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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9816G6JB-7I TR

Name: W9816G6JB-7I TR
Brand: Winbond Electronics Corporation
SKU: W9816G6JB-7I TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9816G6JB-7I TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 60-TFBGA

Datasheet:: W9816G6JB-7I TR.pdf

Description:: IC DRAM 16MBIT LVTTL 60VFBGA

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Product details

Overview

W9816G6JB-7I TR from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 143 MHz with CAS Latency 3, supporting industrial temperature range (−40°C to +85°C), LVTTL interface, and VFBGA-60 (0.65 mm pitch) packaging. It delivers up to 228.8 Mwords/s bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for embedded main memory in cost-sensitive industrial controllers and legacy display subsystems.

For engineers reviewing the W9816G6JB-7I TR datasheet, W9816G6JB-7I TR pinout, W9816G6JB-7I TR application, or W9816G6JB-7I TR equivalent, key selection considerations include its −40°C to +85°C industrial rating, 143 MHz / CL3 timing compliance, VFBGA-60 mechanical compatibility, self-refresh current ≤2 mA, and support for auto-precharge and interleaved bank access in resource-constrained SDRAM interfaces.

Technical Context

This SDRAM implements a dual-bank architecture with independent row activation and column access, enabling bank interleaving to hide tRCD and tRP delays. Its programmable Mode Register configures burst length (1–8, full page), burst type (sequential/interleave), and CAS latency (2 or 3), directly determining data throughput and latency trade-offs in real-time memory access patterns.

It uses LVTTL-compatible control and address signaling with separate VDDQ/VSSQ I/O power domains for noise immunity, supports both controlled and auto-precharge, and enters self-refresh mode via CKE-low assertion with WE high-requiring no external refresh controller during low-power hold states.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	524,288 words × 2 banks × 16 bits = 16 Mbit total capacity; enables 32-bit word access via two 16-bit devices or direct 16-bit bus interfacing.
Clock Frequency	143 MHz maximum; defines 6.99 ns clock period, constraining minimum tCK and governing maximum sustained read/write throughput.
CAS Latency	CL = 3 cycles; determines fixed read data valid delay from column command, critical for timing budget allocation in controller PHY design.
Burst Length	1, 2, 4, 8, or full page; selects sequential or interleave addressing per burst, directly impacting cache line fill efficiency and bus utilization.
Refresh Rate	2K cycles / 32 ms (64 ms refresh interval); mandates controller-initiated CBR commands every 64 ms to retain data integrity.
Supply Voltage	2.7 V–3.6 V for VDD and VDDQ; supports wide-input LDO or single-rail 3.3 V supply with ±0.3 V tolerance, easing power design in industrial environments.
Operating Temperature	−40°C to +85°C; qualified for extended-temperature industrial applications without derating, unlike commercial-grade −5/−6 variants.
Self-Refresh Current	≤2 mA; enables low-power retention during system sleep modes without external refresh, reducing standby power in battery-backed systems.

Pinout & Package

VFBGA-60 package with 0.65 mm ball pitch, RoHS-compliant lead-free construction. Ball grid arranged in 8×7 array with corner balls omitted; requires controlled-impedance PCB layout and standard BGA reflow profile.

Pin/Terminal	Circuit Role	Design Meaning
A0–A10	Address Input (multiplexed)	Row/column address lines shared across all banks; A0–A10 used for row (all), column (A0–A7), and mode register programming.
BA0–BA1	Bank Address	Selects one of two internal banks during ACTIVATE, READ, WRITE, or PRECHARGE commands; enables true bank interleaving.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes without read-modify-write overhead.
CS#, RAS#, CAS#, WE#	Command Control	Active-low command inputs decoded synchronously on CLK rising edge; define all operations including refresh, precharge, and mode register set.
CLK, CKE	Clock Interface	CLK provides synchronous edge sampling; CKE gates internal clock domain-low entry triggers Power Down or Self Refresh.
LDQM, UDQM	I/O Mask	Low-active masks lower/upper 8 bits of DQ bus during reads (Hi-Z output) or writes (data ignore), enabling precise byte-level access.
VDD, VSS, VDDQ, VSSQ	Power/Ground	Separate logic (VDD/VSS) and I/O (VDDQ/VSSQ) supplies reduce switching noise coupling into sensitive analog reference paths.

Key Features

Feature	Design Value
Industrial Temperature Rating	Guaranteed operation from −40°C to +85°C, eliminating thermal derating concerns in enclosed industrial enclosures or automotive under-hood proximity.
Programmable Burst & Latency	Mode Register allows runtime selection of burst length (1–8) and CAS latency (2 or 3), enabling optimization for deterministic latency (CL2) or bandwidth (BL8).
Auto-Precharge Support	Setting A10 high during READ/WRITE automatically initiates bank precharge after burst completion, reducing controller software overhead and improving page-hit efficiency.
Interleaved Bank Access	Concurrent activation of Bank 0 and Bank 1 permits back-to-back column accesses across banks, hiding tRCD and tRP delays to sustain >90% bus utilization.
LVTTL-Compatible Signaling	Meets JEDEC JESD8-15A voltage thresholds (VIH ≥2.0 V, VIL ≤0.8 V), ensuring interoperability with legacy FPGA I/O banks and microcontroller SDRAM controllers without level shifters.
Low-Power Self-Refresh	Enters autonomous refresh state with ≤2 mA current draw when CKE is held low and WE high, preserving data for hours without host intervention or clock input.

Applications

Industrial HMI Controllers	Legacy Display Frame Buffers
Use Scenario: Touchscreen-based human-machine interface running real-time OS with graphics overlay and data logging. IC Role / Device Role / Timing Role: Main system memory for CPU instruction/data and frame buffer storage; operates in interleaved bank mode to sustain pixel streaming while background tasks execute. Use Value: The −40°C to +85°C rating ensures reliable boot and operation in factory-floor cabinets; 143 MHz / CL3 timing meets display controller bandwidth requirements for 800×480 @ 60 Hz with alpha blending.	Use Scenario: Embedded LCD controller in medical diagnostic equipment requiring stable frame buffer memory with long service life. IC Role / Device Role / Timing Role: Dedicated 16-bit-wide frame buffer memory mapped to GPU DMA engine; configured for BL4 sequential bursts to match pixel packing alignment. Use Value: VFBGA-60 footprint minimizes PCB area vs. TSOP; self-refresh current ≤2 mA extends backup battery runtime during AC power loss without data corruption.
Network Edge Routers	Automated Test Equipment
Use Scenario: Packet buffering and lookup table storage in Layer 2/3 switching ASIC companion memory subsystem. IC Role / Device Role / Timing Role: Shared packet buffer memory accessed by multiple traffic managers; uses auto-precharge to minimize bank conflict stalls during bursty ingress/egress traffic. Use Value: Dual-bank architecture enables concurrent read (ingress queue) and write (egress queue) operations, increasing effective throughput by ~35% over single-bank SDR SDRAM.	Use Scenario: Waveform generation and capture memory in modular PXI chassis-based test instruments. IC Role / Device Role / Timing Role: High-reliability data acquisition buffer synchronized to precision clock source; configured for CL2 to minimize trigger-to-capture latency. Use Value: Industrial temperature qualification avoids thermal recalibration drift; 2.7–3.6 V supply range accommodates aging DC-DC converters in field-deployed units without brownout resets.

Industrial HMI Controllers

Legacy Display Frame Buffers

Use Scenario: Touchscreen-based human-machine interface running real-time OS with graphics overlay and data logging.

IC Role / Device Role / Timing Role: Main system memory for CPU instruction/data and frame buffer storage; operates in interleaved bank mode to sustain pixel streaming while background tasks execute.

Use Value: The −40°C to +85°C rating ensures reliable boot and operation in factory-floor cabinets; 143 MHz / CL3 timing meets display controller bandwidth requirements for 800×480 @ 60 Hz with alpha blending.

Use Scenario: Embedded LCD controller in medical diagnostic equipment requiring stable frame buffer memory with long service life.

IC Role / Device Role / Timing Role: Dedicated 16-bit-wide frame buffer memory mapped to GPU DMA engine; configured for BL4 sequential bursts to match pixel packing alignment.

Use Value: VFBGA-60 footprint minimizes PCB area vs. TSOP; self-refresh current ≤2 mA extends backup battery runtime during AC power loss without data corruption.

Network Edge Routers

Automated Test Equipment

Use Scenario: Packet buffering and lookup table storage in Layer 2/3 switching ASIC companion memory subsystem.

IC Role / Device Role / Timing Role: Shared packet buffer memory accessed by multiple traffic managers; uses auto-precharge to minimize bank conflict stalls during bursty ingress/egress traffic.

Use Value: Dual-bank architecture enables concurrent read (ingress queue) and write (egress queue) operations, increasing effective throughput by ~35% over single-bank SDR SDRAM.

Use Scenario: Waveform generation and capture memory in modular PXI chassis-based test instruments.

IC Role / Device Role / Timing Role: High-reliability data acquisition buffer synchronized to precision clock source; configured for CL2 to minimize trigger-to-capture latency.

Use Value: Industrial temperature qualification avoids thermal recalibration drift; 2.7–3.6 V supply range accommodates aging DC-DC converters in field-deployed units without brownout resets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-7BLI	Same 512K×2×16 organization, 143 MHz / CL3, VFBGA-60, −40°C to +85°C; differs in tRC (60 ns vs. 65 ns) and tRFC (120 ns vs. 130 ns).	Compatible pinout and timing; slightly tighter refresh cycle allows marginally higher sustained bandwidth in burst-heavy workloads.	Preferred where refresh controller timing margins are constrained; verify tRFC compliance in existing design before substitution.
MT48LC16M16A2P-75IT	16 Mbit, 143 MHz / CL3, TSOPII-54; commercial temp (0°C to +70°C) only; lacks VDDQ/VSSQ separation and has higher self-refresh current (3.5 mA).	Requires PCB redesign due to different package and thermal envelope; unsuitable for uncontrolled ambient deployments.	Only viable for cost-sensitive, temperature-stable lab or office environments where VFBGA rework is prohibitive.

Compared with W9816G6JB-7I TR, IS42S16100E-7BLI offers tighter timing margins for high-throughput buffering, while MT48LC16M16A2P-75IT trades industrial reliability for lower unit cost and simpler assembly-but cannot replace W9816G6JB-7I TR in extended-temperature applications without thermal validation.

Availability

W9816G6JB-7I TR is available at Aetrix Electronics and suitable for industrial HMI controllers, legacy display frame buffers, and network edge routers requiring stable component supply with guaranteed long-term availability and consistent parametric performance across production lots.

Supply support for W9816G6JB-7I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, PSRAM, and SDRAM products for industrial, automotive, and consumer markets.

The W9816G6JB series targets cost-optimized, pin-compatible SDRAM replacement in legacy embedded systems where industrial temperature range, LVTTL compatibility, and VFBGA packaging are mandatory design constraints.

FAQ

What is the maximum clock frequency supported by W9816G6JB-7I TR?

W9816G6JB-7I TR supports a maximum clock frequency of 143 MHz, corresponding to a 6.99 ns clock period. This speed grade is validated across the full industrial temperature range (−40°C to +85°C) and requires CL3 timing configuration. Operation above 143 MHz is not guaranteed and may result in data corruption or command decode failure.

Does W9816G6JB-7I TR require an external refresh controller?

W9816G6JB-7I TR requires periodic external refresh commands-specifically, 2,048 auto-refresh cycles must be completed every 32 ms (i.e., one refresh every 64 μs on average). While it supports self-refresh mode (with CKE low and WE high) for autonomous retention, normal active operation depends on the memory controller issuing CBR commands at the required rate.

Can W9816G6JB-7I TR operate with a 2.5 V supply?

No, W9816G6JB-7I TR does not support 2.5 V operation. Its specified VDD and VDDQ range is 2.7 V to 3.6 V. Supplying 2.5 V violates the absolute minimum rating and will cause unreliable command decoding, data corruption, or failure to initialize. A compliant 3.3 V ±0.3 V regulator is required.

What is the function of the LDQM and UDQM pins on W9816G6JB-7I TR?

LDQM (Lower Data Mask) and UDQM (Upper Data Mask) are active-low signals that control byte-level access on the 16-bit DQ bus. During reads, asserting either mask places the corresponding 8-bit segment in high-impedance state. During writes, asserting either mask blocks data transfer to that segment-enabling precise 8-bit updates without read-modify-write sequences in W9816G6JB-7I TR.

Is W9816G6JB-7I TR pin-compatible with W9816G6JB-6I TR?

Yes, W9816G6JB-7I TR is pin-compatible with W9816G6JB-6I TR and all other W9816G6JB speed grades (−5, −6, −6I, −7, −7I). They share identical VFBGA-60 ball map, signal definitions, and DC/AC electrical characteristics-only AC timing parameters (e.g., tAC, tRCD, tRP) differ per speed grade. System-level timing margin analysis is required when downgrading from −6I to −7I.

W9816G6JB-7I TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 60-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Not For New Designs

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 16Mbit

Memory Organization:: 1M x 16

Memory Interface:: LVTTL

Clock Frequency:: 143 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 60-VFBGA (6.4x10.1)

W9816G6JB-7I TR FAQ

1.How can I place an order for W9816G6JB-7I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9816G6JB-7I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9816G6JB-7I TR reliable?

The price and inventory of W9816G6JB-7I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JB-7I TR is usually 5 days.

3.What payment methods are accepted for W9816G6JB-7I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JB-7I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9816G6JB-7I TR?

W9816G6JB-7I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9816G6JB-7I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9816G6JB-7I TR?

For technical support, including W9816G6JB-7I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JB-7I TR requirements.

6.How does Aetrix verify that W9816G6JB-7I TR is sourced from the original manufacturer or authorized distributors?

All W9816G6JB-7I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JB-7I TR meets industry standards.

7.What is the process for return or replacement of W9816G6JB-7I TR?

All W9816G6JB-7I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JB-7I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9816G6JB-7I TR part is unused and in its original packaging.

Return procedure for W9816G6JB-7I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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