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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9816G6JH-7I

Name: W9816G6JH-7I
Brand: Winbond Electronics Corporation
SKU: W9816G6JH-7I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9816G6JH-7I

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 50-TSOP (0.400", 10.16mm Width)

Datasheet:: W9816G6JH-7I.pdf

Description:: IC DRAM 16MBIT LVTTL 50TSOP II

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Product details

Overview

W9816G6JH-7I from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 143 MHz with CAS Latency 3, 2.7–3.6 V supply, and industrial temperature range (−40°C to +85°C), used as main memory in embedded controllers, industrial HMIs, and legacy PC-compatible systems requiring LVTTL-compatible SDRAM.

For engineers reviewing the W9816G6JH-7I datasheet, W9816G6JH-7I pinout, W9816G6JH-7I application, or W9816G6JH-7I equivalent, key selection criteria include burst length programmability (1/2/4/8/full page), auto-precharge support, dual-bank interleaving capability, and TSOP-II 50-pin package compatibility with legacy SDRAM controllers.

Technical Context

This SDRAM implements fully synchronous operation latched on the rising edge of CLK, with a programmable Mode Register controlling burst type (sequential/interleave), burst length, and CAS latency. It supports bank activate/read/write/precharge/self-refresh/power-down commands via LVTTL-level control signals (CS, RAS, CAS, WE, CKE).

Its dual-bank architecture enables interleaved access to hide precharge delays, while internal column counters generate sequential or interleaved burst addresses. The device requires eight auto-refresh cycles after power-up initialization and supports both controlled and auto-precharge modes with tRCD = 20 ns, tRP = 20 ns, and tRC = 60 ns at 143 MHz.

Key Specifications

Parameter	Value and Actual Design Meaning
Organization	512K words × 2 banks × 16 bits = 16 Mbit total density; supports 16-bit data bus interface without external width expansion.
Max Clock Frequency	143 MHz; defines maximum system bus speed for sustained burst transfers in industrial temperature range.
CAS Latency	CL = 3; fixed read access latency of 3 clock cycles from column command to first valid DQ output.
Burst Length	Programmable 1, 2, 4, 8, or full-page; determines number of consecutive column accesses per read/write command.
Supply Voltage	2.7 V to 3.6 V; compatible with 3.3 V logic systems and tolerant of ±0.3 V noise margins on inputs.
Operating Temperature	−40°C to +85°C; qualified for industrial environments without derating or thermal management overhead.
Refresh Requirement	2K cycles / 32 ms; mandates minimum refresh rate to retain data integrity during active or self-refresh operation.

Pinout & Package

W9816G6JH-7I is housed in a 50-pin, 400-mil TSOP II package with lead-free, RoHS-compliant construction. Pin assignments follow JEDEC-standard SDRAM layout for drop-in compatibility with existing 16-bit SDRAM footprints.

Pin/Terminal	Circuit Role	Design Meaning
A0–A10	Address Input	Multiplexed row/column address lines; A0–A10 used for row address, A0–A7 for column address.
BA	Bank Select	Selects one of two internal banks during activate or column command; enables bank interleaving.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes.
CS, RAS, CAS, WE	Command Control	Four active-low control signals defining all operations (activate, read, write, precharge, refresh) on CLK rising edge.
CLK, CKE	Clock Interface	CLK synchronizes all inputs; CKE gates internal clock-low enables power-down, self-refresh, or suspend modes.
LDQM / UDQM	Data Mask	Low-active masks lower/upper 8 bits of DQ bus during writes or places outputs in Hi-Z during reads (latency = 2).
VDD / VSS	Core Power/Ground	2.7–3.6 V supply for logic and input buffers; separate VDDQ/VSSQ pins isolate I/O power for noise immunity.
NC	No Connect	Pins 33 and 37 are unconnected; must be left floating or tied to ground per PCB design rules.

Key Features

Feature	Design Value
Programmable Burst Mode	Supports sequential or interleave addressing with burst lengths 1/2/4/8/full page-enables optimization for streaming vs. random-access workloads.
Dual-Bank Interleaving	Enables back-to-back read/write operations across banks, hiding tRP and tRCD delays to sustain >90% bus utilization.
Auto-Precharge	Automatically initiates bank precharge after burst completion when A10 = high; eliminates explicit precharge command overhead in pipelined access.
Industrial Temp Support	Guaranteed operation from −40°C to +85°C with no timing derating-suitable for uncontrolled ambient deployments.
LVTTL-Compatible Interface	Meets JEDEC JESD8-12E voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V); interoperable with standard 3.3 V microcontrollers and FPGAs.

Applications

Industrial HMI Memory	Legacy PC BIOS Storage
Use Scenario: Touchscreen-based human-machine interface in factory automation panels with real-time display buffering and firmware update storage. IC Role / Device Role / Timing Role: Primary working memory for ARM9/Cortex-M7 MCU executing GUI rendering and protocol stacks; provides burst-mode pixel data transfer to display controller. Use Value: Dual-bank interleaving sustains 143 MHz bandwidth for 800×480@60 Hz frame buffering; industrial temp rating ensures reliability in non-climate-controlled enclosures.	Use Scenario: Non-volatile shadow RAM for BIOS/UEFI code execution in legacy x86 industrial motherboards using SDR SDRAM controllers. IC Role / Device Role / Timing Role: Main system memory mapped to CPU address space; initialized by chipset during POST and used for runtime code/data storage. Use Value: CL3 timing and 143 MHz clock meet Intel 440BX chipset requirements; TSOP-II footprint matches existing PCB layouts for drop-in replacement.
Embedded Network Appliance	Medical Diagnostic Display Buffer
Use Scenario: Packet buffering and session table storage in fanless Ethernet gateways deployed in transportation infrastructure. IC Role / Device Role / Timing Role: Shared memory resource for network stack and packet classification engine; accessed concurrently by CPU and DMA engines. Use Value: Auto-precharge reduces command overhead during high-throughput TCP/IP processing; 2K/32 ms refresh satisfies JEDEC SDRAM retention spec under continuous operation.	Use Scenario: Real-time image frame buffer in portable ultrasound devices requiring deterministic latency and EMI-resilient memory interface. IC Role / Device Role / Timing Role: Dedicated video memory for FPGA-based image pipeline; receives raw ADC data and feeds processed frames to LCD controller. Use Value: Separate VDDQ/VSSQ rails minimize switching noise coupling into analog front-end; LVTTL signaling ensures clean signal integrity at 143 MHz over 4-layer PCB traces.

Industrial HMI Memory

Legacy PC BIOS Storage

Use Scenario: Touchscreen-based human-machine interface in factory automation panels with real-time display buffering and firmware update storage.

IC Role / Device Role / Timing Role: Primary working memory for ARM9/Cortex-M7 MCU executing GUI rendering and protocol stacks; provides burst-mode pixel data transfer to display controller.

Use Value: Dual-bank interleaving sustains 143 MHz bandwidth for 800×480@60 Hz frame buffering; industrial temp rating ensures reliability in non-climate-controlled enclosures.

Use Scenario: Non-volatile shadow RAM for BIOS/UEFI code execution in legacy x86 industrial motherboards using SDR SDRAM controllers.

IC Role / Device Role / Timing Role: Main system memory mapped to CPU address space; initialized by chipset during POST and used for runtime code/data storage.

Use Value: CL3 timing and 143 MHz clock meet Intel 440BX chipset requirements; TSOP-II footprint matches existing PCB layouts for drop-in replacement.

Embedded Network Appliance

Medical Diagnostic Display Buffer

Use Scenario: Packet buffering and session table storage in fanless Ethernet gateways deployed in transportation infrastructure.

IC Role / Device Role / Timing Role: Shared memory resource for network stack and packet classification engine; accessed concurrently by CPU and DMA engines.

Use Value: Auto-precharge reduces command overhead during high-throughput TCP/IP processing; 2K/32 ms refresh satisfies JEDEC SDRAM retention spec under continuous operation.

Use Scenario: Real-time image frame buffer in portable ultrasound devices requiring deterministic latency and EMI-resilient memory interface.

IC Role / Device Role / Timing Role: Dedicated video memory for FPGA-based image pipeline; receives raw ADC data and feeds processed frames to LCD controller.

Use Value: Separate VDDQ/VSSQ rails minimize switching noise coupling into analog front-end; LVTTL signaling ensures clean signal integrity at 143 MHz over 4-layer PCB traces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16160J-7TLI	Same 512K×2×16 organization, 143 MHz, CL3, TSOP-54; higher IDD current (40 mA vs. 25 mA typical), different pinout (54-pin vs. 50-pin).	Requires PCB redesign due to 54-pin TSOP-II footprint and relocated VDD/VSS pins; not pin-compatible.	Select only if board revision allows footprint change and higher power budget is acceptable.
MT48LC16M16A2P-75:C	16M×16, 133 MHz, CL3, 54-pin TSOP; tighter tAC (5.5 ns vs. 6.0 ns), wider temp range (−40°C to +85°C), but slower max frequency.	Marginally lower bandwidth; requires timing validation for 143 MHz operation; incompatible pin mapping for DQ/CKE/CLK.	Consider for cost-sensitive designs where 133 MHz suffices and migration path to newer Micron platforms exists.

Compared with IS42S16160J-7TLI and MT48LC16M16A2P-75:C, W9816G6JH-7I offers identical density and speed grade in a compact 50-pin TSOP-II package with lower active current and native pinout compatibility for legacy Winbond-based designs-making it optimal for direct replacement in field-deployed industrial hardware.

Availability

W9816G6JH-7I is available at Aetrix Electronics and suitable for industrial HMIs, legacy PC BIOS modules, and embedded network appliances requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W9816G6JH-7I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontroller solutions, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.

W9816G6JH-7I belongs to Winbond's legacy SDR SDRAM product line, designed specifically for cost-sensitive, long-lifecycle industrial and embedded applications where JEDEC-compliant 16-bit SDRAM performance and industrial temperature support are essential.

FAQ

What is the maximum operating frequency of the W9816G6JH-7I?

The W9816G6JH-7I is rated for a maximum clock frequency of 143 MHz at CAS Latency 3 under industrial temperature conditions (−40°C to +85°C). This specification is validated per AC timing parameters in the official datasheet, including tAC = 6.0 ns and tRCD = 20 ns. Operation above 143 MHz is not guaranteed and may result in data corruption or timing violations. The W9816G6JH-7I achieves this speed while maintaining full compliance with JEDEC SDRAM standards for command decoding and burst behavior.

Does the W9816G6JH-7I support auto-precharge functionality?

Yes, the W9816G6JH-7I supports auto-precharge: when A10 is driven high during a Read or Write command, the device automatically initiates precharge of the accessed bank after burst completion. This eliminates the need for a separate Precharge command in pipelined access sequences. The W9816G6JH-7I enforces tDAL = tWR + tRP (Data-in to Active delay) before reactivating the bank, ensuring reliable operation. Auto-precharge is disabled for full-page burst mode per datasheet restriction.

What package type and pin count does the W9816G6JH-7I use?

The W9816G6JH-7I uses a 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with lead-free, RoHS-compliant construction. Its pin layout follows JEDEC-standard SDRAM pinout for 16-bit data width, including dedicated VDDQ/VSSQ rails for I/O noise isolation. The W9816G6JH-7I is not compatible with 54-pin TSOP packages due to differing pin counts, spacing, and power pin locations-PCB footprint must match the 50-pin configuration exactly.

Can the W9816G6JH-7I operate at 3.3 V supply voltage?

Yes, the W9816G6JH-7I operates within a recommended DC supply range of 2.7 V to 3.6 V, making 3.3 V its nominal operating voltage. At 3.3 V, all AC and DC specifications-including tRCD, tRP, and IDD-meet datasheet limits across the full industrial temperature range. The W9816G6JH-7I's LVTTL-compatible inputs (VIH ≥ 2.0 V, VIL ≤ 0.8 V) ensure robust interfacing with standard 3.3 V logic families without level-shifting circuitry.

What is the refresh requirement for the W9816G6JH-7I?

The W9816G6JH-7I requires 2,048 refresh cycles every 32 ms to maintain data integrity, equivalent to one refresh command every 15.625 µs. This is implemented via CBR (CAS-before-RAS) auto-refresh commands issued by the memory controller. The W9816G6JH-7I supports both auto-refresh and self-refresh modes; in self-refresh, the internal oscillator maintains timing without external clock input, drawing only 2 mA typical current. Failure to meet the 32 ms window risks data loss.

W9816G6JH-7I Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 50-TSOP (0.400", 10.16mm Width)

Packaging:: Tray

Product Status:: Not For New Designs

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 16Mbit

Memory Organization:: 1M x 16

Memory Interface:: LVTTL

Clock Frequency:: 143 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 50-TSOP II

W9816G6JH-7I FAQ

1.How can I place an order for W9816G6JH-7I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9816G6JH-7I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9816G6JH-7I reliable?

The price and inventory of W9816G6JH-7I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JH-7I is usually 5 days.

3.What payment methods are accepted for W9816G6JH-7I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JH-7I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9816G6JH-7I?

W9816G6JH-7I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9816G6JH-7I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9816G6JH-7I?

For technical support, including W9816G6JH-7I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JH-7I requirements.

6.How does Aetrix verify that W9816G6JH-7I is sourced from the original manufacturer or authorized distributors?

All W9816G6JH-7I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JH-7I meets industry standards.

7.What is the process for return or replacement of W9816G6JH-7I?

All W9816G6JH-7I units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JH-7I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9816G6JH-7I part is unused and in its original packaging.

Return procedure for W9816G6JH-7I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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