Winbond Electronics Corporation W9825G6JB-6 TR
- Part No.:
- W9825G6JB-6 TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TFBGA
- Datasheet:
-
W9825G6JB-6 TR.pdf
- Description:
- IC DRAM 256MBIT PAR 54TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9825G6JB-6 TR from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3 or 133 MHz with CAS Latency 2, supporting LVTTL interface, burst lengths of 1/2/4/8/full-page, and auto-precharge functionality. It serves as main memory in embedded controllers and industrial human-machine interfaces requiring deterministic timing and multi-bank interleaving.
For engineers reviewing the W9825G6JB-6 TR datasheet, W9825G6JB-6 TR pinout, W9825G6JB-6 TR application, or W9825G6JB-6 TR equivalent, key selection criteria include its TFBGA-54 (8×8 mm²) package, 3.3V ±0.3V supply, self-refresh capability, and compatibility with standard SDRAM controllers in automotive-grade temperature range (0°C to 70°C).
Technical Context
This SDRAM implements four independent memory banks with row/column address multiplexing via A0–A12 pins and bank selection via BS0/BS1. Its command decoder interprets RAS/CAS/WE/CS combinations on CLK rising edges to execute bank activate, read/write, precharge, auto-refresh, and self-refresh operations.
Internal timing is governed by programmable Mode Register settings for burst type (sequential/interleave), burst length, and CAS latency. The device supports seamless interleaved access across banks to hide tRCD and tRP delays, and uses separate VDDQ/VSSQ rails to isolate I/O noise from core logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 4 banks × 16 bits - delivers 8 MB total capacity with bank-level parallelism for throughput optimization. |
| Max Clock Frequency | 166 MHz - enables 166 million words/sec peak bandwidth when configured for CL3 timing. |
| CAS Latency | CL2 or CL3 - determines fixed clock-cycle delay between column address strobe and first valid data output; impacts real-time latency in control loops. |
| Burst Length | 1, 2, 4, 8, or full page - allows flexible trade-off between burst efficiency and address overhead in sequential data transfers. |
| Refresh Requirement | 8,192 cycles per 64 ms - mandates periodic refresh commands to retain data; supported via auto-refresh or self-refresh modes. |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with legacy 3.3V logic families without level-shifting; VDDQ rail decoupled for signal integrity. |
| Operating Temperature | 0°C to 70°C - validated for commercial/industrial ambient conditions; -6I variant extends to -40°C to +85°C. |
| Package | TFBGA-54 (8×8 mm², 0.8 mm pitch) - surface-mount footprint with ball grid for high-density PCB layout and thermal dissipation. |
Pinout & Package
W9825G6JB-6 TR is housed in a lead-free, RoHS-compliant TFBGA-54 package (8 mm × 8 mm, 0.8 mm ball pitch) with exposed pad for thermal management. Ball assignments follow JEDEC-standard SDRAM pinout conventions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Multiplexed row/column address lines; A10 controls all-bank vs. single-bank precharge when sampled during command decode. |
| BS0, BS1 | Bank Select | Determines which of four internal banks is activated or accessed during row/column operations. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; LDQM/UDQM enable byte-level masking for partial writes without read-modify-write. |
| /CS, /RAS, /CAS, /WE | Command Control | Active-low signals decoded on CLK rising edge to initiate bank activate, read, write, precharge, or mode register set. |
| CLK, CKE | Timing Control | CLK synchronizes all inputs; CKE gates internal clock - low entry triggers power-down or self-refresh modes. |
| VDD, VDDQ, VSS, VSSQ | Power/Ground | Dual-supply architecture: VDD/VSS for core logic, VDDQ/VSSQ for I/O buffers to suppress switching noise on data lines. |
| LDQM, UDQM | Data Mask | Input/output mask pins - high during read places DQ in Hi-Z; high during write blocks corresponding byte write. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Mode Register | Enables runtime configuration of burst length, CAS latency, and burst type (sequential/interleave) without hardware change. |
| Auto-precharge | Automatically initiates bank precharge after read/write completion when A10 is asserted, reducing software overhead in streaming applications. |
| Self Refresh Mode | Retains data with <2 mA current draw while external clocks are halted - essential for low-power suspend states in portable systems. |
| Interleaved Bank Access | Allows concurrent activation of multiple banks to overlap tRCD and tRP delays, sustaining >80% theoretical bandwidth in burst-heavy workloads. |
| LVTTL-Compatible Interface | Direct connection to 3.3V microcontrollers and FPGAs without level shifters; VIH/VIL thresholds ensure noise margin in electrically noisy environments. |
Applications
| Industrial HMI Display Buffer | Automotive Instrument Cluster Memory |
|---|---|
Use Scenario: Storing frame buffer data for 800×480 LCD panels in factory-floor operator terminals with real-time update requirements. IC Role / Device Role / Timing Role: Main memory for graphics controller; provides burst-mode pixel streaming with CL3 latency to meet 60 Hz refresh deadlines. Use Value: Four-bank architecture enables background refresh during active display updates, eliminating visible tearing or stutter in motion graphics. | Use Scenario: Holding gauge rendering data and CAN message history in vehicle dashboard ECUs operating across extended temperature ranges. IC Role / Device Role / Timing Role: Non-volatile shadow RAM for safety-critical UI state; operates reliably at 85°C ambient when paired with -6I variant. Use Value: Auto-precharge reduces CPU intervention per write cycle, freeing MCU cycles for sensor fusion and diagnostics execution. |
| Network Router Packet Buffer | Medical Imaging Control Board Memory |
Use Scenario: Temporary storage for ingress/egress packet headers and metadata in Layer 3 switching ASICs with limited on-chip SRAM. IC Role / Device Role / Timing Role: High-bandwidth buffer interfacing directly to MAC-layer logic; supports back-to-back burst reads at 166 MHz. Use Value: Full-page burst mode delivers 128-byte aligned transfers matching Ethernet MTU boundaries, minimizing bus arbitration overhead. | Use Scenario: Frame storage for ultrasound image acquisition modules where deterministic latency affects Doppler signal processing accuracy. IC Role / Device Role / Timing Role: Low-jitter memory subsystem synchronized to ADC sampling clock; CL2 mode used for sub-100 ns timing-critical accesses. Use Value: Separate VDDQ/VSSQ rails prevent analog front-end noise coupling into digital memory paths, preserving SNR in RF-sensitive designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16400F-6BLI | Same 4M×16 organization, TFBGA-54, 166 MHz/CL3; requires different mode register initialization sequence. | Validated for industrial temp (-40°C to +85°C); lacks explicit automotive qualification documentation. | Select when broader temperature support is required and controller firmware can accommodate alternate MR setup. |
| MT48LC4M16A2P-6A | Identical pinout and electrical specs; same 166 MHz/CL3 rating but rated only to 70°C; higher typical IDD current (3.5 mA vs. 2 mA in self-refresh). | Legacy Micron part with mature supply chain; no automotive grade option available. | Choose for cost-sensitive commercial designs where self-refresh current budget permits higher leakage. |
Compared with W9825G6JB-6 TR, IS42S16400F-6BLI offers wider temperature range but demands firmware adaptation, while MT48LC4M16A2P-6A matches pinout and speed exactly but consumes more power in low-power states and lacks automotive validation.
Availability
W9825G6JB-6 TR is available at Aetrix Electronics and suitable for industrial HMI, automotive instrument clusters, and network infrastructure equipment requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for W9825G6JB-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in memory ICs, flash storage, and security solutions, with over 30 years of DRAM design heritage.
The W9825G6JB series targets cost-sensitive, high-reliability embedded systems requiring automotive-grade SDRAM performance in compact TFBGA packages - optimized for controller-based memory subsystems with minimal external logic.
FAQ
What is the maximum data bandwidth achievable with W9825G6JB-6 TR?
W9825G6JB-6 TR achieves up to 166 million words per second, translating to 332 MB/s with its 16-bit bus width at 166 MHz clock frequency and CL3 timing. This bandwidth assumes continuous full-page bursts with zero wait states and optimal bank interleaving - actual throughput depends on command scheduling efficiency and refresh overhead in the host controller.
Does W9825G6JB-6 TR support both sequential and interleaved burst addressing modes?
Yes, W9825G6JB-6 TR supports both sequential and interleaved burst addressing modes, configurable via the Mode Register. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleaved mode toggles specific address bits (A0–A2) to enable cache-friendly access patterns. The choice affects memory controller address generation logic and must match the configured burst length.
How does the auto-precharge function operate in W9825G6JB-6 TR during a read command?
In W9825G6JB-6 TR, auto-precharge activates when A10 is high during a read command. The SDRAM begins internal precharge before burst completion - specifically, it starts tRP cycles prior to the final data output, determined by CAS latency. This eliminates the need for a separate precharge command, reducing command overhead in streaming applications but prohibiting interruption of the burst cycle.
What is the purpose of separate VDDQ and VSSQ pins on W9825G6JB-6 TR?
W9825G6JB-6 TR uses dedicated VDDQ and VSSQ pins to isolate I/O buffer power from core logic supplies. This separation minimizes switching noise coupling from data bus activity into sensitive internal circuitry, improving signal integrity and timing margin - especially critical for reliable operation at 166 MHz with tight setup/hold windows on DQ lines.
Can W9825G6JB-6 TR be used in systems requiring extended temperature operation beyond 70°C?
No, W9825G6JB-6 TR is specified for 0°C to 70°C operation. For extended temperature support, Winbond offers the W9825G6JB-6I variant, which is fully compatible pin-for-pin and electrically identical but guaranteed to operate from -40°C to +85°C. Using W9825G6JB-6 TR outside its rated range may result in data retention failure or timing violations.
W9825G6JB-6 TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TFBGA (8x8)
W9825G6JB-6 TR FAQ
1.How can I place an order for W9825G6JB-6 TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9825G6JB-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9825G6JB-6 TR reliable?
The price and inventory of W9825G6JB-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6JB-6 TR is usually 5 days.
3.What payment methods are accepted for W9825G6JB-6 TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6JB-6 TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9825G6JB-6 TR?
W9825G6JB-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9825G6JB-6 TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9825G6JB-6 TR?
For technical support, including W9825G6JB-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6JB-6 TR requirements.
6.How does Aetrix verify that W9825G6JB-6 TR is sourced from the original manufacturer or authorized distributors?
All W9825G6JB-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6JB-6 TR meets industry standards.
7.What is the process for return or replacement of W9825G6JB-6 TR?
All W9825G6JB-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6JB-6 TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9825G6JB-6 TR part is unused and in its original packaging.
Return procedure for W9825G6JB-6 TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9825G6JB-6 TR Tags

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