Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W9816G6JH-7I TR

Part No.:
W9816G6JH-7I TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
50-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9816G6JH-7I TR.pdf
Description:
IC DRAM 16MBIT LVTTL 50TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,910

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W9816G6JH-7I TR from Winbond is a 512K × 2 banks × 16-bit synchronous DRAM (SDRAM) operating at 143 MHz with CAS Latency 3, 2.7–3.6 V supply, and industrial temperature range (−40°C to +85°C), used as main memory in embedded controllers, industrial HMIs, and legacy communication modules requiring LVTTL-compatible SDRAM.

For engineers reviewing the W9816G6JH-7I TR datasheet, W9816G6JH-7I TR pinout, W9816G6JH-7I TR application, or W9816G6JH-7I TR equivalent, key selection criteria include burst length configurability (1/2/4/8/full page), auto-precharge support, dual-bank interleaving capability, and TSOP II-50 industrial-grade thermal reliability.

Technical Context

This SDRAM implements fully synchronous command decoding synchronized to CLK rising edges, with programmable Mode Register controlling burst type (sequential/interleaved), burst length, and CAS latency. It supports bank activate/read/write/precharge/self-refresh/power-down modes via RAS/CAS/WE/CS control lines.

Internal architecture features two independent 512K×16-bit banks enabling true interleaved access to hide precharge delays; column addressing uses internal counter for burst operations, while random column access remains possible via explicit A0–A7 inputs during column latch time.

Key Specifications

ParameterValue and Actual Design Meaning
Organization524,288 words × 2 banks × 16 bits - delivers 16.8 Mbit total capacity with dual-bank parallelism for sustained bandwidth.
Max Clock Frequency143 MHz - supports 286 MT/s data rate with CL3 timing, suitable for legacy microprocessor bus interfaces.
CAS LatencyCL = 3 - fixed latency of three clock cycles between column address strobe and first valid data output.
Burst Length1, 2, 4, 8, or full page - configurable via Mode Register to match host controller burst requirements and optimize bus efficiency.
Supply Voltage2.7 V to 3.6 V - compatible with 3.3 V LVTTL I/O domains and tolerant of rail variation in industrial power supplies.
Operating Temperature−40°C to +85°C - qualified for extended industrial environments without derating or thermal management overhead.
Refresh Rate2K cycles / 32 ms - meets JEDEC standard for SDR SDRAM, ensuring data retention without external refresh controller intervention.
Interface StandardLVTTL - direct compatibility with legacy FPGA, ASIC, and microcontroller memory controllers using 3.3 V logic levels.

Pinout & Package

Packaged in 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with lead-free, RoHS-compliant construction.

Pin/TerminalCircuit RoleDesign Meaning
A0–A10Address InputMultiplexed row/column address lines; row address latched on ACTIVE, column address latched on READ/WRITE.
BABank SelectSelects one of two internal banks during row or column address latch time for bank-specific activation or access.
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes without read-modify-write overhead.
CS, RAS, CAS, WECommand ControlFour active-low control signals decoded synchronously on CLK rising edge to define all device operations.
CLK, CKEClock InterfaceCLK provides synchronous timing reference; CKE enables/disables internal clock domain to enter Power Down or Self Refresh.
LDQM / UDQMData MaskLow-active input/output masks lower/upper 8 bits of DQ bus during write (zero-latency block) or read (Hi-Z after latency 2).
VDD / VSSCore Power/Ground2.7–3.6 V supply for logic and input buffers; separate VDDQ/VSSQ pins isolate I/O power for noise immunity.
NCNo ConnectionPins 33 and 37 are unconnected; must be left floating or tied to ground per board layout best practices.

Key Features

FeatureDesign Value
Programmable Mode RegisterEnables runtime configuration of burst length, CAS latency, and burst type-eliminates need for hardware redesign when tuning memory performance.
Dual-Bank InterleavingAllows back-to-back accesses across banks (e.g., Bank 0 read while Bank 1 precharges), reducing effective latency by hiding tRP overhead.
Auto-Precharge SupportAutomatically initiates precharge after burst completion when A10=HIGH, simplifying controller logic and guaranteeing tRP compliance without software intervention.
Byte-Level Write MaskingLDQM/UDQM enable selective 8-bit writes within 16-bit word, avoiding destructive read-modify-write cycles for partial updates.
Self-Refresh ModeRetains data with only CKE held low and no external clocks-critical for low-power suspend states in battery-backed or energy-constrained systems.

Applications

Industrial HMI MemoryLegacy Communication Module

Use Scenario: Touchscreen-based human-machine interface in factory automation panels with ARM9 or ColdFire MCU.

IC Role / Device Role / Timing Role: Primary system RAM providing fast, burst-accessible storage for GUI frame buffers and real-time control variables.

Use Value: Dual-bank interleaving sustains >100 MB/s effective bandwidth under mixed read/write loads, meeting display refresh deadlines without CPU stalling.

Use Scenario: Protocol gateway bridging RS-485 Modbus devices to Ethernet, using FPGA-based packet processor.

IC Role / Device Role / Timing Role: Off-chip working memory for packet buffering, header parsing, and checksum calculation.

Use Value: Full-page burst mode enables rapid loading of 512-byte Ethernet frames into local cache, reducing DMA transaction count by 75% vs. single-word access.

Embedded Controller Main MemoryMedical Diagnostic Equipment Buffer

Use Scenario: Standalone motor control unit with DSP running real-time PID loops and sensor fusion algorithms.

IC Role / Device Role / Timing Role: Volatile program/data memory interfaced directly to DSP EMIF with 16-bit bus width.

Use Value: CL3 timing and 143 MHz operation ensure deterministic memory access latency (<21 ns), critical for jitter-sensitive control loop execution.

Use Scenario: Portable ultrasound device acquiring and preprocessing echo data before transmission to host PC.

IC Role / Device Role / Timing Role: High-speed circular buffer for raw ADC samples prior to FIR filtering and compression.

Use Value: Industrial temperature rating (−40°C to +85°C) ensures reliable operation during field use in uncontrolled ambient conditions without thermal throttling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS42S16100E-7BLISame 512K×2×16 organization, 143 MHz/CL3, TSOP-54 package (3 mm wider), higher IDD2 current (70 mA vs. 55 mA typical)Requires PCB footprint revision due to 54-pin layout; identical timing but larger package may limit routing density.Choose if existing design uses IS42S16100E footprint or requires higher drive strength for long traces.
MT48LC16M16A2P-75:CSame density and speed grade, but 66-pin TSOP-I package, 3.3 V only (no 2.7 V min), and requires 100 µA lower standby currentNot drop-in: different pinout, no LDQM/UDQM symmetry, and lacks industrial temp option (-75:C is commercial only)Consider only for new designs where footprint flexibility exists and extended temperature is not required.

Compared with IS42S16100E-7BLI and MT48LC16M16A2P-75:C, the W9816G6JH-7I TR offers identical functional timing and dual-bank architecture in a compact 50-pin TSOP II, with guaranteed industrial temperature operation and lower minimum supply voltage-making it optimal for space-constrained, thermally demanding embedded systems.

Availability

W9816G6JH-7I TR is available at Aetrix Electronics and suitable for industrial HMIs, legacy communication modules, and embedded controller main memory applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W9816G6JH-7I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, PSRAM, and SDR SDRAM for industrial, automotive, and consumer markets.

The W9816G6JH series belongs to Winbond's legacy SDR SDRAM product line, designed specifically for cost-sensitive, reliability-critical embedded systems needing JEDEC-compliant synchronous DRAM with industrial temperature support and LVTTL compatibility.

FAQ

What is the maximum operating frequency and CAS latency supported by the W9816G6JH-7I TR?

The W9816G6JH-7I TR is rated for a maximum clock frequency of 143 MHz with CAS Latency 3 (CL3). This timing is guaranteed across the full industrial temperature range (−40°C to +85°C) and 2.7–3.6 V supply. The -7I speed grade does not support CL2 operation; CL3 is fixed for this variant. All timing parameters-including tRCD, tRP, and tRC-are specified at this speed grade in the official datasheet revision A03.

Does the W9816G6JH-7I TR support auto-precharge, and how is it enabled?

Yes, the W9816G6JH-7I TR supports auto-precharge. It is enabled by asserting A10 HIGH during a READ or WRITE command cycle. When activated, the SDRAM automatically initiates precharge after the burst completes-two clocks after final write data (tWR) for writes, or based on CAS latency for reads. This eliminates the need for explicit PRECHARGE commands in burst-heavy workloads, simplifying controller firmware and improving bandwidth efficiency.

What package type and pin count does the W9816G6JH-7I TR use?

The W9816G6JH-7I TR uses a 50-pin, 400-mil TSOP II (Thin Small Outline Package, Type II) with gull-wing leads. It is lead-free and RoHS compliant. Pin pitch is 0.5 mm, body width is 10.16 mm, and overall dimensions are 22.22 mm × 10.16 mm × 1.2 mm. This package is distinct from TSOP-I (54-pin) and TFBGA variants used by other SDRAM families.

Can the W9816G6JH-7I TR operate at 2.7 V supply, and what are the implications?

Yes, the W9816G6JH-7I TR is fully specified to operate at 2.7 V minimum VDD and VDDQ. At this voltage, AC timing parameters (e.g., tRCD, tRP) are relaxed per datasheet Table 9.5, requiring controller timing margins to be verified accordingly. DC characteristics-including input thresholds (VIH/VIL) and output drive-remain valid across the full 2.7–3.6 V range, enabling interoperability with low-voltage logic domains without level shifters.

How does the W9816G6JH-7I TR handle burst termination and partial writes?

W9816G6JH-7I TR supports burst stop only during full-page bursts (via RAS=HIGH, CAS=HIGH, CS=LOW, WE=LOW); other burst lengths cannot be interrupted mid-sequence. For partial writes, LDQM and UDQM provide byte-level masking: asserting either signal HIGH blocks corresponding lower or upper 8 bits of DQ0–DQ15 with zero latency, eliminating read-modify-write cycles and preserving unmasked data integrity during 16-bit bus transfers.

W9816G6JH-7I TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
50-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
LVTTL
Clock Frequency:
143 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
50-TSOP II

W9816G6JH-7I TR FAQ

1.How can I place an order for W9816G6JH-7I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9816G6JH-7I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9816G6JH-7I TR reliable?

The price and inventory of W9816G6JH-7I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9816G6JH-7I TR is usually 5 days.

3.What payment methods are accepted for W9816G6JH-7I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9816G6JH-7I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9816G6JH-7I TR?

W9816G6JH-7I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9816G6JH-7I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9816G6JH-7I TR?

For technical support, including W9816G6JH-7I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9816G6JH-7I TR requirements.

6.How does Aetrix verify that W9816G6JH-7I TR is sourced from the original manufacturer or authorized distributors?

All W9816G6JH-7I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9816G6JH-7I TR meets industry standards.

7.What is the process for return or replacement of W9816G6JH-7I TR?

All W9816G6JH-7I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9816G6JH-7I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9816G6JH-7I TR part is unused and in its original packaging.

Return procedure for W9816G6JH-7I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W9816G6JH-7I TR Tags

  • W9816G6JH-7I TR
  • W9816G6JH-7I TR PDF
  • W9816G6JH-7I TR Datasheet
  • W9816G6JH-7I TR Specifications
  • W9816G6JH-7I TR Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W9816G6JH-7I TR
  • Buy W9816G6JH-7I TR
  • W9816G6JH-7I TR Price
  • W9816G6JH-7I TR Distributor
  • W9816G6JH-7I TR Supplier
  • W9816G6JH-7I TR Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER