Winbond Electronics Corporation W9816G6JH-5
- Part No.:
- W9816G6JH-5
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 50-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9816G6JH-5.pdf
- Description:
- IC DRAM 16MBIT PAR 50TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9816G6JH-5 from Winbond Electronics is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at up to 200 MHz with CAS Latency 3, 3.3V ±0.3V supply, and TSOP II-50 package. It delivers 200M words/sec bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for embedded main memory in industrial controllers and legacy computing systems.
For engineers reviewing the W9816G6JH-5 datasheet, W9816G6JH-5 pinout, W9816G6JH-5 application, or W9816G6JH-5 equivalent, key selection criteria include its -5 speed grade (200MHz/CL3), 2-bank architecture enabling interleaved access, LVTTL interface compatibility, self-refresh current ≤2mA, and RoHS-compliant lead-free TSOP II packaging.
Technical Context
The W9816G6JH-5 implements a fully synchronous interface synchronized to CLK's rising edge, with command decoding controlled by CS, RAS, CAS, and WE. Its dual-bank architecture allows bank interleaving to hide precharge latency (tRP = 20 ns min), and programmable Mode Register configures burst type (sequential/interleave), length, and CAS latency.
It supports auto-precharge (A10 high during read/write), burst stop (for full-page bursts), and power management modes including Power Down (CKE low) and Self Refresh (CS/RAS/CAS/WE low, CKE low). All banks must be precharged before Mode Register Set, and eight Auto Refresh cycles are required post-initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Organization | 524,288 words × 2 banks × 16 bits - provides 16 Mbit total capacity with bank-level parallelism for reduced row activation overhead. |
| Max Clock Frequency | 200 MHz - enables 200M words/sec peak data rate at CL3 timing, meeting PC133 SDRAM standard compliance. |
| CAS Latency | CL = 3 - defines 3-clock-cycle delay between column address strobe and first valid data output in read bursts. |
| Burst Length | 1, 2, 4, 8, or full page - configurable via Mode Register to match sequential or interleave addressing patterns for optimal throughput. |
| Supply Voltage | 3.3V ± 0.3V - requires tightly regulated LVTTL-compatible supply; VDDQ separated from VDD for I/O noise immunity. |
| Refresh Rate | 2K cycles / 32 ms - mandates refresh every 15.625 µs per row; supports both auto-refresh and self-refresh modes. |
| Operating Temp | 0°C to 70°C - commercial-grade temperature range suitable for non-extended-environment embedded applications. |
| Self-Refresh Current | ≤2 mA - enables low-power retention during system suspend without external refresh controller intervention. |
Pinout & Package
Packaged in a 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with lead-free, RoHS-compliant construction. Pin pitch is 0.5 mm; body width is 10.16 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Input | Multiplexed row/column address lines; A0–A10 used for row address, A0–A7 for column address during latch. |
| BA | Bank Select | 2-bit input selecting one of two internal banks for activation or access during column operations. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; LDQM/UDQM control byte masking for partial writes and output tri-state during reads. |
| CS, RAS, CAS, WE | Command Control | Four active-low control signals defining all operations (activate, read, write, precharge, refresh) on CLK rising edge. |
| CLK, CKE | Clock Interface | CLK synchronizes all inputs; CKE gates clock domain - low enables Power Down, Self Refresh, or Clock Suspend modes. |
| VDD / VSS | Core Power/Ground | 3.3V supply and ground for logic circuitry and input buffers; separate VDDQ/VSSQ pins isolate I/O power for noise reduction. |
| UDQM / LDQM | I/O Mask | Upper/lower byte mask: high during read places DQ8–DQ15 or DQ0–DQ7 in Hi-Z; high during write blocks corresponding byte write. |
| NC | No Connect | Pins 33 and 37 are unconnected; must remain floating or tied to no-net - not usable for routing or termination. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Mode Register | Enables dynamic configuration of burst length, CAS latency, and burst type (sequential/interleave) without hardware change. |
| Interleaved Bank Access | Allows concurrent activation of both banks to overlap precharge time (tRP), increasing effective bandwidth in burst-intensive workloads. |
| Auto-Precharge Support | Automatically initiates bank precharge after burst completion when A10 is asserted, eliminating explicit precharge command overhead. |
| LVTTL-Compatible Interface | Meets JEDEC-standard voltage thresholds (VIH ≥2.0V, VIL ≤0.8V) for direct interfacing with 3.3V microcontrollers and FPGAs. |
| Low-Power Self-Refresh | Draws ≤2 mA during self-refresh mode, enabling extended battery-backed or low-power standby operation without external refresh logic. |
| RoHS-Compliant TSOP II | 50-pin surface-mount package with 0.5 mm pitch and 10.16 mm width - compatible with standard reflow profiles and automated assembly. |
Applications
| Industrial PLC Memory | Legacy Embedded Controller |
|---|---|
Use Scenario: Real-time data logging and program execution in programmable logic controllers requiring deterministic memory access and thermal stability. IC Role / Device Role / Timing Role: Primary working memory storing ladder logic variables, I/O image tables, and firmware stack under continuous 0°C–70°C operation. Use Value: Dual-bank interleaving reduces average access latency during cyclic scan execution; CL3 timing ensures predictable instruction fetch timing. | Use Scenario: Main memory in legacy x86-based single-board computers or communication gateways using SDR SDRAM interfaces. IC Role / Device Role / Timing Role: System RAM supporting BIOS initialization, OS boot, and application runtime with JEDEC-compliant 200MHz timing. Use Value: Full-page burst and auto-precharge minimize command overhead during DMA transfers; TSOP II footprint matches legacy PCB layouts. |
| Medical Diagnostic Display Buffer | Test Equipment Frame Store |
Use Scenario: Frame buffering for monochrome or grayscale medical imaging displays where data integrity and low standby power are critical. IC Role / Device Role / Timing Role: High-reliability display memory holding processed image frames prior to LCD controller readout. Use Value: Self-refresh current ≤2 mA enables safe retention during equipment idle periods; LVTTL interface ensures clean signal integrity over long traces. | Use Scenario: Acquisition buffer in automated test equipment capturing analog-to-digital samples at sustained high rates. IC Role / Device Role / Timing Role: High-throughput data capture memory accepting burst writes from ADC controllers and supporting sequential readout to host processor. Use Value: 200M words/sec bandwidth handles 16-bit @ 12.5 MSPS streams; burst length 8 optimizes FIFO efficiency for pipeline-aligned sampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-5BLI | Same 512K×2×16 organization, 200MHz/CL3, but uses 54-pin TSOP II and supports industrial temp (–40°C to 85°C). | Requires PCB layout change due to 54-pin footprint; suitable for extended-temp designs needing drop-in reliability upgrade. | Select if operating temperature exceeds 70°C or higher refresh margin is required. |
| MT48LC16M16A2P-6A | 16M×16 organization (256Mbit), 166MHz/CL2, 54-pin TSOP II; higher density but slower max speed and different timing parameters. | Not pin-compatible; requires redesign of address/control routing and timing validation for CL2 vs CL3 behavior. | Choose only when memory capacity >16 Mbit is mandatory and speed downgrade to 166MHz is acceptable. |
Compared with IS42S16100E-5BLI and MT48LC16M16A2P-6A, the W9816G6JH-5 offers exact pinout and timing compatibility with legacy 50-pin TSOP II SDRAM designs at 200MHz, while maintaining lower cost and simpler thermal management within its 0°C–70°C envelope.
Availability
W9816G6JH-5 is available at Aetrix Electronics and suitable for industrial PLC memory, legacy embedded controller platforms, medical diagnostic display buffers, and test equipment frame stores requiring stable component supply across multi-year production cycles.
Supply support for W9816G6JH-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and SDRAM products for industrial, communications, and consumer markets.
The W9816G6JH series belongs to Winbond's legacy SDR SDRAM product line, designed specifically for cost-sensitive, space-constrained embedded systems requiring JEDEC-compliant 3.3V SDRAM with proven reliability and long-lifecycle support.
FAQ
What is the maximum operating frequency and CAS latency supported by the W9816G6JH-5?
The W9816G6JH-5 is rated for a maximum clock frequency of 200 MHz with CAS Latency 3 (CL3). This timing is guaranteed across the full commercial temperature range (0°C to 70°C) and requires a 3.3V ±0.3V supply. The -5 speed grade designation explicitly confirms this performance binning, and CL3 defines the fixed 3-clock delay between column address assertion and first valid data output in read operations. No other CAS latency values are supported for the W9816G6JH-5 variant.
Does the W9816G6JH-5 support self-refresh mode, and what is its typical current draw?
Yes, the W9816G6JH-5 supports self-refresh mode, entered via the Self-Refresh Command (CS/RAS/CAS/WE low, CKE low on CLK rising edge). Its maximum self-refresh current is specified as 2 mA under standard operating conditions. This low current enables extended retention during system suspend without external refresh circuitry, making it suitable for battery-backed or energy-conscious embedded applications where memory state must persist with minimal power draw.
What package type and pin count does the W9816G6JH-5 use, and is it RoHS compliant?
The W9816G6JH-5 uses a 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with 0.5 mm pin pitch and 10.16 mm body width. It is manufactured using lead-free materials and fully complies with RoHS Directive 2011/65/EU. The package includes dedicated VDDQ/VSSQ pins for I/O power isolation, and pins 33 and 37 are marked NC (no connection) and must remain unconnected in PCB layout.
Can the W9816G6JH-5 be used interchangeably with other speed grades like -6 or -7 in the same design?
No - the W9816G6JH-5 is not interchangeable with -6 or -7 speed grades without timing validation. While pinout and basic functionality are identical, the -5 grade guarantees 200MHz/CL3 operation, whereas -6 supports only 166MHz/CL3 and -7 supports 143MHz/CL3. Using a slower grade may cause timing violations in a design optimized for 200MHz, and substituting -5 into a -6/-7 layout risks overdriving timing margins due to tighter setup/hold requirements. Always validate AC timing against the specific speed grade's datasheet.
What burst lengths and addressing modes does the W9816G6JH-5 support, and how are they configured?
The W9816G6JH-5 supports burst lengths of 1, 2, 4, 8, and full page, configurable via the Mode Register Set command. Burst type - sequential or interleave - is also set in the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2); interleave mode toggles address bits (e.g., A0, then A1, then A0+A1). Configuration requires all banks to be precharged and CKE high before issuing the Mode Register Set command with appropriate A0–A12 address inputs per the Mode Register table.
W9816G6JH-5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 50-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 50-TSOP II
W9816G6JH-5 FAQ
1.How can I place an order for W9816G6JH-5 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9816G6JH-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9816G6JH-5 reliable?
The price and inventory of W9816G6JH-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JH-5 is usually 5 days.
3.What payment methods are accepted for W9816G6JH-5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JH-5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9816G6JH-5?
W9816G6JH-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9816G6JH-5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9816G6JH-5?
For technical support, including W9816G6JH-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JH-5 requirements.
6.How does Aetrix verify that W9816G6JH-5 is sourced from the original manufacturer or authorized distributors?
All W9816G6JH-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JH-5 meets industry standards.
7.What is the process for return or replacement of W9816G6JH-5?
All W9816G6JH-5 units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JH-5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9816G6JH-5 part is unused and in its original packaging.
Return procedure for W9816G6JH-5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9816G6JH-5 Tags

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