Winbond Electronics Corporation W9825G6JH-6I
- Part No.:
- W9825G6JH-6I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9825G6JH-6I.pdf
- Description:
- IC DRAM 256MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9825G6JH-6I from Winbond Electronics is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V supply, and industrial temperature range (−40°C to +85°C). It supports burst lengths of 1/2/4/8/full page, auto-precharge, and self-refresh - deployed as main memory in embedded controllers, industrial HMIs, and legacy PC-compatible systems.
For engineers reviewing the W9825G6JH-6I datasheet, W9825G6JH-6I pinout, W9825G6JH-6I application, or W9825G6JH-6I equivalent, key selection criteria include industrial-grade thermal reliability, TSOP II 54-pin compatibility, LVTTL interface timing compliance, and burst-mode memory bandwidth matching for real-time data buffering in deterministic systems.
Technical Context
The W9825G6JH-6I implements a fully synchronous architecture synchronized to the rising edge of CLK, with command decoding governed by CS, RAS, CAS, and WE. Its four independent banks enable interleaved access to hide precharge latency (tRP = 20 ns min), while the programmable Mode Register configures burst type (sequential/interleave), length, and CAS latency.
It supports multiple low-power states: Power Down mode (CKE-driven, no refresh), Self Refresh (internal oscillator maintains refresh, CKE low), and Clock Suspend (active bank freeze). Data integrity is maintained via separate VDDQ/VSSQ I/O power domains and LDQM/UDQM per-byte masking - critical for mixed-signal system integration where noise immunity is non-negotiable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity; enables 2 MB addressable space per bank with page-based burst efficiency. |
| Clock Frequency | 166 MHz maximum; delivers 332 MB/s peak bandwidth (16-bit bus × 166 MHz) for real-time frame buffering in video controllers. |
| CAS Latency | CL = 3 cycles; defines fixed read-data-to-clock delay - constrains minimum controller pipeline depth and impacts real-time interrupt response latency. |
| Burst Length | Configurable 1/2/4/8/full page; full-page burst accesses all 512 columns in a row without address re-latching - reduces command overhead in streaming applications. |
| Refresh Rate | 8K cycles / 64 ms (7.8 µs interval); mandates precise external or internal refresh scheduling to prevent data retention loss over temperature. |
| Operating Temperature | −40°C to +85°C; qualified for industrial environments including factory automation PLCs and outdoor kiosks without derating. |
| Supply Voltage | 3.3V ± 0.3V (VDD/VDDQ); requires dual-rail regulation with <100 mV ripple to meet VIH/VIL thresholds across temperature. |
Pinout & Package
W9825G6JH-6I is housed in a 54-pin TSOP II (400 mil) package with 0.80 mm pitch, RoHS-compliant lead-free finish. Pin layout follows JEDEC standard for 16-bit SDRAM, with dedicated DQ[0:15], address (A0–A12), bank select (BS0/BS1), and control signals (CS, RAS, CAS, WE, CKE, CLK).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Row/Column Address Input | Multiplexed address bus: A0–A12 latch row on ACTIVE; A0–A8 latch column on READ/WRITE - requires external address demux logic. |
| BS0, BS1 | Bank Select Input | Selects one of four internal banks during row activation or column access - enables true bank interleaving to overlap tRP with active cycles. |
| DQ0–DQ15 | Data I/O Bidirectional Bus | 16-bit parallel data path; LDQM masks lower byte, UDQM masks upper byte - supports partial writes without read-modify-write overhead. |
| CS, RAS, CAS, WE | Command Decode Inputs | Four-signal command encoding per JEDEC SDRAM spec; determines operation (e.g., LOW/LOW/HIGH/LOW = PRECHARGE) on every CLK rising edge. |
| CKE | Clock Enable Control | Gates internal clock domain; LOW enters Power Down or Self Refresh - must be held HIGH ≥1 cycle before issuing commands after wake-up. |
| CLK | System Clock Input | Synchronizes all command, address, and data transfers; requires matched trace length and <100 ps skew vs. control signals for setup/hold compliance. |
| VDD / VSS | Core Logic Power/Ground | 3.3V supply for command decoder, address buffers, and control logic - decoupling capacitors required within 5 mm of pins 1/14/27. |
| VDDQ / VSSQ | I/O Buffer Power/Ground | Isolated 3.3V rail for DQ drivers/receivers - prevents switching noise from corrupting data reads during high-speed bursts. |
| LDQM / UDQM | Lower/Upper Byte Mask | Assert HIGH to disable output drivers (read) or block write data (write) with zero latency - essential for 8-bit peripheral interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Range | Rated −40°C to +85°C operation without performance derating - eliminates thermal margining in uncontrolled enclosures. |
| Separate I/O Power Domain (VDDQ/VSSQ) | Reduces DQ bus noise coupling by isolating output driver transients from core logic - improves signal integrity at 166 MHz burst rates. |
| Programmable Burst Mode | Supports sequential or interleave addressing per Mode Register setting - allows optimization for linear streaming (sequential) or random-access cache line fills (interleave). |
| Auto-Precharge on Read/Write | Automatic bank close triggered by A10 HIGH during command - eliminates explicit PRECHARGE issuance, reducing controller firmware complexity. |
| Self-Refresh with Internal Oscillator | Maintains data retention during host sleep using on-die RC oscillator - removes need for external refresh controller in battery-backed systems. |
Applications
| Industrial HMI Memory | Legacy PC Embedded Controller |
|---|---|
Use Scenario: Touchscreen-based human-machine interface in factory floor equipment requiring persistent display buffer storage across thermal cycling. IC Role / Device Role / Timing Role: Main memory storing GUI frame buffers and configuration data; operates in burst-length-4 sequential mode with CL3 timing for deterministic pixel fetch latency. Use Value: −40°C to +85°C rating ensures uninterrupted operation during ambient swings; TSOP II footprint simplifies replacement in existing PCB layouts. | Use Scenario: Memory subsystem in x86-compatible single-board computer used in railway signaling cabinets. IC Role / Device Role / Timing Role: System RAM interfaced to Intel 440BX-equivalent chipset; relies on auto-precharge and 166 MHz clock to meet PCI bus bandwidth requirements. Use Value: Pin-compatible with prior -6/-5 grades - enables drop-in upgrade to extended temperature without redesign; LVTTL interface avoids level-shifter cost. |
| Video Frame Buffer | Medical Diagnostic Equipment Cache |
Use Scenario: Real-time video capture module in ultrasound imaging device buffering raw sensor frames before DSP processing. IC Role / Device Role / Timing Role: High-bandwidth frame store using full-page burst reads; leverages four-bank interleaving to sustain >300 MB/s effective throughput. Use Value: 16-bit bus width matches common image sensor parallel outputs; separate VDDQ/VSSQ suppresses EMI-induced artifacts in analog front-end sections. | Use Scenario: Temporary data staging memory in portable ECG analyzer performing on-device waveform analysis. IC Role / Device Role / Timing Role: Low-power working memory entering Self Refresh during patient idle periods; wakes synchronously on interrupt with <500 ns latency. Use Value: 2 mA max self-refresh current extends battery life; industrial temp grade supports sterilization cycle exposure without data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16400J-6BLI | Same 4M×4×16 organization, 166 MHz, −40°C to +85°C, but uses 54-pin TSOP II with identical pinout and timing. | Drop-in replacement with identical AC/DC specs and JEDEC compliance; validated in same industrial controller reference designs. | Select when second-source assurance is required; shares identical PCB footprint and timing margins. |
| MT48LC4M16A2P-6A:G | 166 MHz, CL3, −40°C to +85°C, but rated for 3.3V ± 0.2V (tighter tolerance) and has longer tRC (60 ns vs. 55 ns). | Requires minor controller timing adjustment for tRC and tRAS; suitable where higher voltage stability is mandated. | Choose for automotive-adjacent applications needing tighter VDD regulation; not pin-compatible due to different TSOP II pin 40 assignment. |
Compared with IS42S16400J-6BLI and MT48LC4M16A2P-6A:G, the W9825G6JH-6I offers identical industrial temperature support and TSOP II mechanical fit, but provides broader VDD tolerance (±0.3V) and shorter tRC - easing power design and improving worst-case timing margin in thermally stressed systems.
Availability
W9825G6JH-6I is available at Aetrix Electronics and suitable for industrial HMIs, legacy PC embedded controllers, and medical diagnostic equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9825G6JH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, PSRAM, and SDR/DDR SDRAM for industrial and embedded markets.
The W9825G6JH series targets cost-sensitive, thermally demanding applications where JEDEC-compliant SDRAM functionality is needed without DDR complexity - emphasizing reliability, long-term availability, and drop-in compatibility with legacy designs.
FAQ
What is the maximum clock frequency supported by the W9825G6JH-6I?
The W9825G6JH-6I is rated for a maximum clock frequency of 166 MHz, compliant with the 166 MHz/CL3 specification. This speed is guaranteed across its full industrial temperature range (−40°C to +85°C), and timing parameters such as tAC (access time), tRC (row cycle time), and tRCD (RAS-to-CAS delay) are specified at this frequency. The -6I suffix explicitly denotes industrial qualification, distinguishing it from commercial-grade variants like the -6 or -5.
Does the W9825G6JH-6I support auto-precharge, and how is it enabled?
Yes, the W9825G6JH-6I supports auto-precharge on both read and write commands. It is enabled by asserting A10 HIGH during the issuance of a READ or WRITE command. When activated, the SDRAM automatically initiates precharge of the accessed bank before the burst completes - eliminating the need for a separate PRECHARGE command. This feature reduces command overhead and simplifies controller firmware, especially in burst-intensive applications like frame buffering.
What package type and pin count does the W9825G6JH-6I use?
The W9825G6JH-6I uses a 54-pin TSOP II (Thin Small Outline Package, Type II) with 400-mil body width and 0.80 mm lead pitch. This JEDEC-standard package features gull-wing leads and is RoHS-compliant with lead-free terminations. Its pinout matches industry-standard 16-bit SDRAMs, enabling direct PCB footprint compatibility with alternatives such as the IS42S16400J-6BLI.
How does the W9825G6JH-6I handle power management in low-power modes?
The W9825G6JH-6I supports three distinct low-power states: Power Down (CKE low, clocks gated, no refresh), Clock Suspend (CKE low while bank active, clocks halted mid-operation), and Self Refresh (CKE low, internal oscillator sustains 8K refresh cycles/64 ms). In Self Refresh, the device maintains data integrity autonomously - critical for battery-powered or host-sleep scenarios. Exit from any mode requires defined stabilization delays (e.g., tXSR after Self Refresh exit) before valid commands may be issued.
What is the memory organization and total density of the W9825G6JH-6I?
The W9825G6JH-6I is organized as 4,194,304 words × 4 banks × 16 bits, resulting in a total density of 128 Mbit (16 MByte). Each bank contains 1,048,576 words (1 MWord), and rows are 512 columns deep. This structure supports efficient page-mode access and bank interleaving - allowing concurrent row activation across banks to hide precharge latency and sustain high effective bandwidth in streaming workloads.
W9825G6JH-6I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
W9825G6JH-6I FAQ
1.How can I place an order for W9825G6JH-6I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9825G6JH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9825G6JH-6I reliable?
The price and inventory of W9825G6JH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6JH-6I is usually 5 days.
3.What payment methods are accepted for W9825G6JH-6I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6JH-6I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9825G6JH-6I?
W9825G6JH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9825G6JH-6I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9825G6JH-6I?
For technical support, including W9825G6JH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6JH-6I requirements.
6.How does Aetrix verify that W9825G6JH-6I is sourced from the original manufacturer or authorized distributors?
All W9825G6JH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6JH-6I meets industry standards.
7.What is the process for return or replacement of W9825G6JH-6I?
All W9825G6JH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6JH-6I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9825G6JH-6I part is unused and in its original packaging.
Return procedure for W9825G6JH-6I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9825G6JH-6I Tags

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