Winbond Electronics Corporation W9825G6JB-6I TR
- Part No.:
- W9825G6JB-6I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TFBGA
- Datasheet:
-
W9825G6JB-6I TR.pdf
- Description:
- IC DRAM 256MBIT LVTTL 54TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9825G6JB-6I TR from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V LVTTL interface, and industrial temperature range (–40°C to +85°C). It delivers 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for embedded main memory in real-time control systems.
For engineers reviewing the W9825G6JB-6I TR datasheet, W9825G6JB-6I TR pinout, W9825G6JB-6I TR application, or W9825G6JB-6I TR equivalent, key selection criteria include guaranteed industrial-temperature operation, TFBGA-54 package compatibility, self-refresh power management, and precise tRCD/tRP/tRC timing compliance for deterministic memory controller design.
Technical Context
This SDRAM implements four independent 4M-word banks with interleaved access capability to hide precharge latency. Its programmable Mode Register configures burst type (sequential/interleave), length, and CAS latency-enabling optimization for sequential streaming or random-access workloads.
It supports auto-precharge, controlled precharge, and self-refresh modes with 8K refresh cycles per 64 ms. The device uses separate VDDQ/VSSQ rails to isolate I/O noise and requires strict CKE-controlled entry/exit from Power Down and Clock Suspend modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum command rate and data throughput |
| CAS Latency | CL = 3 - fixes read data valid delay from column address strobe edge |
| Burst Length | 1, 2, 4, 8, or full page - determines consecutive column accesses per command |
| Operating Temperature | –40°C to +85°C - validated for industrial environments without derating |
| Supply Voltage | 3.3 V ± 0.3 V - requires stable LVTTL-compatible power rail with decoupling |
| Refresh Requirement | 8,192 cycles / 64 ms - mandates controller-initiated CBR refresh every 7.8 µs average interval |
| Package | TFBGA-54 (8 mm × 8 mm, 0.8 mm pitch) - surface-mount footprint with ball grid layout |
Pinout & Package
W9825G6JB-6I TR uses a 54-ball thin fine-pitch BGA (TFBGA) package with 8 mm × 8 mm body size and 0.8 mm ball pitch. Ball assignments follow JEDEC-standard SDRAM pinout conventions with dedicated address, bank select, command, clock, data, and power/ground terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Multiplexed row/column address lines; A10 controls all-bank precharge when high during command |
| BS0, BS1 | Bank Select | Two-bit encoding selects one of four internal banks for activation or access |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with LDQM/UDQM masking for byte-level write control |
| /CS, /RAS, /CAS, /WE | Command Control | Active-low signals decoded on CLK rising edge to execute bank activate, read, write, precharge, etc. |
| CLK, CKE | Timing Control | CLK synchronizes all inputs; CKE gates clock domain entry into Power Down, Self Refresh, or Clock Suspend |
| VDD, VDDQ, VSS, VSSQ | Power Distribution | Separate core (VDD/VSS) and I/O (VDDQ/VSSQ) supplies reduce switching noise coupling to data lines |
| LDQM, UDQM | Data Mask | Input-sampled masks for lower/upper 8-bit bytes during write; tri-states DQ outputs during read when high |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Range | –40°C to +85°C operation fully characterized - eliminates thermal derating in harsh environments |
| Programmable Burst Mode | Configurable sequential or interleave addressing - matches memory controller access patterns for optimal bandwidth |
| Auto-Precharge Support | Automatic bank closure after read/write via A10 assertion - reduces manual command overhead and improves efficiency |
| Separate I/O Power Rails | VDDQ/VSSQ isolation - maintains signal integrity on DQ lines during high-speed toggling |
| Low-Power Self-Refresh | On-chip refresh timing with CKE control - enables extended standby without external refresh controller |
| LVTTL-Compatible Interface | 3.3V signaling with VIH ≥ 2.0 V, VIL ≤ 0.8 V - interoperable with standard FPGA and ASIC memory controllers |
Applications
| Industrial PLC Memory | Automotive ADAS Logging |
|---|---|
Use Scenario: Real-time ladder logic execution and I/O state buffering in programmable logic controllers requiring deterministic memory access under wide temperature swings. IC Role / Device Role / Timing Role: Main system RAM interfaced directly to ARM Cortex-M7 or RISC-V MCU with tight tRCD/tRP timing constraints. Use Value: Guaranteed –40°C to +85°C operation and 166 MHz CL3 performance enable sub-100 ns read latency without thermal throttling or timing margin loss. |
Use Scenario: High-speed sensor data capture and ring-buffer storage for camera/radar fusion modules in autonomous driving ECUs. IC Role / Device Role / Timing Role: Burst-capable frame buffer supporting interleaved bank reads to sustain >1 Gbps sustained bandwidth during multi-sensor ingestion. Use Value: Full-page burst mode and auto-precharge minimize command overhead, enabling continuous streaming without CPU intervention. |
| Medical Imaging Controller | Avionics Display Buffer |
Use Scenario: Pixel data staging for ultrasound or X-ray image reconstruction pipelines where data coherency and timing predictability are safety-critical. IC Role / Device Role / Timing Role: Coherent memory subsystem synchronized to imaging processor clock with precise CAS latency alignment. Use Value: Self-refresh mode with traceable 64 ms refresh window ensures zero data loss during brief power interruptions per IEC 62304 requirements. |
Use Scenario: Frame buffer for DO-178C-certified cockpit displays requiring radiation-tolerant timing behavior and long-term supply stability. IC Role / Device Role / Timing Role: Deterministic latency SDRAM used as dual-port video memory with strict tRC/tRRD timing enforcement. Use Value: TFBGA-54 package provides mechanical reliability under vibration; industrial-grade qualification supports 15+ year lifecycle commitments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16400J-6BLI | Same 128 Mbit organization, 166 MHz/CL3, but uses 54-ball FBGA with different ball map (non-pin-compatible) | Requires PCB redesign due to shifted DQ/VDDQ locations; identical timing and command set | Select if sourcing flexibility is prioritized over drop-in replacement; verify layout adaptation for DQ routing and power plane splits |
| MT48LC16M16A2P-6A:G | 166 MHz/CL3, 128 Mbit, but TSOP-54 package - no TFBGA option; higher tAC and relaxed tRCD | Suitable for cost-sensitive non-space-constrained designs; incompatible with fine-pitch BGA assembly | Choose only for legacy board refreshes where TFBGA is not feasible; avoid for new industrial designs requiring compactness |
Compared with IS42S16400J-6BLI and MT48LC16M16A2P-6A:G, W9825G6JB-6I TR offers identical speed-grade performance in a smaller TFBGA footprint with validated industrial temperature support - making it optimal for new space- and reliability-constrained designs where pinout reuse is possible.
Availability
W9825G6JB-6I TR is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS loggers, medical imaging controllers, avionics display buffers, and real-time embedded systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9825G6JB-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and SDRAM for industrial, automotive, and computing markets.
W9825G6JB-6I TR belongs to Winbond's industrial-grade SDRAM product line, designed specifically for high-reliability embedded applications demanding guaranteed operation from –40°C to +85°C with robust timing margins and long-term supply assurance.
FAQ
What is the maximum supported clock frequency for W9825G6JB-6I TR?
W9825G6JB-6I TR is rated for 166 MHz operation with CAS Latency 3, as confirmed by its speed grade suffix "-6I" and electrical characterization in Section 9.5 of the datasheet. This frequency defines the upper limit for command issuance and data transfer rates, and must be maintained with tCK ≥ 6 ns and proper setup/hold timing on all control and address signals relative to CLK.
Does W9825G6JB-6I TR support self-refresh mode, and how is it initiated?
Yes, W9825G6JB-6I TR supports self-refresh mode. It is initiated by asserting /CS, /RAS, /CAS, and CKE low while holding /WE high on a CLK rising edge. Once entered, the device internally manages all refresh cycles using its on-chip timer, and CKE must remain low until exit. Exit occurs when CKE returns high, followed by tXSR delay before accepting new commands.
What is the function of the LDQM and UDQM pins on W9825G6JB-6I TR?
LDQM (Lower Data Queue Mask) and UDQM (Upper Data Queue Mask) provide byte-level write masking for the 16-bit DQ bus. When sampled high during a write cycle, LDQM masks DQ0–DQ7 and UDQM masks DQ8–DQ15, blocking corresponding byte writes with zero latency. During read cycles, they place the respective DQ byte outputs in high-impedance state after CAS latency delay.
Is W9825G6JB-6I TR pin-compatible with other Winbond SDRAMs like W9825G6KH?
No, W9825G6JB-6I TR is not pin-compatible with W9825G6KH. Although both are 128 Mbit SDRAMs, W9825G6KH uses a 60-ball TFBGA package with different ball assignment (e.g., additional VDD/VSS balls), whereas W9825G6JB-6I TR uses 54-ball TFBGA with distinct pin mapping per Section 4 and 5 of its datasheet - requiring separate PCB layout.
What does the "TR" suffix indicate in W9825G6JB-6I TR?
The "TR" suffix in W9825G6JB-6I TR denotes tape-and-reel packaging format per JEDEC standards - indicating the part is supplied on embossed plastic carrier tape in standard 13-inch reels, optimized for automated SMT placement. It does not affect electrical or thermal specifications; the "-6I" portion defines speed grade and temperature rating.
W9825G6JB-6I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- LVTTL
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TFBGA (8x8)
W9825G6JB-6I TR FAQ
1.How can I place an order for W9825G6JB-6I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9825G6JB-6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9825G6JB-6I TR reliable?
The price and inventory of W9825G6JB-6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6JB-6I TR is usually 5 days.
3.What payment methods are accepted for W9825G6JB-6I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6JB-6I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9825G6JB-6I TR?
W9825G6JB-6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9825G6JB-6I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9825G6JB-6I TR?
For technical support, including W9825G6JB-6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6JB-6I TR requirements.
6.How does Aetrix verify that W9825G6JB-6I TR is sourced from the original manufacturer or authorized distributors?
All W9825G6JB-6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6JB-6I TR meets industry standards.
7.What is the process for return or replacement of W9825G6JB-6I TR?
All W9825G6JB-6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6JB-6I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9825G6JB-6I TR part is unused and in its original packaging.
Return procedure for W9825G6JB-6I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9825G6JB-6I TR Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
Microchip Technology
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