Winbond Electronics Corporation W9825G2JB-6I

Overview

W9825G2JB-6I from Winbond is an industrial-grade 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V LVTTL interface, and TFBGA-54 (8×8 mm²) packaging. It delivers up to 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for embedded control, automotive infotainment, and industrial HMI main memory applications.

For engineers reviewing the W9825G2JB-6I datasheet, W9825G2JB-6I pinout, W9825G2JB-6I application, or W9825G2JB-6I equivalent, key selection considerations include its -40°C to +85°C industrial temperature rating, auto-precharge and self-refresh modes, programmable mode register, TFBGA-54 ball mapping, and compatibility with standard SDRAM controllers requiring CL3 timing at 166 MHz.

Technical Context

This SDRAM implements a fully synchronous architecture with four independent memory banks, enabling interleaved access to hide precharge latency. Its command decoder interprets RAS/CAS/WE/CS on CLK rising edges to execute bank activate, read/write, precharge, auto-refresh, self-refresh, and power-down operations.

Internal timing is governed by programmable parameters in the mode register-including burst length (1–8, full page), burst type (sequential/interleaved), and CAS latency (2 or 3)-and enforced by strict AC specifications including tRCD = 20 ns, tRP = 20 ns, and tRC = 60 ns at 166 MHz. The device uses separate VDDQ/VSSQ rails to isolate I/O noise and supports byte masking via LDQM/UDQM.

Key Specifications

Pinout & Package

W9825G2JB-6I is housed in a 54-ball thin fine-pitch BGA (TFBGA) package measuring 8 mm × 8 mm with 0.8 mm ball pitch. Ball assignment follows JEDEC-standard SDRAM pinout with dedicated address, data, control, and power/ground balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Compared with IS42S16400J-6BLI and MT48LC4M16A2P-6A:G, W9825G2JB-6I offers tighter tRC (60 ns), industrial-grade reliability in TFBGA, and native support for clock suspend mode-making it optimal for new designs prioritizing compactness, thermal performance, and low-latency memory access.

Availability

W9825G2JB-6I is available at Aetrix Electronics and suitable for automotive infotainment, industrial HMI, and medical imaging applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature operation.

Supply support for W9825G2JB-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and SDRAM products for industrial, automotive, and computing markets.

W9825G2JB-6I belongs to Winbond's W9825GxJB SDRAM family, designed specifically for cost-sensitive yet thermally demanding embedded systems requiring high-bandwidth, low-pin-count, industrial-grade main memory with JEDEC-compliant timing.

FAQ

What is the maximum operating frequency and CAS latency supported by W9825G2JB-6I?

W9825G2JB-6I is rated for 166 MHz operation with CAS Latency 3 (CL3). It does not support CL2 at this speed grade-the -6 variant supports both CL2 at 133 MHz and CL3 at 166 MHz, but the -6I industrial version is specified only for CL3 at 166 MHz per its datasheet revision A05. This ensures timing margin across the full -40°C to +85°C range.

Does W9825G2JB-6I support auto-precharge and how is it enabled?

Yes, W9825G2JB-6I supports auto-precharge. It is enabled by driving A10 high during a Read or Write command. When activated, the SDRAM automatically begins precharging the accessed bank before burst completion-reducing software overhead and improving sustained bandwidth. Auto-precharge is incompatible with full-page burst length and requires adherence to tDAL (tWR + tRP) before reactivation.

What package type and ball count does W9825G2JB-6I use?

W9825G2JB-6I uses a 54-ball thin fine-pitch BGA (TFBGA) package with 8 mm × 8 mm body size and 0.8 mm ball pitch. The ball map includes 13 address lines (A0–A12), 2 bank select (BS0/BS1), 16 data I/Os (DQ0–DQ15), 4 command signals (/CS, /RAS, /CAS, /WE), CLK, CKE, LDQM, UDQM, and dedicated VDD/VDDQ/VSS/VSSQ rails-fully compliant with JEDEC MO-218AC standard.

How does W9825G2JB-6I handle power management in low-power systems?

W9825G2JB-6I provides three low-power modes: Power Down (CKE low, ≤2 mA), Self Refresh (CKE low + /CS//RAS//CAS high + /WE high, retains data autonomously), and Clock Suspend (CKE low while bank active, halts clocked operations with 1-cycle resume). All modes are entered synchronously on CLK and require no external refresh during self-refresh-critical for battery-backed industrial devices.

Is W9825G2JB-6I pin-compatible with other Winbond SDRAMs like W9825G6JB?

Yes, W9825G2JB-6I is pin-compatible with W9825G6JB and other members of the W9825GxJB family. Both share identical TFBGA-54 ballout, signal naming, and functional pin assignments-including A0–A12, BS0/BS1, DQ0–DQ15, /CS, /RAS, /CAS, /WE, CLK, CKE, LDQM, UDQM, and power rails. Differences are limited to internal density configuration and speed binning-not physical or electrical interface.