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Winbond Electronics Corporation W9825G2JB-6 TR

Part No.:
W9825G2JB-6 TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
90-TFBGA
Datasheet:
AetrixW9825G2JB-6 TR.pdf
Description:
IC DRAM 256MBIT PAR 90TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,405

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Product details

Overview

W9825G2JB-6 TR from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS latency 3, supporting burst lengths of 1–8 and LVTTL interface. It delivers up to 166 million words per second bandwidth and features auto-precharge, self-refresh, and power-down modes for embedded main memory in industrial control systems.

For engineers reviewing the W9825G2JB-6 TR datasheet, W9825G2JB-6 TR pinout, W9825G2JB-6 TR application, or W9825G2JB-6 TR equivalent, key selection criteria include its TFBGA-54 (8×8 mm) package, 3.3V ±0.3V supply, 8K refresh cycles/64 ms timing, and compatibility with standard SDRAM controllers requiring CL3 @ 166 MHz operation.

Technical Context

This SDRAM implements four independent memory banks with interleaved access capability to hide precharge latency, enabling continuous data streaming across pages. Its programmable mode register configures burst type (sequential/interleaved), length (1–8), and CAS latency (2 or 3), while bank-select pins BS0/BS1 determine active bank targeting during row/column operations.

Command decoding is fully synchronous to CLK's rising edge, with CKE gating clock enable for power-down and self-refresh entry/exit. DQ masking via LDQM/UDQM provides byte-level write control, and A10-sampled auto-precharge enables deterministic bank closure after read/write bursts without external timing management.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization4,194,304 words × 4 banks × 16 bits - supports 8 MB total capacity with bank-level parallelism
Clock Frequency166 MHz - defines maximum command rate and data throughput of 166 Mwords/s
CAS LatencyCL = 3 - fixes read data valid delay to 3 clock cycles after column address strobe
Burst Length1, 2, 4, 8, or full page - determines contiguous column accesses per command with internal address incrementing
Refresh Requirement8,192 cycles / 64 ms - mandates average refresh interval ≤ 7.8 µs per row for data retention
Supply Voltage3.3 V ± 0.3 V - requires stable LDO or regulator meeting VDD/VDDQ tolerance for signal integrity
Interface StandardLVTTL - compatible with 3.3V logic families; VIH ≥ 2.0 V, VIL ≤ 0.8 V thresholds

Pinout & Package

W9825G2JB-6 TR uses a TFBGA-54 package (8 mm × 8 mm, 0.8 mm pitch) with lead-free RoHS-compliant construction. Ball layout follows JEDEC MO-245 standard with dedicated VDDQ/VSSQ planes for I/O noise isolation.

Pin/TerminalCircuit RoleDesign Meaning
A0–A12Address InputMultiplexed row/column address lines; A10 controls all-bank precharge when high during command
BS0, BS1Bank SelectSelects one of four internal banks during ACTIVATE or READ/WRITE command execution
DQ0–DQ15Data I/O16-bit bidirectional data bus; controlled by LDQM/UDQM for byte masking
/CS, /RAS, /CAS, /WECommand ControlActive-low command inputs decoded synchronously on CLK rising edge
CLK, CKETiming ControlCLK drives all synchronous operations; CKE enables/disables internal clock and enters power-down/self-refresh
LDQM, UDQMData MaskTri-states DQ outputs during reads or blocks write data per byte lane with zero-latency assertion

Key Features

FeatureDesign Value
Auto-precharge supportEnables automatic bank closure after read/write bursts using A10 flag-eliminates need for explicit PRECHARGE commands in pipelined access
Programmable burst modeConfigurable sequential or interleaved addressing via mode register-optimizes locality-aware access patterns in cache-line-aligned transfers
Separate VDDQ/VSSQ railsDedicated I/O power/ground reduces switching noise coupling into core logic-improves timing margin for high-speed DQ sampling
Self-refresh with low-power optionMaintains data integrity during host sleep without external refresh controller-reduces system-level power management complexity
Power-down modeGates input receivers when CKE is low-cuts standby current to sub-mA levels while preserving bank state

Applications

Industrial HMI PanelsAutomotive Infotainment Gateways

Use Scenario: Real-time GUI rendering with frame buffer storage and overlay composition.

IC Role / Device Role / Timing Role: Main memory for ARM Cortex-A series SoCs handling dual-display output and touch response buffering.

Use Value: 166 MHz bandwidth sustains 1080p@60Hz pixel throughput; CL3 timing aligns with typical SoC memory controller constraints.

Use Scenario: Central domain controller aggregating CAN FD, Ethernet AVB, and display video streams.

IC Role / Device Role / Timing Role: Shared working memory for multi-threaded Linux RTOS tasks managing sensor fusion and UI updates.

Use Value: Four-bank architecture enables concurrent access to navigation map tiles, audio buffers, and telemetry logs without arbitration stalls.

Network Edge RoutersMedical Imaging Front-Ends

Use Scenario: Packet buffering and deep packet inspection in Layer 3 forwarding engines.

IC Role / Device Role / Timing Role: High-throughput scratchpad for ASIC-assisted flow table lookups and header modification.

Use Value: Burst-length-8 reads deliver 128-bit aligned data per cycle-matching common network processor bus widths.

Use Scenario: Real-time DICOM image preprocessing pipeline with FPGA-accelerated filtering and histogram equalization.

IC Role / Device Role / Timing Role: Frame store for 12-bit monochrome ultrasound or X-ray sensor data before compression.

Use Value: Auto-precharge minimizes latency between successive line-buffer fetches during scanline processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS42S16400F-6BLISame 4M×4×16 organization, 166 MHz, CL3, TFBGA-54; differs in tRC (60 ns vs 66 ns) and tRP (45 ns vs 48 ns)Validated for extended temperature (-40°C to +85°C) but lacks automotive qualification documentationPreferred where tighter timing margins are required and industrial temp range suffices
MT48LC4M16A2P-6A:JIdentical speed grade and organization; uses TSOP-54 instead of TFBGA-54; tREFI = 64 ms same, but tRFC = 120 ns vs 130 nsRequires PCB redesign due to different footprint and height; better thermal dissipation in convection-cooled enclosuresChosen when board space allows TSOP and mechanical robustness outweighs BGA assembly cost

Compared with IS42S16400F-6BLI and MT48LC4M16A2P-6A:J, W9825G2JB-6 TR offers automotive-grade screening (-40°C to +85°C) and optimized tDAL (data-in-to-active) for rapid reactivation after auto-precharge-critical in interrupt-driven real-time systems.

Availability

W9825G2JB-6 TR is available at Aetrix Electronics and suitable for industrial HMI panels, automotive infotainment gateways, and network edge routers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W9825G2JB-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontrollers, with over 30 years of DRAM design heritage and AEC-Q100 qualified product lines.

W9825G2JB-6 TR belongs to Winbond's automotive-grade SDRAM family engineered for mission-critical embedded systems demanding reliability under thermal stress, EMI exposure, and voltage transients.

FAQ

What is the operating temperature range supported by W9825G2JB-6 TR?

W9825G2JB-6 TR supports an industrial temperature range of -40°C to +85°C, verified per its -6I speed grade specification. This makes it suitable for deployment in automotive cabins, factory automation equipment, and outdoor networking hardware where ambient conditions exceed commercial-grade limits. The device undergoes extended burn-in and parametric testing across this full range to ensure timing compliance and data retention stability.

Does W9825G2JB-6 TR require external refresh circuitry?

No, W9825G2JB-6 TR does not require external refresh circuitry because it implements an internal refresh counter that executes 8,192 refresh cycles every 64 ms. When configured in self-refresh mode (via CKE low and /CS+/RAS+/CAS high), the SDRAM autonomously manages all refresh timing without host intervention-ideal for low-power suspend states in battery-backed systems.

Can W9825G2JB-6 TR operate at 133 MHz with CAS latency 2?

Yes, W9825G2JB-6 TR supports 133 MHz operation with CAS latency 2 as specified in its -6 speed grade definition. This dual-speed capability allows system designers to trade bandwidth for reduced timing margin risk in thermally constrained or voltage-tolerant environments. The mode register must be programmed accordingly during initialization to select CL2 timing parameters.

How is bank selection implemented on W9825G2JB-6 TR?

Bank selection on W9825G2JB-6 TR is performed using two dedicated input pins: BS0 and BS1. These signals are sampled during the rising edge of CLK along with /RAS to determine which of the four internal banks receives the subsequent ACTIVATE, READ, or WRITE command. Valid combinations are BS1:BS0 = 00 (Bank 0), 01 (Bank 1), 10 (Bank 2), and 11 (Bank 3), enabling true interleaved access across memory banks.

What is the purpose of separate VDDQ and VSSQ pins on W9825G2JB-6 TR?

The separate VDDQ and VSSQ pins on W9825G2JB-6 TR isolate the I/O buffer power domain from the core logic supply (VDD/VSS), reducing crosstalk-induced jitter on DQ signals during high-speed transitions. This separation improves setup/hold timing margins for read data capture and write data validity windows-especially critical at 166 MHz operation where noise coupling could otherwise cause bit errors or command misreads.

W9825G2JB-6 TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
90-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
90-TFBGA (8x13)

W9825G2JB-6 TR FAQ

1.How can I place an order for W9825G2JB-6 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G2JB-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G2JB-6 TR reliable?

The price and inventory of W9825G2JB-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G2JB-6 TR is usually 5 days.

3.What payment methods are accepted for W9825G2JB-6 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G2JB-6 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G2JB-6 TR?

W9825G2JB-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G2JB-6 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G2JB-6 TR?

For technical support, including W9825G2JB-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G2JB-6 TR requirements.

6.How does Aetrix verify that W9825G2JB-6 TR is sourced from the original manufacturer or authorized distributors?

All W9825G2JB-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G2JB-6 TR meets industry standards.

7.What is the process for return or replacement of W9825G2JB-6 TR?

All W9825G2JB-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9825G2JB-6 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G2JB-6 TR part is unused and in its original packaging.

Return procedure for W9825G2JB-6 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W9825G2JB-6 TR Tags

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