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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9816G6JH-6I TR

Name: W9816G6JH-6I TR
Brand: Winbond Electronics Corporation
SKU: W9816G6JH-6I TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9816G6JH-6I TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 50-TSOP (0.400", 10.16mm Width)

Datasheet:: W9816G6JH-6I TR.pdf

Description:: IC DRAM 16MBIT PAR 50TSOP II

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W9816G6JH-6I TR from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (−40°C to +85°C). It delivers 332 million words/second bandwidth in burst-4 mode and supports auto-precharge, self-refresh, and interleaved bank access for high-efficiency memory subsystems in embedded controllers and legacy PC-compatible systems.

For engineers reviewing the W9816G6JH-6I TR datasheet, W9816G6JH-6I TR pinout, W9816G6JH-6I TR application, or W9816G6JH-6I TR equivalent, key selection criteria include its TSOP-II-50 package, LVTTL interface compatibility, 2K/32ms refresh requirement, burst length programmability (1–8), and industrial-grade thermal reliability without voltage derating.

Technical Context

This SDRAM implements a dual-bank architecture with independent row activation and column access, enabling true interleaved read/write operations across banks to hide tRCD and tRP delays. Its command decoder interprets RAS/CAS/WE/CS combinations on every CLK rising edge, supporting full synchronous operation including auto-precharge, burst stop, clock suspend, and power-down modes.

The device uses a programmable Mode Register to configure burst type (sequential/interleaved), burst length (1/2/4/8/full page), CAS latency (2 or 3), and write burst mode. Internal refresh counter executes 2,048 CBR cycles per 32 ms, and self-refresh current is specified at ≤2 mA - critical for low-power hold states in battery-backed or standby systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Organization	524,288 words × 2 banks × 16 bits = 16 Mbit total capacity
Max Clock Frequency	166 MHz - defines maximum data transfer rate of 332 MW/s in burst-4 mode
CAS Latency	CL = 3 - imposes 3-clock delay between column address strobe and first valid data output
Burst Length	Programmable 1, 2, 4, 8, or full-page - determines contiguous data fetch size per column address
Refresh Requirement	2,048 cycles / 32 ms - mandates external or internal refresh controller scheduling
Supply Voltage	3.3 V ± 0.3 V - requires stable LDO or regulator meeting ripple and transient specs per DC characteristics table
Operating Temperature	−40°C to +85°C - validated for industrial environments without derating
Interface Standard	LVTTL - compatible with 3.3V logic families; VIH ≥ 2.0 V, VIL ≤ 0.8 V

Pinout & Package

Packaged in 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with lead-free, RoHS-compliant construction. Pin pitch is 0.5 mm; body width is 10.16 mm.

Pin/Terminal	Circuit Role	Design Meaning
A0–A10	Address Input	Multiplexed row/column address lines; A0–A10 used for row, A0–A7 for column
BA	Bank Select	2-bit input selecting one of two internal banks during ACTIVATE or READ/WRITE
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; LDQM/UDQM control byte masking for partial writes
CS, RAS, CAS, WE	Command Control	Four active-low control signals defining all operations via truth table decoding on CLK edge
CLK, CKE	Timing Control	CLK synchronizes all inputs; CKE enables/disables clock domain - low enters power-down/self-refresh
LDQM / UDQM	I/O Mask	Low-active masks lower/upper 8 bits of DQ bus during reads (Hi-Z) or blocks writes (zero-latency inhibit)
VDD / VSS	Core Power/Ground	3.3V supply and return for logic circuitry and input buffers
VDDQ / VSSQ	I/O Power/Ground	Separate 3.3V supply/ground for output drivers - improves noise immunity and signal integrity

Key Features

Feature	Design Value
Interleaved Bank Access	Enables continuous data flow by alternating reads/writes between Bank 0 and Bank 1, hiding precharge time (tRP) and row activation delay (tRCD)
Programmable Burst Mode	Supports sequential or interleave addressing per burst - optimizes cache-line alignment and DMA efficiency in host controllers
Auto-Precharge	Automatically initiates bank precharge after burst completion when A10 = HIGH, reducing software overhead and command bus contention
Self-Refresh Mode	Enters ultra-low-power state (≤2 mA) with internal refresh counter active - maintains data without external clock or controller intervention
Industrial Temperature Range	Guaranteed operation from −40°C to +85°C with no voltage or timing derating - suitable for automotive infotainment and industrial HMIs
LVTTL-Compatible Interface	Meets JEDEC JESD8-12E input thresholds and drive strength - interoperable with FPGA, MCU, and ASIC memory controllers without level shifters

Applications

Industrial HMI Systems	Legacy PC-Compatible Controllers
Use Scenario: Touchscreen-based human-machine interface in factory automation panels requiring local frame buffer and firmware storage. IC Role / Device Role / Timing Role: Main system memory for ARM9 or MIPS-based SoC, providing 16-bit wide data path for graphics rendering and real-time OS execution. Use Value: Dual-bank interleaving sustains >90% bus utilization during video refresh; industrial temp rating ensures reliability in uncooled enclosures.	Use Scenario: Memory expansion for x86-compatible single-board computers (SBCs) running DOS or lightweight Linux in test equipment. IC Role / Device Role / Timing Role: Drop-in replacement for older SDRAM modules in ISA/PCI-based memory controllers with fixed CL3 timing. Use Value: Pin- and timing-compatible with industry-standard -6I speed grade; supports burst-4/8 modes required by legacy BIOS memory initialization routines.
Embedded Network Gateways	Medical Diagnostic Devices
Use Scenario: Protocol translation gateway aggregating Modbus, CAN, and Ethernet traffic with local packet buffering and configuration storage. IC Role / Device Role / Timing Role: Shared RAM for packet FIFOs and runtime parameter tables accessed concurrently by multiple peripherals. Use Value: Auto-precharge reduces command overhead during burst-heavy network stack operations; self-refresh preserves configuration during power-loss events.	Use Scenario: Portable ultrasound or ECG analyzers requiring deterministic memory access for real-time signal processing and display buffering. IC Role / Device Role / Timing Role: Low-latency working memory for DSP co-processors, synchronized to master clock via CLK/CKE handshake. Use Value: CL3 timing guarantees predictable 3-cycle read latency critical for pipeline-constrained FIR filter kernels; −40°C to +85°C rating covers clinical and field-deployed use cases.

Industrial HMI Systems

Legacy PC-Compatible Controllers

Use Scenario: Touchscreen-based human-machine interface in factory automation panels requiring local frame buffer and firmware storage.

IC Role / Device Role / Timing Role: Main system memory for ARM9 or MIPS-based SoC, providing 16-bit wide data path for graphics rendering and real-time OS execution.

Use Value: Dual-bank interleaving sustains >90% bus utilization during video refresh; industrial temp rating ensures reliability in uncooled enclosures.

Use Scenario: Memory expansion for x86-compatible single-board computers (SBCs) running DOS or lightweight Linux in test equipment.

IC Role / Device Role / Timing Role: Drop-in replacement for older SDRAM modules in ISA/PCI-based memory controllers with fixed CL3 timing.

Use Value: Pin- and timing-compatible with industry-standard -6I speed grade; supports burst-4/8 modes required by legacy BIOS memory initialization routines.

Embedded Network Gateways

Medical Diagnostic Devices

Use Scenario: Protocol translation gateway aggregating Modbus, CAN, and Ethernet traffic with local packet buffering and configuration storage.

IC Role / Device Role / Timing Role: Shared RAM for packet FIFOs and runtime parameter tables accessed concurrently by multiple peripherals.

Use Value: Auto-precharge reduces command overhead during burst-heavy network stack operations; self-refresh preserves configuration during power-loss events.

Use Scenario: Portable ultrasound or ECG analyzers requiring deterministic memory access for real-time signal processing and display buffering.

IC Role / Device Role / Timing Role: Low-latency working memory for DSP co-processors, synchronized to master clock via CLK/CKE handshake.

Use Value: CL3 timing guarantees predictable 3-cycle read latency critical for pipeline-constrained FIR filter kernels; −40°C to +85°C rating covers clinical and field-deployed use cases.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same 512K×2×16 organization, 166 MHz/CL3, TSOP-54 package (54-pin vs. 50-pin); higher IDD2 current (55 mA vs. 45 mA typical)	Requires PCB layout change due to different pin count and DQ/DQM placement; identical timing and command set	Select if existing design uses ISSI's qualification ecosystem or requires extended voltage margin (2.5–3.6 V)
MT48LC16M16A2P-6A:G	Same density, speed, and CL; 54-pin TSOP-I package; tighter tRC spec (60 ns vs. 66 ns), lower self-refresh current (1.5 mA)	Not pin-compatible - different pinout (e.g., CKE position, VDD/VSS distribution); requires schematic and layout revision	Choose for higher reliability in long-life medical deployments where Micron's 10-year longevity program applies

Compared with IS42S16100E-6BLI and MT48LC16M16A2P-6A:G, W9816G6JH-6I TR offers direct pin compatibility in 50-pin TSOP-II footprint, guaranteed industrial temperature support without voltage scaling, and optimized power delivery via separate VDDQ/VSSQ rails - making it ideal for cost-sensitive, drop-in legacy upgrades.

Availability

W9816G6JH-6I TR is available at Aetrix Electronics and suitable for industrial HMI systems, legacy PC-compatible controllers, embedded network gateways, and medical diagnostic devices requiring stable component supply across extended product lifecycles.

Supply support for W9816G6JH-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design heritage and ISO/TS 16949-certified manufacturing.

The W9816G6JH series belongs to Winbond's industrial-grade SDR SDRAM product line, engineered for cost-effective, pin-compatible memory upgrades in legacy computing and embedded platforms where DDR migration is impractical.

FAQ

What is the maximum supported clock frequency for W9816G6JH-6I TR?

The W9816G6JH-6I TR is rated for operation up to 166 MHz with CAS Latency 3. This speed grade is validated across the full industrial temperature range (−40°C to +85°C) under 3.3 V ± 0.3 V supply conditions. The device will not meet timing specifications above this frequency, and exceeding 166 MHz may result in data corruption or command decode failure. Always observe tAC, tCAC, and tRC timing constraints from the AC characteristics table when designing the memory controller interface for W9816G6JH-6I TR.

Does W9816G6JH-6I TR support both sequential and interleaved burst addressing modes?

Yes, W9816G6JH-6I TR supports both sequential and interleaved burst addressing, controlled via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2…), while interleaved mode toggles address bits A0–A2 based on burst length - optimizing cache-line access patterns for specific host architectures. The mode is selected during Mode Register Set (MRS) command and remains active until reprogrammed. Both modes are fully functional at 166 MHz/CL3 and require no hardware changes to enable.

How many refresh cycles does W9816G6JH-6I TR require, and how is refresh managed?

W9816G6JH-6I TR requires 2,048 refresh cycles per 32 ms, corresponding to one cycle every 15.625 µs. Refresh can be performed using either external CBR (CAS-before-RAS) commands issued by the memory controller, or internally via self-refresh mode when CKE is held low. In self-refresh, the device maintains data integrity autonomously with ≤2 mA current draw. The refresh interval must be strictly maintained - missing a cycle risks data retention failure. W9816G6JH-6I TR does not support hidden refresh or auto-refresh during active bank access.

Can W9816G6JH-6I TR be used with a 2.5V-only memory controller?

No, W9816G6JH-6I TR requires a 3.3 V ± 0.3 V supply for VDD and VDDQ and is not compatible with 2.5 V logic interfaces. Its input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and output drive strength are specified only for 3.3 V operation. Using it with a 2.5 V controller would violate VIH min and risk unreliable command decoding. For 2.5 V systems, consider Winbond's W9825G6KH series or other 2.5 V SDRAM alternatives - W9816G6JH-6I TR must be paired with a 3.3 V-compatible controller.

What is the function of LDQM and UDQM pins on W9816G6JH-6I TR?

LDQM (Lower Data Queue Mask) and UDQM (Upper Data Queue Mask) are byte-enable controls for the 16-bit DQ bus on W9816G6JH-6I TR. During reads, asserting either signal high places the corresponding 8-bit segment (DQ0–7 or DQ8–15) in high-impedance state after 2-clock latency. During writes, asserting high blocks data latching for that byte group with zero latency. This enables partial-word writes without read-modify-write cycles - essential for efficient register-level updates and mixed-endian data handling in microcontroller-based systems using W9816G6JH-6I TR.

W9816G6JH-6I TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 50-TSOP (0.400", 10.16mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Not For New Designs

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 16Mbit

Memory Organization:: 1M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 50-TSOP II

W9816G6JH-6I TR FAQ

1.How can I place an order for W9816G6JH-6I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9816G6JH-6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9816G6JH-6I TR reliable?

The price and inventory of W9816G6JH-6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JH-6I TR is usually 5 days.

3.What payment methods are accepted for W9816G6JH-6I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JH-6I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9816G6JH-6I TR?

W9816G6JH-6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9816G6JH-6I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9816G6JH-6I TR?

For technical support, including W9816G6JH-6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JH-6I TR requirements.

6.How does Aetrix verify that W9816G6JH-6I TR is sourced from the original manufacturer or authorized distributors?

All W9816G6JH-6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JH-6I TR meets industry standards.

7.What is the process for return or replacement of W9816G6JH-6I TR?

All W9816G6JH-6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JH-6I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9816G6JH-6I TR part is unused and in its original packaging.

Return procedure for W9816G6JH-6I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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