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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9825G2JB-6I TR

Name: W9825G2JB-6I TR
Brand: Winbond Electronics Corporation
SKU: W9825G2JB-6I TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9825G2JB-6I TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 90-TFBGA

Datasheet:: W9825G2JB-6I TR.pdf

Description:: IC DRAM 256MBIT PAR 90TFBGA

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Product details

Overview

W9825G2JB-6I TR from Winbond is a 4 M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, compliant to industrial temperature range (−40°C to +85°C), and featuring LVTTL interface, auto-precharge, and self-refresh modes for embedded main memory in real-time control systems.

For engineers reviewing the W9825G2JB-6I TR datasheet, W9825G2JB-6I TR pinout, W9825G2JB-6I TR application, or W9825G2JB-6I TR equivalent, key selection criteria include burst length support (1/2/4/8/full page), dual DQM masking, TFBGA-54 package compatibility, and guaranteed operation under extended thermal cycling conditions.

Technical Context

This SDRAM implements a fully synchronous architecture with programmable mode register controlling burst type (sequential/interleaved), burst length, and CAS latency. It uses four independent banks to enable bank interleaving, reducing effective access latency during sequential page accesses.

Command decoding relies on RAS/CAS/WE/CS edge-sampled logic synchronized to CLK, with CKE gating clock domain entry into power-down and self-refresh modes. Internal refresh counter executes 8K cycles per 64 ms, supporting both auto-refresh and self-refresh with low-power retention.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency	166 MHz - supports 332 MB/s peak data bandwidth (16-bit bus)
CAS Latency	CL = 3 - fixed timing delay between column address and first valid read data
Burst Length	1, 2, 4, 8, or full-page - enables flexible burst transfer sizing per access
Operating Temperature	−40°C to +85°C - qualified for industrial-grade reliability without derating
Refresh Requirement	8,192 cycles / 64 ms - ensures data retention without external refresh controller intervention
Interface Standard	LVTTL - compatible with 3.3 V logic families and standard SDRAM controllers

Pinout & Package

W9825G2JB-6I TR is packaged in a RoHS-compliant, lead-free TFBGA-54 (8 mm × 8 mm) with 0.8 mm ball pitch. Ball assignment follows JEDEC-standard SDRAM layout optimized for signal integrity and thermal dissipation in dense PCB layouts.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge when high during command
BS0, BS1	Bank Select	Selects one of four internal banks during ACTIVATE or READ/WRITE commands
DQ0–DQ15	Data I/O	16-bit bidirectional data bus with separate VDDQ/VSSQ supply for noise isolation
/CS, /RAS, /CAS, /WE	Command Control	Active-low command strobes decoded synchronously on CLK rising edge
LDQM, UDQM	Data Mask	Byte-level write masking: LDQM masks DQ0–7, UDQM masks DQ8–15
CLK, CKE	Clock Interface	CLK drives all synchronous operations; CKE enables/disables clock domain (power-down/self-refresh entry)

Key Features

Feature	Design Value
Programmable Mode Register	Configures burst length, CAS latency, and burst type (sequential/interleaved) at system initialization
Auto-precharge Support	Enables automatic bank precharge after read/write completion-reduces software overhead and improves throughput
Dual DQM Masking	Independent lower/upper byte masking allows precise 8-bit writes without read-modify-write cycles
Self-refresh Mode	Retains data with <2 mA current draw while external clocks are halted-essential for low-power suspend states
Industrial Temp Range	Guaranteed operation from −40°C to +85°C without performance degradation or timing margin loss

Applications

Industrial PLC Memory	Automotive ADAS Controller Buffer
Use Scenario: Real-time ladder logic execution in programmable logic controllers requiring deterministic memory access and thermal resilience. IC Role / Device Role / Timing Role: Main working memory for instruction and I/O data storage, interfaced directly to ARM Cortex-M7 or RISC-V SoC memory controller. Use Value: CL3 timing and 166 MHz clock ensure sub-20 ns average read latency; TFBGA-54 footprint minimizes board area in space-constrained DIN-rail modules.	Use Scenario: Frame buffering for surround-view camera fusion in automotive ADAS ECUs operating across vehicle cabin temperature extremes. IC Role / Device Role / Timing Role: High-bandwidth temporary storage for image tiles prior to GPU processing, synchronized to MIPI CSI-2 video pipeline timing. Use Value: Dual DQM masking enables selective pixel-line updates; self-refresh mode maintains frame buffer integrity during ECU sleep/wake transitions.
Medical Imaging Front-End	Network Edge Router Packet Buffer
Use Scenario: Acquisition buffer in portable ultrasound devices where memory must retain integrity during battery-powered operation and frequent thermal cycling. IC Role / Device Role / Timing Role: Direct DMA target for ADC data streams, configured with burst length = 8 and interleaved addressing to maximize throughput. Use Value: Industrial-grade temp rating eliminates need for active cooling; 8K/64 ms refresh rate aligns with medical device low-power standby requirements.	Use Scenario: Temporary packet queuing in Layer 3 enterprise switches handling mixed VoIP, video, and data traffic under sustained load. IC Role / Device Role / Timing Role: Shared packet buffer accessed concurrently by multiple ASIC engines via time-multiplexed SDRAM controller arbitration. Use Value: Four-bank architecture enables concurrent read/write to different banks-reducing contention and sustaining >90% bus utilization at line rate.

Industrial PLC Memory

Automotive ADAS Controller Buffer

Use Scenario: Real-time ladder logic execution in programmable logic controllers requiring deterministic memory access and thermal resilience.

IC Role / Device Role / Timing Role: Main working memory for instruction and I/O data storage, interfaced directly to ARM Cortex-M7 or RISC-V SoC memory controller.

Use Value: CL3 timing and 166 MHz clock ensure sub-20 ns average read latency; TFBGA-54 footprint minimizes board area in space-constrained DIN-rail modules.

Use Scenario: Frame buffering for surround-view camera fusion in automotive ADAS ECUs operating across vehicle cabin temperature extremes.

IC Role / Device Role / Timing Role: High-bandwidth temporary storage for image tiles prior to GPU processing, synchronized to MIPI CSI-2 video pipeline timing.

Use Value: Dual DQM masking enables selective pixel-line updates; self-refresh mode maintains frame buffer integrity during ECU sleep/wake transitions.

Medical Imaging Front-End

Network Edge Router Packet Buffer

Use Scenario: Acquisition buffer in portable ultrasound devices where memory must retain integrity during battery-powered operation and frequent thermal cycling.

IC Role / Device Role / Timing Role: Direct DMA target for ADC data streams, configured with burst length = 8 and interleaved addressing to maximize throughput.

Use Value: Industrial-grade temp rating eliminates need for active cooling; 8K/64 ms refresh rate aligns with medical device low-power standby requirements.

Use Scenario: Temporary packet queuing in Layer 3 enterprise switches handling mixed VoIP, video, and data traffic under sustained load.

IC Role / Device Role / Timing Role: Shared packet buffer accessed concurrently by multiple ASIC engines via time-multiplexed SDRAM controller arbitration.

Use Value: Four-bank architecture enables concurrent read/write to different banks-reducing contention and sustaining >90% bus utilization at line rate.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16400J-6BLI	Same 128 Mbit organization, 166 MHz, CL3, TFBGA-54, but requires 3.3 V ± 0.15 V supply (tighter tolerance)	Designed for telecom infrastructure; higher AC parameter consistency across voltage/temp	Preferred where tighter VDD regulation is available and telecom-grade reliability certification is required
MT48LC16M16A2P-6A:G	Same density and speed grade, but uses TSOP-54 package (not pin-compatible); slightly higher tRC (60 ns vs 55 ns)	Legacy industrial design with through-hole or surface-mount TSOP footprint constraints	Only suitable if board redesign for TFBGA is not feasible; requires layout revision and signal integrity revalidation

Compared with IS42S16400J-6BLI and MT48LC16M16A2P-6A:G, W9825G2JB-6I TR offers identical timing and bank architecture in a smaller TFBGA footprint, with broader industrial temperature margin and relaxed supply tolerance-making it optimal for cost-sensitive, thermally demanding embedded designs where board space is constrained.

Availability

W9825G2JB-6I TR is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS controllers, medical imaging front-ends, network edge routers, and portable test equipment requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9825G2JB-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including SPI NOR Flash, PSRAM, and SDRAM for industrial, automotive, and consumer applications.

W9825G2JB-6I TR belongs to Winbond's industrial-grade SDRAM product line, designed specifically for embedded systems requiring reliable, low-latency main memory under harsh thermal and electrical conditions without requiring external refresh management.

FAQ

What is the exact memory organization and density of W9825G2JB-6I TR?

W9825G2JB-6I TR is organized as 4 M words × 4 banks × 16 bits, delivering a total density of 128 Mbit (16 MB). This configuration supports efficient 16-bit data transfers and enables bank-interleaved access patterns to hide precharge latency in high-throughput applications.

Does W9825G2JB-6I TR support both sequential and interleaved burst addressing modes?

Yes, W9825G2JB-6I TR supports both sequential and interleaved burst addressing modes, controlled via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleaved mode toggles LSBs for cache-friendly access-both configurable per burst operation in W9825G2JB-6I TR.

What is the minimum and maximum supply voltage specification for W9825G2JB-6I TR?

W9825G2JB-6I TR operates with VDD and VDDQ specified from 3.0 V to 3.6 V, per its recommended DC operating conditions. This ±0.3 V tolerance simplifies power design compared to tighter-spec alternatives and ensures robust operation across varying input rail conditions in W9825G2JB-6I TR deployments.

How does the auto-precharge function operate in W9825G2JB-6I TR during a read command?

In W9825G2JB-6I TR, auto-precharge is triggered when A10 is high during a READ command. The device initiates precharge automatically before burst completion-starting tRP cycles prior to final data output-ensuring the bank is ready for subsequent activation without software intervention.

Is W9825G2JB-6I TR pin-compatible with other Winbond SDRAM variants such as W9825G6JB-6I?

Yes, W9825G2JB-6I TR shares identical TFBGA-54 pinout, ball assignment, and command protocol with W9825G6JB-6I and other members of the W9825GxJB family-enabling drop-in replacement within the same speed grade and temperature rating, provided system timing margins accommodate the specific part's AC characteristics.

W9825G2JB-6I TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 90-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 90-TFBGA (8x13)

W9825G2JB-6I TR FAQ

1.How can I place an order for W9825G2JB-6I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G2JB-6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G2JB-6I TR reliable?

The price and inventory of W9825G2JB-6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G2JB-6I TR is usually 5 days.

3.What payment methods are accepted for W9825G2JB-6I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G2JB-6I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G2JB-6I TR?

W9825G2JB-6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G2JB-6I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G2JB-6I TR?

For technical support, including W9825G2JB-6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G2JB-6I TR requirements.

6.How does Aetrix verify that W9825G2JB-6I TR is sourced from the original manufacturer or authorized distributors?

All W9825G2JB-6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G2JB-6I TR meets industry standards.

7.What is the process for return or replacement of W9825G2JB-6I TR?

All W9825G2JB-6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9825G2JB-6I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G2JB-6I TR part is unused and in its original packaging.

Return procedure for W9825G2JB-6I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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