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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9825G6JB-6I

Name: W9825G6JB-6I
Brand: Winbond Electronics Corporation
SKU: W9825G6JB-6I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9825G6JB-6I

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TFBGA

Datasheet:: W9825G6JB-6I.pdf

Description:: IC DRAM 256MBIT LVTTL 54TFBGA

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Product details

Overview

W9825G6JB-6I from Winbond Electronics is an industrial-grade 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and TFBGA-54 (8×8 mm²) packaging. It delivers up to 166 million words per second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for embedded main memory in automotive control units and industrial HMIs.

For engineers reviewing the W9825G6JB-6I datasheet, W9825G6JB-6I pinout, W9825G6JB-6I application, or W9825G6JB-6I equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), LVTTL interface compatibility, self-refresh power management, auto-precharge timing constraints, and TFBGA-54 ball mapping for PCB layout verification.

Technical Context

This SDRAM implements a four-bank architecture with independent row activation and interleaved bank access to hide precharge latency. Its programmable Mode Register configures burst type (sequential/interleave), length, and CAS latency-enabling optimization for sequential streaming or random-access workloads.

Command decoding is fully synchronous to CLK's rising edge, with CKE gating clock enable for Power Down and Self Refresh modes. The device uses separate VDDQ/VSSQ rails to isolate I/O noise, and LDQM/UDQM pins provide byte-level write masking with zero-latency blocking during write cycles.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	4,194,304 words × 4 banks × 16 bits - provides 128 Mbit total capacity with bank-level parallelism for concurrent page access.
Clock Frequency	166 MHz - defines maximum data transfer rate of 166 million words/sec under CL3 timing at industrial temperature range.
CAS Latency	CL = 3 - specifies fixed 3-clock-cycle delay between column address strobe and first valid read data output.
Burst Length	1, 2, 4, 8, or full page - enables flexible data fetch granularity aligned to cache line or DMA burst size requirements.
Refresh Rate	8K cycles / 64 ms - mandates minimum refresh command interval to retain data integrity across all operating temperatures.
Supply Voltage	3.3V ±0.3V (VDD/VDDQ) - requires dual-rail regulation with decoupling for logic and I/O domains to meet noise immunity specs.
Operating Temperature	–40°C to +85°C - validated for industrial control systems without derating; excludes consumer-grade -6 variant.

Pinout & Package

W9825G6JB-6I is packaged in a lead-free, RoHS-compliant TFBGA-54 package (8 mm × 8 mm, 0.8 mm pitch). Ball assignment follows JEDEC-standard SDRAM pinout with dedicated address, command, data, and power/ground balls.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Input	Multiplexed row/column address lines; A10 controls all-bank vs. bank-specific precharge when sampled during command.
BS0, BS1	Bank Select	Selects one of four internal banks during ACTIVATE or READ/WRITE commands; enables interleaved bank operation.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte masking via LDQM/UDQM for partial writes without read-modify-write overhead.
/CS, /RAS, /CAS, /WE	Command Control	Active-low command inputs decoded synchronously on CLK rising edge; define all operations including refresh and mode register setup.
CLK, CKE	Timing Control	CLK drives all synchronous operations; CKE enables/disables internal clock domain-low entry triggers Power Down or Self Refresh.
LDQM, UDQM	Data Mask	Assert high during read to tri-state DQ outputs after CL+2 latency; blocks write data on corresponding byte lanes with zero-cycle latency.

Key Features

Feature	Design Value
Industrial Temperature Range	Guaranteed operation from –40°C to +85°C without performance degradation-critical for engine control modules and factory automation hardware.
Auto-precharge Support	Enables automatic bank precharge after read/write bursts by asserting A10; eliminates explicit PRECHARGE command overhead and reduces command bus contention.
Separate VDDQ/VSSQ Rails	Dedicated I/O power/ground improves signal integrity on DQ lines-reduces crosstalk-induced timing violations in high-speed parallel memory interfaces.
LVTTL-Compatible Interface	Meets JEDEC JESD8-15A voltage thresholds (VIH ≥ 2.0V, VIL ≤ 0.8V) for direct interfacing with FPGA or ASIC memory controllers without level-shifting.
Self Refresh Mode	Retains data with <2 mA current draw while external clocks are halted-enables low-power suspend states in portable HMI and telematics devices.

Applications

Automotive Engine Control Unit (ECU)	Industrial Human-Machine Interface (HMI)
Use Scenario: Real-time sensor fusion and actuator control loop execution requiring deterministic memory access latency and extended thermal reliability. IC Role / Device Role / Timing Role: Main program/data memory for 32-bit RISC microcontroller, serving instruction fetches and DMA buffers with burst-aligned reads at 166 MHz. Use Value: Industrial-grade temperature rating ensures uninterrupted operation during under-hood thermal cycling; auto-precharge minimizes command overhead in time-critical control cycles.	Use Scenario: Touchscreen GUI rendering and local data logging in factory-floor operator panels exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Frame buffer and application code storage for ARM-based display controller, supporting 16-bit pixel data transfers and interrupt-driven event buffering. Use Value: Separate VDDQ/VSSQ rails suppress I/O noise during simultaneous display updates and serial comms; self-refresh maintains state during panel sleep mode.
Railway Signaling Controller	Medical Diagnostic Imaging Subsystem
Use Scenario: Safety-critical track occupancy detection and interlocking logic where memory must retain integrity across power brownouts and vibration-induced stress. IC Role / Device Role / Timing Role: Non-volatile configuration storage and real-time status table memory for SIL-2-certified FPGA-based controller, accessed via AXI or APB bridge. Use Value: 8K/64ms refresh compliance guarantees data retention during extended power-loss intervals; TFBGA-54 mechanical robustness resists shock-induced solder fatigue.	Use Scenario: Local image preprocessing pipeline in portable ultrasound equipment requiring low-latency pixel buffer access and battery-efficient idle states. IC Role / Device Role / Timing Role: Dual-port frame buffer for FPGA-accelerated FFT and beamforming, accepting raw ADC streams and outputting processed scan lines. Use Value: Burst length flexibility (1–8) matches varying kernel sizes; CL3 timing enables predictable 18 ns read turnaround for real-time processing deadlines.

Automotive Engine Control Unit (ECU)

Industrial Human-Machine Interface (HMI)

Use Scenario: Real-time sensor fusion and actuator control loop execution requiring deterministic memory access latency and extended thermal reliability.

IC Role / Device Role / Timing Role: Main program/data memory for 32-bit RISC microcontroller, serving instruction fetches and DMA buffers with burst-aligned reads at 166 MHz.

Use Value: Industrial-grade temperature rating ensures uninterrupted operation during under-hood thermal cycling; auto-precharge minimizes command overhead in time-critical control cycles.

Use Scenario: Touchscreen GUI rendering and local data logging in factory-floor operator panels exposed to wide ambient temperature swings.

IC Role / Device Role / Timing Role: Frame buffer and application code storage for ARM-based display controller, supporting 16-bit pixel data transfers and interrupt-driven event buffering.

Use Value: Separate VDDQ/VSSQ rails suppress I/O noise during simultaneous display updates and serial comms; self-refresh maintains state during panel sleep mode.

Railway Signaling Controller

Medical Diagnostic Imaging Subsystem

Use Scenario: Safety-critical track occupancy detection and interlocking logic where memory must retain integrity across power brownouts and vibration-induced stress.

IC Role / Device Role / Timing Role: Non-volatile configuration storage and real-time status table memory for SIL-2-certified FPGA-based controller, accessed via AXI or APB bridge.

Use Value: 8K/64ms refresh compliance guarantees data retention during extended power-loss intervals; TFBGA-54 mechanical robustness resists shock-induced solder fatigue.

Use Scenario: Local image preprocessing pipeline in portable ultrasound equipment requiring low-latency pixel buffer access and battery-efficient idle states.

IC Role / Device Role / Timing Role: Dual-port frame buffer for FPGA-accelerated FFT and beamforming, accepting raw ADC streams and outputting processed scan lines.

Use Value: Burst length flexibility (1–8) matches varying kernel sizes; CL3 timing enables predictable 18 ns read turnaround for real-time processing deadlines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16400J-6BLI	Same 4M×4×16 organization, 166 MHz/CL3, TFBGA-54, but uses different mode register encoding and has tRC = 50 ns vs. W9825G6JB-6I's 45 ns.	Valid for drop-in replacement only if memory controller firmware supports IS42S16400J's extended mode register bit definitions and relaxed tRC.	Select when existing design already qualifies ISSI's timing margins and requires second-source assurance without layout change.
MT48LC16M16A2P-6A:G	Functionally identical 128 Mbit SDRAM, but in TSOP-54 package with longer tRP (45 ns vs. 40 ns) and no industrial temp grade-rated only to 70°C.	Requires PCB redesign due to TSOP-54 footprint; unsuitable for environments exceeding 70°C or demanding high vibration resistance.	Choose only for cost-sensitive non-industrial applications where board space allows TSOP and thermal profile stays within commercial range.

Compared with IS42S16400J-6BLI and MT48LC16M16A2P-6A:G, W9825G6JB-6I offers tighter tRP/tRC timing, native industrial qualification, and TFBGA-54 mechanical stability-making it optimal for safety-critical or thermally demanding embedded systems where layout reuse and long-term supply continuity are mandatory.

Availability

W9825G6JB-6I is available at Aetrix Electronics and suitable for automotive ECU, industrial HMI, railway signaling, and medical imaging subsystems requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9825G6JB-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and SDRAM products for industrial, automotive, and communications markets.

The W9825G6JB series targets cost-sensitive, high-reliability embedded systems needing JEDEC-compliant SDRAM with extended temperature support and compact TFBGA packaging-designed specifically for automotive body electronics and factory automation controllers.

FAQ

What is the maximum operating frequency and CAS latency supported by W9825G6JB-6I?

W9825G6JB-6I is rated for 166 MHz operation with CAS Latency 3 across its full industrial temperature range (–40°C to +85°C). It does not support CL2 operation-unlike the commercial-grade W9825G6JB-6 variant-which is limited to 133 MHz/CL2 or 166 MHz/CL3. The -6I speed grade guarantees CL3 timing stability under worst-case thermal and voltage conditions.

Does W9825G6JB-6I support both sequential and interleaved burst addressing modes?

Yes, W9825G6JB-6I supports both sequential and interleaved burst addressing modes, configured via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleaved mode toggles LSBs in defined patterns-enabling optimized access for cache-line-aligned or scatter-gather workloads. The mode setting persists until reprogrammed and applies uniformly across all burst operations.

How does the auto-precharge function operate in W9825G6JB-6I during a read command?

In W9825G6JB-6I, auto-precharge is triggered during a READ command when A10 is asserted high at command registration. The device executes the full burst read normally but initiates internal precharge before burst completion-starting tRP cycles prior to final data output. This eliminates the need for a separate PRECHARGE command, reducing command bus utilization and improving bandwidth efficiency in page-mode access patterns.

What are the power supply requirements for W9825G6JB-6I, and why are VDDQ and VDD separate?

W9825G6JB-6I requires two 3.3V ±0.3V supplies: VDD for core logic and VDDQ for I/O buffers. Separation prevents switching noise from DQ drivers from coupling into sensitive internal circuitry, maintaining timing margin and signal integrity. Decoupling capacitors must be placed independently on each rail, with VDDQ typically routed closer to DQ balls to minimize inductance in high-speed data paths.

Can W9825G6JB-6I enter Self Refresh mode while maintaining data integrity during system suspend?

Yes, W9825G6JB-6I supports Self Refresh mode, drawing less than 2 mA while retaining full memory contents without external clocks or refresh commands. Entry requires all banks to be idle and CKE held low with /CS, /RAS, /CAS low and /WE high. Exit occurs when CKE returns high, followed by tXSR delay before new commands-enabling reliable low-power suspend in battery-backed industrial gateways and portable diagnostic tools.

W9825G6JB-6I Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: LVTTL

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TFBGA (8x8)

W9825G6JB-6I FAQ

1.How can I place an order for W9825G6JB-6I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G6JB-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G6JB-6I reliable?

The price and inventory of W9825G6JB-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6JB-6I is usually 5 days.

3.What payment methods are accepted for W9825G6JB-6I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6JB-6I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G6JB-6I?

W9825G6JB-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G6JB-6I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G6JB-6I?

For technical support, including W9825G6JB-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6JB-6I requirements.

6.How does Aetrix verify that W9825G6JB-6I is sourced from the original manufacturer or authorized distributors?

All W9825G6JB-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6JB-6I meets industry standards.

7.What is the process for return or replacement of W9825G6JB-6I?

All W9825G6JB-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6JB-6I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G6JB-6I part is unused and in its original packaging.

Return procedure for W9825G6JB-6I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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