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Winbond Electronics Corporation W9825G6JB-6

Name: W9825G6JB-6
Brand: Winbond Electronics Corporation
SKU: W9825G6JB-6
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9825G6JB-6

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TFBGA

Datasheet:: W9825G6JB-6.pdf

Description:: IC DRAM 256MBIT PAR 54TFBGA

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Product details

Overview

W9825G6JB-6 from Winbond is a 4M × 4 banks × 16-bit automotive-grade SDRAM operating at up to 166 MHz with CAS latency 3, 3.3V LVTTL interface, and TFBGA-54 (8×8 mm) packaging. It delivers 166M words/s bandwidth and supports burst lengths of 1–8 and full-page, enabling high-throughput main memory in embedded controllers and infotainment systems.

For engineers reviewing the W9825G6JB-6 datasheet, W9825G6JB-6 pinout, W9825G6JB-6 application, or W9825G6JB-6 equivalent, key selection criteria include its -6 speed grade (166MHz/CL3 or 133MHz/CL2), industrial temperature range (0°C to 70°C), self-refresh current (2 mA), and bank-interleaved burst access architecture for latency hiding.

Technical Context

This SDRAM implements a synchronous, clocked command interface with four independently addressable banks, enabling true interleaved access across active rows. Its internal architecture includes programmable mode register control for burst type (sequential/interleave), burst length, and CAS latency - all configurable per system timing requirements.

Functional operation relies on precise command sequencing: Bank Activate must precede Read/Write; Auto-precharge is triggered by A10 high during command latching; and Self Refresh requires CKE low with CS/RAS/CAS low and WE high. All timing adheres to JEDEC-standard SDRAM protocols including tRCD, tRP, tRC, and tRAS constraints.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency	166 MHz - defines maximum data transfer rate and system bus timing budget
CAS Latency	CL = 2 or 3 - determines fixed read pipeline delay from column command to first data output
Burst Length	1, 2, 4, 8, or full page - controls number of consecutive data transfers per command, optimizing bandwidth vs. address overhead
Refresh Requirement	8K cycles / 64 ms - mandates periodic refresh scheduling to retain data integrity
Supply Voltage	3.3 V ± 0.3 V - defines compatible power rail design and decoupling requirements
Operating Temperature	0°C to 70°C - specifies thermal envelope for automotive cabin and industrial control environments

Pinout & Package

W9825G6JB-6 is packaged in a RoHS-compliant, lead-free TFBGA-54 (8 mm × 8 mm) with 0.8 mm ball pitch. Ball assignments follow JEDEC-standard SDRAM layout for signal integrity and thermal management.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge when high
BS0, BS1	Bank Select	2-bit encoding to select one of four internal banks during activate or command execution
DQ0–DQ15	Data I/O	16-bit bidirectional data bus with separate VDDQ/VSSQ for noise isolation
/CS, /RAS, /CAS, /WE	Command Control	Active-low command strobes defining operation type (activate, read, write, precharge, etc.)
LDQM, UDQM	Data Mask	Lower/upper byte masking for partial writes without affecting adjacent bytes
CLK, CKE	Clock Interface	System clock input and clock enable - CKE low enters Power Down or Self Refresh modes

Key Features

Feature	Design Value
Programmable Mode Register	Enables runtime configuration of burst length, CAS latency, and burst order (sequential/interleave) without hardware change
Auto-precharge Support	Automatically initiates bank precharge after burst completion when A10 is asserted, reducing manual command overhead
Interleaved Bank Access	Allows concurrent activation of multiple banks to hide tRCD and tRP delays, sustaining continuous data flow
Self Refresh Mode	Retains memory contents with only CKE held low - consumes only 2 mA, enabling low-power suspend states
LVTTL-Compatible Interface	Ensures direct compatibility with 3.3V microcontrollers and FPGAs without level-shifting circuitry

Applications

Automotive Infotainment Head Unit	Industrial PLC Main Memory
Use Scenario: Real-time video decoding and UI rendering in vehicle head units requiring sustained 166 MB/s memory bandwidth. IC Role / Device Role / Timing Role: Primary SDRAM for application processor frame buffer and code execution space, interfacing via 16-bit LVTTL bus at 166 MHz. Use Value: Interleaved bank access and CL3 timing enable deterministic latency for audio/video synchronization under variable load.	Use Scenario: Data logging and control algorithm execution in programmable logic controllers operating in factory environments. IC Role / Device Role / Timing Role: System memory for ARM-based controller SoC, supporting burst reads/writes during cyclic scan execution. Use Value: Auto-precharge and programmable burst length reduce command overhead, improving deterministic response time for I/O scanning.
Medical Imaging Display Controller	Network Edge Router Buffer
Use Scenario: High-resolution DICOM image buffering in portable ultrasound displays requiring reliable operation at 70°C ambient. IC Role / Device Role / Timing Role: Frame store memory for FPGA-based display pipeline, synchronized to pixel clock domain via CLK/CKE control. Use Value: 0°C to 70°C rating and 2 mA self-refresh current ensure stable imaging buffer retention during thermal transients.	Use Scenario: Packet buffering in Layer 3 edge routers handling bursty traffic with minimal latency variation. IC Role / Device Role / Timing Role: Shared packet memory for traffic manager and forwarding engine, accessed via dual-port arbitration logic. Use Value: Four independent banks allow simultaneous read (egress) and write (ingress) operations, preventing head-of-line blocking.

Automotive Infotainment Head Unit

Industrial PLC Main Memory

Use Scenario: Real-time video decoding and UI rendering in vehicle head units requiring sustained 166 MB/s memory bandwidth.

IC Role / Device Role / Timing Role: Primary SDRAM for application processor frame buffer and code execution space, interfacing via 16-bit LVTTL bus at 166 MHz.

Use Value: Interleaved bank access and CL3 timing enable deterministic latency for audio/video synchronization under variable load.

Use Scenario: Data logging and control algorithm execution in programmable logic controllers operating in factory environments.

IC Role / Device Role / Timing Role: System memory for ARM-based controller SoC, supporting burst reads/writes during cyclic scan execution.

Use Value: Auto-precharge and programmable burst length reduce command overhead, improving deterministic response time for I/O scanning.

Medical Imaging Display Controller

Network Edge Router Buffer

Use Scenario: High-resolution DICOM image buffering in portable ultrasound displays requiring reliable operation at 70°C ambient.

IC Role / Device Role / Timing Role: Frame store memory for FPGA-based display pipeline, synchronized to pixel clock domain via CLK/CKE control.

Use Value: 0°C to 70°C rating and 2 mA self-refresh current ensure stable imaging buffer retention during thermal transients.

Use Scenario: Packet buffering in Layer 3 edge routers handling bursty traffic with minimal latency variation.

IC Role / Device Role / Timing Role: Shared packet memory for traffic manager and forwarding engine, accessed via dual-port arbitration logic.

Use Value: Four independent banks allow simultaneous read (egress) and write (ingress) operations, preventing head-of-line blocking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16400J-6BLI	Same 128 Mbit organization, 16-bit bus, and -6 speed grade; differs in refresh cycle tolerance (64 ms vs. 64 ms) and package (TFBGA-54 vs. TFBGA-54)	Identical automotive temperature range (-40°C to 85°C for IS42S16400J-6BLI vs. 0°C to 70°C for W9825G6JB-6)	Select IS42S16400J-6BLI only if extended temperature support is required; otherwise W9825G6JB-6 offers lower cost for commercial-temp designs.
MT48LC16M16A2P-6A	Same density and interface but uses TSOP-54 packaging; tAC and tRCD timings differ slightly (tRCD = 20 ns vs. 22 ns)	TSOP-54 footprint incompatible with W9825G6JB-6's TFBGA-54 layout; requires PCB redesign	MT48LC16M16A2P-6A is suitable only for legacy TSOP-based designs; not a drop-in replacement for W9825G6JB-6.

Compared with IS42S16400J-6BLI and MT48LC16M16A2P-6A, W9825G6JB-6 provides identical 128 Mbit capacity and 166 MHz performance in a compact TFBGA-54 package optimized for space-constrained automotive modules, while offering lower self-refresh current (2 mA) than MT48LC16M16A2P-6A (3 mA) for battery-backed applications.

Availability

W9825G6JB-6 is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial PLCs, and medical display controllers requiring stable component supply across production lifecycles.

Supply support for W9825G6JB-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontroller solutions for automotive, industrial, and consumer markets.

The W9825G6JB series is part of Winbond's automotive-qualified SDRAM product line, designed specifically for high-reliability, temperature-stable main memory in real-time embedded systems.

FAQ

What is the maximum operating frequency supported by W9825G6JB-6?

W9825G6JB-6 supports a maximum clock frequency of 166 MHz when configured with CAS latency 3, or 133 MHz with CAS latency 2. These speed grades are validated per JEDEC SDRAM specifications and reflected in the -6 suffix designation. The device maintains timing compliance across its full 0°C to 70°C operating range, and W9825G6JB-6 must be operated within these limits to guarantee tRCD, tRP, and tRC parameter adherence.

Does W9825G6JB-6 support full-page burst mode?

Yes, W9825G6JB-6 supports full-page burst mode as one of its selectable burst lengths, alongside 1, 2, 4, and 8. Full-page burst enables reading or writing all columns in an open row with a single command, maximizing bandwidth efficiency for sequential data access. However, auto-precharge is prohibited when full-page burst is selected, as stated in section 7.14 of the W9825G6JB-6 datasheet.

What is the function of the LDQM and UDQM pins on W9825G6JB-6?

LDQM (Lower Data Queue Mask) and UDQM (Upper Data Queue Mask) are byte-level write mask inputs on W9825G6JB-6. When asserted high during a write cycle, LDQM masks DQ0–DQ7 and UDQM masks DQ8–DQ15, allowing selective 8-bit updates without disturbing adjacent bytes. During read cycles, asserting either DQM places the corresponding DQ group in high-impedance state after CAS latency delay, preventing bus contention - a critical feature for W9825G6JB-6 in shared-memory multiprocessor systems.

Can W9825G6JB-6 operate in self-refresh mode at its maximum temperature rating?

Yes, W9825G6JB-6 supports self-refresh mode across its full specified operating temperature range of 0°C to 70°C, with a maximum self-refresh current of 2 mA. The device enters self-refresh when CS, RAS, CAS, and WE are low and CKE is low at the rising clock edge, and exits upon CKE return high after tXSR delay. This capability ensures data retention during system sleep states in automotive and industrial applications where W9825G6JB-6 is deployed.

Is W9825G6JB-6 pin-compatible with other Winbond SDRAMs in the same family?

W9825G6JB-6 shares identical TFBGA-54 pinout and signal assignment with other members of the W9825G6JB family (e.g., W9825G6JB-6I and W9825G6JB-75), including matching ball locations for A0–A12, DQ0–DQ15, /CS, /RAS, /CAS, /WE, CKE, CLK, LDQM, UDQM, VDD, VSS, VDDQ, and VSSQ. This allows direct substitution within the same speed grade and temperature variant without PCB modification - a verified compatibility confirmed in Winbond's order information table for W9825G6JB-6.

W9825G6JB-6 Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TFBGA (8x8)

W9825G6JB-6 FAQ

1.How can I place an order for W9825G6JB-6 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G6JB-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G6JB-6 reliable?

The price and inventory of W9825G6JB-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6JB-6 is usually 5 days.

3.What payment methods are accepted for W9825G6JB-6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6JB-6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G6JB-6?

W9825G6JB-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G6JB-6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G6JB-6?

For technical support, including W9825G6JB-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6JB-6 requirements.

6.How does Aetrix verify that W9825G6JB-6 is sourced from the original manufacturer or authorized distributors?

All W9825G6JB-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6JB-6 meets industry standards.

7.What is the process for return or replacement of W9825G6JB-6?

All W9825G6JB-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6JB-6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G6JB-6 part is unused and in its original packaging.

Return procedure for W9825G6JB-6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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