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Winbond Electronics Corporation W9816G6JH-6
- Part No.:
- W9816G6JH-6
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 50-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9816G6JH-6.pdf
- Description:
- IC DRAM 16MBIT PAR 50TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:3,316
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Product details
Overview
W9816G6JH-6 from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and TSOP II-50 package. It delivers 332 MB/s peak bandwidth and supports burst lengths of 1/2/4/8/full page for embedded main memory in industrial controllers and legacy display subsystems.
For engineers reviewing the W9816G6JH-6 datasheet, W9816G6JH-6 pinout, W9816G6JH-6 application, or W9816G6JH-6 equivalent, key selection criteria include tRCD = 20 ns, tRP = 20 ns, self-refresh current ≤2 mA, LVTTL interface compatibility, and industrial-grade timing margin validation for 0°C to 70°C operation.
Technical Context
This SDRAM implements dual-bank interleaving to hide precharge latency and uses a programmable Mode Register to configure burst type (sequential/interleaved), burst length, and CAS latency. Its command decoder responds to standard LVTTL-level inputs (CS, RAS, CAS, WE, CKE, CLK) on rising clock edges.
It supports auto-precharge (A10 high during read/write), burst stop (for full-page bursts), and power-down mode via CKE gating. Refresh is managed via 2K cycles per 32 ms, with self-refresh enabled by holding CS/RAS/CAS low and CKE low.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 2 banks × 16 bits = 16 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum data transfer rate of 332 MB/s (166 MHz × 2 bytes) |
| CAS Latency | CL = 3 - fixed 3-cycle delay between column address strobe and first valid data output |
| tRCD / tRP | 20 ns - minimum Row-to-Column Delay and Precharge Time, constraining bank activation timing |
| Supply Voltage | 3.3 V ±0.3 V - requires stable LVTTL-compliant power rail; VDDQ separated for I/O noise immunity |
| Refresh Requirement | 2,048 cycles / 32 ms - mandates refresh controller support for 15.6 µs interval compliance |
| Operating Temperature | 0°C to 70°C - validated for commercial industrial applications without extended thermal derating |
Pinout & Package
W9816G6JH-6 is housed in a 50-pin, 400-mil TSOP II package with lead-free, RoHS-compliant construction. Pin layout follows JEDEC-standard SDRAM pinout for 16-bit data bus and dual-bank addressing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Input (multiplexed) | Row address (A0–A10) and column address (A0–A7); shared pins reduce package count |
| BA | Bank Select | 2-bit input selecting one of two internal banks for row activation or column access |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes |
| CS, RAS, CAS, WE | Command Control | Four active-low control signals decoded synchronously on CLK rising edge to execute operations |
| CLK, CKE | Timing Interface | CLK provides system synchronization; CKE enables/disables internal clock domain (power-down entry) |
| LDQM / UDQM | I/O Mask | Low-active masks lower/upper 8 bits of DQ bus during reads (Hi-Z) or blocks writes (zero-latency inhibit) |
| VDD / VSS | Core Power/Ground | Separate 3.3V supply and ground for logic circuitry; decoupling required near pins 1/25/26/50 |
| VDDQ / VSSQ | I/O Power/Ground | Isolated 3.3V supply and ground dedicated to DQ drivers to minimize switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Burst Length Programmability | Configurable 1/2/4/8/full-page bursts via Mode Register - enables optimization for sequential vs. random access patterns |
| Auto-Precharge Support | A10-driven automatic bank precharge after read/write - eliminates external precharge command overhead and reduces latency in pipelined access |
| Dual-Bank Interleaving | Independent activation of Bank #0 and Bank #1 - allows hiding tRP/tRCD delays during back-to-back accesses across banks |
| LVTTL-Compatible Interface | VIH ≥2.0 V, VIL ≤0.8 V - ensures interoperability with 3.3V microcontrollers, FPGAs, and ASICs without level-shifting |
| Self-Refresh Mode | ≤2 mA current draw with CKE low and CS/RAS/CAS low - maintains data integrity during host sleep without external refresh controller |
Applications
| Industrial HMI Display Controller | Legacy Network Router Buffer |
|---|---|
|
Use Scenario: Frame buffer storage for 800×480 TFT-LCD panel driven by ARM9-based SoC with limited external memory bandwidth. IC Role / Device Role / Timing Role: Primary SDRAM serving as pixel line buffer and GUI overlay memory; synchronized to 166 MHz system clock with CL3 timing. Use Value: Dual-bank interleaving enables concurrent refresh and display fetch, sustaining 332 MB/s throughput needed for 60 Hz video refresh without frame tearing. |
Use Scenario: Packet buffering in MIPS-based Layer 3 switch handling 10/100 Ethernet traffic with QoS queuing. IC Role / Device Role / Timing Role: Shared packet memory accessed by ingress/egress DMA engines; configured for burst length 4 and auto-precharge to minimize command overhead. Use Value: 20 ns tRCD/tRP allows sub-100 ns average access latency under burst traffic, supporting line-rate forwarding at 100 Mbps with <5% buffer contention. |
| Medical Diagnostic Imaging Module | Automotive Infotainment Head Unit |
|
Use Scenario: Temporary storage for ultrasound image frames captured at 30 fps before JPEG compression and storage to NAND. IC Role / Device Role / Timing Role: High-reliability frame buffer interfaced to FPGA-based image processor; operated within 0°C–70°C ambient range. Use Value: Self-refresh current ≤2 mA enables safe 10-second power-loss hold-up using backup capacitor, preserving last acquired frame during brownout. |
Use Scenario: Audio/video decode buffer in head unit running Linux-based IVI stack with HDMI output and Bluetooth A2DP streaming. IC Role / Device Role / Timing Role: Shared system memory for video decoder, audio DSP, and UI rendering engine; accessed via AXI bus bridge with LVTTL voltage translation. Use Value: TSOP II-50 package footprint matches legacy PCB layouts; 3.3V-only supply simplifies PMIC design versus DDR variants requiring 1.8V/2.5V rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS4C16M16SA-6TCN | Same 16Mbit organization, 166 MHz, CL3, but uses 54-pin TSOP II and supports 2.5V/3.3V dual supply | Requires PCB redesign for pinout and voltage rail; better suited for mixed-voltage systems | Select if migrating to newer-generation SDRAM with wider voltage tolerance and longer lifecycle availability |
| MT48LC16M16A2P-6A:L | Identical 16Mbit/166 MHz/CL3 spec, but Micron's part uses 54-pin TSOP II and has tighter tRC (60 ns vs. 65 ns) | Higher timing margin for demanding burst sequences; same temperature grade (0°C–70°C) | Choose when board-level timing closure requires stricter tRC compliance or when sourcing from Micron-authorized channels |
Compared with W9816G6JH-6, AS4C16M16SA-6TCN offers broader supply flexibility but demands layout changes, while MT48LC16M16A2P-6A:L delivers identical performance with tighter tRC for robust multi-burst operation-both require verification of pin compatibility and JEDEC timing margin alignment.
Availability
W9816G6JH-6 is available at Aetrix Electronics and suitable for industrial HMI display controllers, legacy network router buffers, medical diagnostic imaging modules, and automotive infotainment head units requiring stable component supply across extended production lifecycles.
Supply support for W9816G6JH-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design heritage.
W9816G6JH-6 belongs to Winbond's legacy SDR SDRAM product line, engineered for cost-sensitive, long-lifecycle industrial and embedded applications where pin-compatible upgrade paths and proven reliability outweigh DDR bandwidth gains.
FAQ
What is the maximum data bandwidth achievable with W9816G6JH-6?
W9816G6JH-6 achieves a peak data bandwidth of 332 MB/s, calculated as 166 MHz × 2 bytes per transfer (16-bit bus). This assumes continuous burst transfers with no command overhead, CL3 latency, and optimal bank interleaving. Real-world sustained bandwidth depends on access pattern, tRCD/tRP constraints, and refresh overhead.
Does W9816G6JH-6 support both sequential and interleaved burst modes?
Yes, W9816G6JH-6 supports both sequential and interleaved burst addressing modes, selected via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleaved mode toggles address bits (e.g., A0, A1, A2) for cache-friendly access patterns. The choice affects memory controller address generation logic.
Can W9816G6JH-6 operate outside the 0°C to 70°C temperature range?
No, W9816G6JH-6 is specified and tested only for 0°C to 70°C operation. The -6 suffix denotes commercial temperature grade; for extended range, Winbond offers the W9816G6JH-6I variant rated from -40°C to 85°C. Operating W9816G6JH-6 beyond its rated range may cause timing violations or data retention failure.
How does the auto-precharge function work on W9816G6JH-6?
Auto-precharge on W9816G6JH-6 is triggered by setting A10 high during a Read or Write command. This causes the SDRAM to initiate precharge automatically after the burst completes - for reads, precharge starts tCL cycles before burst end; for writes, it begins two clocks after final data-in (tWR + tRP). Auto-precharge is invalid for full-page bursts.
Is W9816G6JH-6 pin-compatible with other 50-pin TSOP II SDRAMs?
W9816G6JH-6 follows JEDEC-standard 50-pin TSOP II pinout for x16 SDRAMs, matching mechanical and signal mapping for industry-common parts like ISSI IS42S16100E-6BLI or older Samsung K4S281632F. However, electrical timing (e.g., tRCD, tRP) and Mode Register encoding must be verified per manufacturer datasheet before drop-in replacement.
W9816G6JH-6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 50-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 50-TSOP II
W9816G6JH-6 FAQ
1.How can I place an order for W9816G6JH-6 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9816G6JH-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9816G6JH-6 reliable?
The price and inventory of W9816G6JH-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JH-6 is usually 5 days.
3.What payment methods are accepted for W9816G6JH-6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JH-6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9816G6JH-6?
W9816G6JH-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9816G6JH-6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9816G6JH-6?
For technical support, including W9816G6JH-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JH-6 requirements.
6.How does Aetrix verify that W9816G6JH-6 is sourced from the original manufacturer or authorized distributors?
All W9816G6JH-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JH-6 meets industry standards.
7.What is the process for return or replacement of W9816G6JH-6?
All W9816G6JH-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JH-6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9816G6JH-6 part is unused and in its original packaging.
Return procedure for W9816G6JH-6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9816G6JH-6 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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