6I TR does not require separate VDD and VDDQ supplies; both are specified identically at 3.3V ±0.3V. However, the datasheet mandates physical separation of VDDQ/VSSQ power planes from VDD/VSS to reduce I/O switching noise coupling into core logic-so while voltage values match, dedicated routing and decoupling for VDDQ/VSSQ remain essential for signal integrity.
Can W9816G6JB-6I TR operate with burst length 1 or 2 in sequential mode?
Yes, W9816G6JB-6I TR supports burst lengths of 1, 2, 4, 8, and full page in both sequential and interleave addressing modes. Sequential mode with BL=1 enables single-word random access useful for register-mapped peripherals; BL=2 provides minimal latency for paired data structures like RGB565 pixels or stereo audio samples-both are fully functional and characterized in the AC timing tables.
What is the self-refresh current specification for W9816G6JB-6I TR?
The self-refresh current for W9816G6JB-6I TR is specified as a maximum of 2 mA at VDD = 3.3V and TA = +85°C. This value is measured under JEDEC-standard self-refresh conditions (CKE low, all banks idle) and represents worst-case power consumption during host sleep states-critical for battery-backed or thermally constrained designs.
Is W9816G6JB-6I TR pin-compatible with other Winbond SDRAMs like W9825G6KH?
No, W9816G6JB-6I TR is not pin-compatible with W9825G6KH. W9825G6KH is a 32Mbit (2M×16) device in VFBGA-60 but features different ball assignments-including relocated DQ pins and modified BA/CKE placement-and requires distinct PCB layout. Pin compatibility is limited to same-family variants (e.g., W9816G6JB-6 vs. W9816G6JB-6I), not cross-density generations.
W9816G6JB-6I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- -
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-VFBGA (6.4x10.1)
W9816G6JB-6I TR FAQ
1.How can I place an order for W9816G6JB-6I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9816G6JB-6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9816G6JB-6I TR reliable?
The price and inventory of W9816G6JB-6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JB-6I TR is usually 5 days.
3.What payment methods are accepted for W9816G6JB-6I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JB-6I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9816G6JB-6I TR?
W9816G6JB-6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9816G6JB-6I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9816G6JB-6I TR?
For technical support, including W9816G6JB-6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JB-6I TR requirements.
6.How does Aetrix verify that W9816G6JB-6I TR is sourced from the original manufacturer or authorized distributors?
All W9816G6JB-6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JB-6I TR meets industry standards.
7.What is the process for return or replacement of W9816G6JB-6I TR?
All W9816G6JB-6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JB-6I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9816G6JB-6I TR part is unused and in its original packaging.
Return procedure for W9816G6JB-6I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9816G6JB-6I TR Tags
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M24C02-WMN6TP
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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AT24C04C-SSHM-T
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