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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9816G6JH-6I

Name: W9816G6JH-6I
Brand: Winbond Electronics Corporation
SKU: W9816G6JH-6I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9816G6JH-6I

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 50-TSOP (0.400", 10.16mm Width)

Datasheet:: W9816G6JH-6I.pdf

Description:: IC DRAM 16MBIT PAR 50TSOP II

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W9816G6JH-6I from Winbond Electronics is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at up to 166 MHz with CAS Latency 3, supporting industrial temperature range (–40°C to +85°C), LVTTL interface, and auto-precharge functionality - deployed as main memory in embedded controllers, industrial HMIs, and legacy PC-compatible systems.

For engineers reviewing the W9816G6JH-6I datasheet, W9816G6JH-6I pinout, W9816G6JH-6I application, or W9816G6JH-6I equivalent, key selection considerations include its TSOP II-50 package, burst length programmability (1/2/4/8/full page), dual-bank interleaving capability, self-refresh current ≤2 mA, and compatibility with standard SDRAM controllers requiring CL3 timing at 166 MHz.

Technical Context

This SDRAM implements fully synchronous operation synchronized to the rising edge of CLK, with command decoding controlled by CS, RAS, CAS, and WE. It supports sequential and interleave burst addressing modes, programmable mode register configuration for burst length and latency, and bank-select logic via BA pins to enable concurrent access across two independent 512K-word banks.

Functional operation includes power-up initialization requiring precharge and eight auto-refresh cycles before mode register programming, plus support for critical low-power states: Self Refresh (CKE low, all banks idle), Power Down (CKE low during idle), and Clock Suspend (CKE low mid-burst). All timing adheres to JEDEC-standard SDRAM protocols including tRCD = 20 ns, tRP = 20 ns, and tRC = 60 ns for the -6I grade.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	524,288 words × 2 banks × 16 bits = 16 Mbit total capacity; enables dual-bank interleaving to hide precharge latency.
Max Clock Frequency	166 MHz (tCK = 6 ns); defines maximum data throughput of 332 MByte/s in burst-8 mode with 16-bit bus.
CAS Latency	CL = 3 cycles; determines fixed read data valid delay after column address strobe, critical for controller timing budget.
Burst Length	Programmable 1, 2, 4, 8, or full-page; allows optimization between bandwidth efficiency and address overhead per transaction.
Operating Temperature	–40°C to +85°C; validated for industrial environments without derating, unlike commercial-grade -6 variant.
Supply Voltage	3.0 V to 3.6 V (VDD/VDDQ); compatible with 3.3 V LVTTL I/O standards and noise margins per JEDEC specification.
Self-Refresh Current	≤2 mA; enables low-power retention during system sleep without external refresh controller intervention.
Package	50-pin TSOP II, 400 mil width, RoHS-compliant lead-free; surface-mount compatible with standard reflow profiles.

Pinout & Package

W9816G6JH-6I uses a 50-pin Thin Small Outline Package (TSOP II), 400 mil body width, with gull-wing leads and RoHS-compliant lead-free finish. Pin 1 is located at top-left corner when notch faces upward; pin numbering proceeds counterclockwise.

Pin/Terminal	Circuit Role	Design Meaning
A0–A10	Address Input (multiplexed)	Row/column address lines shared across banks; A0–A10 used for row, A0–A7 for column depending on command phase.
BA	Bank Address	Selects one of two internal banks during ACTIVATE, READ, or WRITE; enables true dual-bank interleaving.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes without read-modify-write.
CS, RAS, CAS, WE	Command Control	Four active-low control signals defining all operations (e.g., ACTIVATE = /CS+/RAS low, /CAS+/WE high).
CLK, CKE	Clock Interface	CLK synchronizes all inputs; CKE gates clock domain - low enables Power Down, Self Refresh, or Clock Suspend.
LDQM / UDQM	Data Mask	Low-active masks lower/upper 8 bits during write; places DQ outputs in Hi-Z during read to prevent bus contention.
VDD / VSS	Core Power / Ground	3.3 V supply for logic and input buffers; separate VDDQ/VSSQ pins isolate I/O power for improved signal integrity.
NC	No Connect	Pins 33 and 37 are unconnected internally; must be left floating or tied to ground per PCB layout best practice.

Key Features

Feature	Design Value
Dual-bank architecture	Enables interleaved access between Bank 0 and Bank 1, reducing effective latency by overlapping activate/precharge with read/write cycles.
Programmable burst mode	Supports sequential or interleave addressing for burst lengths 1/2/4/8/full page - configurable via Mode Register to match controller requirements.
Auto-precharge capability	Automatically initiates bank precharge after read/write completion when A10 = high, eliminating need for explicit PRECHARGE command in streaming applications.
LVTTL-compatible interface	Meets JEDEC JESD8-6 standard for 3.3 V logic levels, ensuring interoperability with FPGA, ASIC, and microcontroller SDRAM controllers.
Industrial temperature support	Guaranteed operation from –40°C to +85°C with no performance degradation, validated per JESD22-A108 thermal cycling spec.
Low-power self-refresh	Consumes ≤2 mA during Self Refresh mode, enabling extended battery-backed operation in portable or remote industrial devices.

Applications

Industrial HMI Memory	Legacy Embedded Controller RAM
Use Scenario: Touchscreen-based human-machine interface in factory automation panels requiring local frame buffer and application code storage. IC Role / Device Role / Timing Role: Primary SDRAM serving as display buffer and runtime memory for ARM9 or MIPS-based SoC with integrated SDRAM controller. Use Value: Dual-bank interleaving sustains >120 MB/s sustained bandwidth for 1024×768 RGB565 video updates while background tasks execute in parallel.	Use Scenario: Main memory in cost-sensitive industrial PLC modules using older-generation microcontrollers (e.g., NXP LPC2478) with native SDRAM interface. IC Role / Device Role / Timing Role: System RAM mapped directly into processor's external memory space; operates under CL3/166 MHz timing constraints. Use Value: Industrial temperature rating eliminates need for thermal derating or heatsinking in enclosed control cabinets with ambient temperatures up to 85°C.
Medical Diagnostic Device Buffer	Network Appliance Packet Buffer
Use Scenario: Real-time waveform acquisition and preprocessing in portable ECG or ultrasound units where deterministic memory access is required. IC Role / Device Role / Timing Role: High-speed buffer staging sensor data prior to DSP processing; relies on burst-4 reads with predictable tRCD/tRP timing. Use Value: Auto-precharge reduces command overhead per sample block, increasing effective throughput by ~18% versus manual precharge sequences.	Use Scenario: Temporary packet buffering in Ethernet-to-serial gateways handling Modbus TCP or PROFINET traffic in industrial networks. IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by MAC controller and host CPU via arbitration logic. Use Value: LDQM/UDQM byte masking enables efficient 1–4 byte header writes without corrupting adjacent packet payload bytes in same 16-bit word.

Industrial HMI Memory

Legacy Embedded Controller RAM

Use Scenario: Touchscreen-based human-machine interface in factory automation panels requiring local frame buffer and application code storage.

IC Role / Device Role / Timing Role: Primary SDRAM serving as display buffer and runtime memory for ARM9 or MIPS-based SoC with integrated SDRAM controller.

Use Value: Dual-bank interleaving sustains >120 MB/s sustained bandwidth for 1024×768 RGB565 video updates while background tasks execute in parallel.

Use Scenario: Main memory in cost-sensitive industrial PLC modules using older-generation microcontrollers (e.g., NXP LPC2478) with native SDRAM interface.

IC Role / Device Role / Timing Role: System RAM mapped directly into processor's external memory space; operates under CL3/166 MHz timing constraints.

Use Value: Industrial temperature rating eliminates need for thermal derating or heatsinking in enclosed control cabinets with ambient temperatures up to 85°C.

Medical Diagnostic Device Buffer

Network Appliance Packet Buffer

Use Scenario: Real-time waveform acquisition and preprocessing in portable ECG or ultrasound units where deterministic memory access is required.

IC Role / Device Role / Timing Role: High-speed buffer staging sensor data prior to DSP processing; relies on burst-4 reads with predictable tRCD/tRP timing.

Use Value: Auto-precharge reduces command overhead per sample block, increasing effective throughput by ~18% versus manual precharge sequences.

Use Scenario: Temporary packet buffering in Ethernet-to-serial gateways handling Modbus TCP or PROFINET traffic in industrial networks.

IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by MAC controller and host CPU via arbitration logic.

Use Value: LDQM/UDQM byte masking enables efficient 1–4 byte header writes without corrupting adjacent packet payload bytes in same 16-bit word.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same density (16 Mbit), 54-pin TSOP, CL3 @ 166 MHz, but requires 2.5 V core supply (VDD = 2.3–2.7 V) and supports only 3.3 V I/O (VDDQ).	Not drop-in due to different pinout (54-pin vs. 50-pin) and incompatible power domain separation; requires PCB redesign and voltage regulator change.	Select only if migrating to lower-core-voltage platform with compatible controller support for 2.5 V VDD.
MT48LC16M16A2P-6A:G	Identical organization and speed grade (166 MHz/CL3), 54-pin TSOP, but rated only for commercial temp (0°C to +70°C) and higher self-refresh current (≤4 mA).	Lacks industrial temperature validation; unsuitable for deployments exceeding 70°C ambient or requiring long-term reliability under thermal cycling.	Acceptable for cost-sensitive non-industrial designs where ambient stays within 0–70°C and board-level thermal management is assured.

Compared with W9816G6JH-6I, IS42S16100E-6BLI demands hardware-level voltage and layout changes, while MT48LC16M16A2P-6A:G sacrifices industrial qualification and power efficiency - making W9816G6JH-6I the sole option meeting full industrial SDRAM requirements in a 50-pin TSOP footprint.

Availability

W9816G6JH-6I is available at Aetrix Electronics and suitable for industrial HMIs, legacy embedded controllers, and medical diagnostic devices requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.

Supply support for W9816G6JH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, SLNAND, and legacy-compatible DRAM products for industrial and automotive markets.

The W9816G6JH series belongs to Winbond's industrial-grade SDRAM product line, designed specifically to replace obsolete Micron and Samsung SDR SDRAMs in long-lifecycle embedded systems requiring JEDEC-compliant timing and extended temperature support.

FAQ

What is the maximum operating frequency and CAS latency supported by W9816G6JH-6I?

W9816G6JH-6I supports a maximum clock frequency of 166 MHz with CAS Latency 3 (CL3), corresponding to a 6 ns clock period and fixed 3-cycle read data valid delay. This timing is guaranteed across the full industrial temperature range (–40°C to +85°C) and meets JEDEC Standard No. 10-2 for SDR SDRAM.

Does W9816G6JH-6I support auto-precharge, and how is it enabled?

Yes, W9816G6JH-6I supports auto-precharge. It is enabled by setting address pin A10 high during issuance of a READ or WRITE command. When activated, the SDRAM automatically begins precharging the accessed bank before burst completion, eliminating the need for a separate PRECHARGE command in streaming data applications.

What package type and pin count does W9816G6JH-6I use?

W9816G6JH-6I uses a 50-pin Thin Small Outline Package (TSOP II) with 400 mil body width and RoHS-compliant lead-free finish. Pin 1 is marked by a notch at the top-left corner; pin numbering follows standard counterclockwise convention, matching JEDEC MO-141AC mechanical specifications.

How does W9816G6JH-6I differ from the commercial-grade W9816G6JH-6?

W9816G6JH-6I differs from W9816G6JH-6 solely in its extended operating temperature range (–40°C to +85°C vs. 0°C to +70°C) and associated industrial qualification testing. Electrical specifications, pinout, timing parameters, and functional behavior are identical - making W9816G6JH-6I a direct drop-in replacement where environmental robustness is required.

Can W9816G6JH-6I operate with a 2.5 V supply voltage?

No, W9816G6JH-6I requires a 3.0 V to 3.6 V supply for both VDD and VDDQ. It is not compatible with 2.5 V core logic systems. The device is specified for 3.3 V LVTTL interface compliance and will not function reliably below 3.0 V, as confirmed by its Absolute Maximum Ratings and Recommended DC Operating Conditions tables.

W9816G6JH-6I Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 50-TSOP (0.400", 10.16mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 16Mbit

Memory Organization:: 1M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 50-TSOP II

W9816G6JH-6I FAQ

1.How can I place an order for W9816G6JH-6I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9816G6JH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9816G6JH-6I reliable?

The price and inventory of W9816G6JH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JH-6I is usually 5 days.

3.What payment methods are accepted for W9816G6JH-6I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JH-6I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9816G6JH-6I?

W9816G6JH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9816G6JH-6I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9816G6JH-6I?

For technical support, including W9816G6JH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JH-6I requirements.

6.How does Aetrix verify that W9816G6JH-6I is sourced from the original manufacturer or authorized distributors?

All W9816G6JH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JH-6I meets industry standards.

7.What is the process for return or replacement of W9816G6JH-6I?

All W9816G6JH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JH-6I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9816G6JH-6I part is unused and in its original packaging.

Return procedure for W9816G6JH-6I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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