Winbond Electronics Corporation W9825G6EH-6
- Part No.:
- W9825G6EH-6
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9825G6EH-6.pdf
- Description:
- IC DRAM 256MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:4,225
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Product details
Overview
W9825G6EH-6 from Winbond Electronics is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3 or 133 MHz with CAS Latency 2, supporting burst lengths of 1/2/4/8/full page, and packaged in 54-pin TSOP II (400 mil). It delivers up to 166 million words per second for embedded main memory in industrial controllers and legacy computing systems.
For engineers reviewing the W9825G6EH-6 datasheet, W9825G6EH-6 pinout, W9825G6EH-6 application, or W9825G6EH-6 equivalent, key selection considerations include its 3.3V LVTTL interface, programmable mode register for burst/latency configuration, bank interleaving capability, self-refresh and power-down modes, and industrial temperature support (0°C to 70°C).
Technical Context
This SDRAM implements fully synchronous operation synchronized to the rising edge of CLK, with command decoding controlled by CS, RAS, CAS, and WE. It features four independent memory banks enabling interleaved access to hide precharge delays and sustain high throughput across sequential or interleave burst patterns.
The device supports programmable burst types (sequential or interleave), auto-precharge via A10 assertion, and dual DQM masking (LDQM/UDQM) for byte-level write control. Its internal architecture includes a refresh counter, column address counter, and mode register that defines latency, burst length, and burst type - all configurable without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity |
| Max Clock Frequency | 166 MHz (CL3) or 133 MHz (CL2); determines maximum sustained data rate |
| CAS Latency | Programmable CL2 or CL3; defines fixed clock-cycle delay between read command and first valid data |
| Burst Length | 1, 2, 4, 8, or full-page; enables efficient sequential access within an open row |
| Refresh Requirement | 8,192 cycles / 64 ms; mandates periodic refresh to retain data in volatile cells |
| I/O Voltage | 3.3V ± 0.3V LVTTL-compatible interface; ensures interoperability with legacy 3.3V logic families |
| Operating Temperature | 0°C to 70°C; validated for commercial/industrial ambient environments |
Pinout & Package
W9825G6EH-6 is housed in a 54-pin TSOP II package (400 mil body width, 0.80 mm pitch), with separate VCC/VSS and VCCQ/VSSQ supplies for core logic and I/O buffers to reduce noise coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Multiplexed row/column address lines; A0–A12 for row, A0–A8 for column |
| BS0, BS1 | Bank Select | Selects one of four internal banks during ACTIVATE or READ/WRITE commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDQM/UDQM |
| CS | Chip Select | Enables command decoder; low = active command recognition |
| RAS, CAS, WE | Command Strobes | Combined with CS to define operation (e.g., ACTIVATE, READ, WRITE, PRECHARGE) |
| LDQM, UDQM | Data Mask | Controls byte enable for writes (UDQM masks upper 8 bits, LDQM masks lower 8 bits) |
| CLK | System Clock | All commands and data transfers synchronized to rising edge |
| CKE | Clock Enable | High = normal operation; low = enters Power Down, Self Refresh, or Clock Suspend |
| VCC / VSS | Core Power/Ground | 3.3V supply and return for internal logic and input buffers |
| VCCQ / VSSQ | I/O Power/Ground | Isolated 3.3V supply and return for DQ drivers/receivers to improve signal integrity |
| NC | No Connect | Pin 40 is unconnected; must be left floating or tied to GND per design practice |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Mode Register | Configures burst length, CAS latency, and burst type (sequential/interleave) dynamically without hardware change |
| Auto-precharge Support | Automatically initiates bank precharge after read/write completion when A10 = high, reducing software overhead |
| Dual DQM Masking | Independent upper/lower byte masking (UDQM/LDQM) enables precise 8-bit write control on 16-bit bus |
| Four-Bank Architecture | Enables bank interleaving to overlap row activation and data transfer, improving effective bandwidth |
| Self Refresh Mode | Maintains data retention with minimal external control during low-power states; requires only CKE low |
Applications
| Industrial PLC Memory | Legacy PC Main Memory |
|---|---|
Use Scenario: Real-time data logging and program execution in programmable logic controllers requiring deterministic memory access. IC Role / Device Role / Timing Role: Primary working memory interfaced directly to microcontroller or FPGA fabric with synchronous timing control. Use Value: 166 MHz operation and 4-bank interleaving sustain >130 MB/s sustained bandwidth for cyclic scan tasks under 0–70°C conditions. | Use Scenario: System memory in embedded x86 platforms (e.g., VIA Eden, AMD Geode) where cost-sensitive, pin-compatible SDRAM is required. IC Role / Device Role / Timing Role: Drop-in replacement for standard PC133/PC166 SDRAM modules in compact form factor designs. Use Value: Full compliance with JEDEC SDRAM standards ensures compatibility with legacy BIOS and memory controllers without timing revalidation. |
| Medical Diagnostic Equipment Buffer | Network Appliance Packet Buffer |
Use Scenario: Frame buffering in ultrasound or imaging subsystems needing reliable, low-latency memory with thermal stability. IC Role / Device Role / Timing Role: High-speed frame store between ADC/DAC and processing engine, managed via burst reads/writes. Use Value: CAS Latency 2/3 selection allows tuning for latency-critical acquisition paths while maintaining 128 Mbit density in TSOP footprint. | Use Scenario: Temporary packet storage in Ethernet switches or firewalls handling line-rate traffic with bursty ingress/egress patterns. IC Role / Device Role / Timing Role: Shared buffer pool accessed concurrently by multiple MAC engines using bank arbitration. Use Value: Four-bank architecture enables concurrent read from one bank while writing to another, minimizing contention in multi-port buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16400F-6BLI | Same 4M×4×16 organization, 166 MHz/CL3, 54-pin TSOP II, but with extended temp range (–40°C to 85°C) and higher IDD current (4 mA vs. 3 mA) | Preferred for extended-temperature deployments where W9825G6EH-6's 0–70°C rating is insufficient | Select IS42S16400F-6BLI if ambient exceeds 70°C or long-term reliability under thermal cycling is critical |
| MT48LC4M16A2P-6A | Identical speed grade (166 MHz/CL3), same pinout and organization, but Micron-manufactured with tighter tRC/tRP specs (60 ns vs. 66 ns) and different refresh timing tolerance | Suitable for designs already qualified with Micron SDRAMs or requiring stricter AC parameter margins | Choose MT48LC4M16A2P-6A when migrating from Micron-based BOMs or when tRC margin is constrained in timing closure |
Compared with IS42S16400F-6BLI and MT48LC4M16A2P-6A, W9825G6EH-6 offers identical functional and pinout compatibility for 166 MHz SDRAM use cases but with lower standby current and Winbond-specific initialization sequences - making it optimal for cost-sensitive, thermally moderate industrial applications where vendor lock-in is not required.
Availability
W9825G6EH-6 is available at Aetrix Electronics and suitable for industrial PLCs, legacy PC main memory upgrades, medical diagnostic equipment, network appliance packet buffering, and embedded controller memory expansion requiring stable component supply over extended production lifecycles.
Supply support for W9825G6EH-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design heritage.
The W9825G6EH series belongs to Winbond's legacy SDRAM product line, engineered for cost-effective, pin-compatible replacement in industrial and embedded systems requiring JEDEC-compliant synchronous DRAM with proven reliability and broad controller support.
FAQ
What is the maximum operating frequency and CAS latency supported by W9825G6EH-6?
W9825G6EH-6 supports two speed modes: 166 MHz with CAS Latency 3, or 133 MHz with CAS Latency 2. These are fixed speed-grade configurations defined at manufacturing; the device does not support dynamic switching between them. The mode register must be programmed accordingly during initialization to match the selected clock frequency and latency setting.
Does W9825G6EH-6 require external refresh circuitry?
No, W9825G6EH-6 performs internal refresh via Auto Refresh commands issued by the memory controller. It requires exactly 8,192 refresh cycles every 64 ms (tREF = 64 ms), which equates to one refresh command every 7.8125 µs on average. The SDRAM itself manages row addressing during refresh; no external row counter is needed.
Can W9825G6EH-6 operate in self-refresh mode without external clocks?
Yes, W9825G6EH-6 enters self-refresh mode when CS, RAS, CAS, and WE are held low with CKE low at the rising clock edge. Once entered, the internal oscillator sustains refresh autonomously, and CLK may be stopped. The device exits self-refresh when CKE returns high, followed by a tRFC + tXS delay before accepting new commands.
What is the purpose of separate VCCQ and VSSQ pins on W9825G6EH-6?
VCCQ and VSSQ provide isolated power and ground for the DQ input/output buffers only, decoupling I/O switching noise from the core logic supply (VCC/VSS). This separation improves signal integrity, reduces crosstalk on the 16-bit data bus, and meets JEDEC SDRAM noise immunity requirements - especially critical in high-speed burst transfers.
Is W9825G6EH-6 compatible with standard PC133 or PC166 memory controllers?
Yes, W9825G6EH-6 complies fully with JEDEC Standard No. 21-C for SDRAM and matches the timing, command set, and electrical specifications of PC133 (133 MHz/CL2) and PC166 (166 MHz/CL3) modules. Its 54-pin TSOP II footprint and LVTTL interface ensure drop-in compatibility with controllers designed for those standards, provided the mode register is configured correctly.
W9825G6EH-6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
W9825G6EH-6 FAQ
1.How can I place an order for W9825G6EH-6 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9825G6EH-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9825G6EH-6 reliable?
The price and inventory of W9825G6EH-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6EH-6 is usually 5 days.
3.What payment methods are accepted for W9825G6EH-6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6EH-6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9825G6EH-6?
W9825G6EH-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9825G6EH-6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9825G6EH-6?
For technical support, including W9825G6EH-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6EH-6 requirements.
6.How does Aetrix verify that W9825G6EH-6 is sourced from the original manufacturer or authorized distributors?
All W9825G6EH-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6EH-6 meets industry standards.
7.What is the process for return or replacement of W9825G6EH-6?
All W9825G6EH-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6EH-6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9825G6EH-6 part is unused and in its original packaging.
Return procedure for W9825G6EH-6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9825G6EH-6 Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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