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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9825G6JH-6I TR

Name: W9825G6JH-6I TR
Brand: Winbond Electronics Corporation
SKU: W9825G6JH-6I TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9825G6JH-6I TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TSOP (0.400", 10.16mm Width)

Datasheet:: W9825G6JH-6I TR.pdf

Description:: IC DRAM 256MBIT PAR 54TSOP II

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Product details

Overview

W9825G6JH-6I TR from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V supply, TSOP II-54 package, and industrial temperature range (–40°C to +85°C). It serves as main memory in embedded controllers, network interface cards, and multimedia processors requiring burst-access bandwidth and low-power self-refresh.

For engineers reviewing the W9825G6JH-6I TR datasheet, W9825G6JH-6I TR pinout, W9825G6JH-6I TR application, or W9825G6JH-6I TR equivalent, key selection criteria include guaranteed industrial-temp operation, LVTTL-compatible timing, programmable burst length (1/2/4/8/full page), auto-precharge support, and TSOP II pin compatibility with legacy SDRAM designs.

Technical Context

This SDRAM implements four independent 4M-word banks with interleaved access capability to hide precharge latency. Its command decoder interprets RAS/CAS/WE/CS combinations on CLK rising edges to execute bank activate, read/write, auto-precharge, self-refresh, and power-down operations.

The device supports both sequential and interleave burst addressing modes, configurable via Mode Register. Internal refresh counter executes 8K cycles per 64 ms, and CKE-controlled clock gating enables power-down and self-refresh modes without external refresh controller intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity
Clock Frequency	166 MHz maximum - defines system bus timing budget and data throughput ceiling
CAS Latency	CL = 3 cycles - determines minimum read-to-data-valid delay after column address strobe
Burst Length	Programmable 1, 2, 4, 8, or full-page - enables optimization for sequential vs. random access patterns
Operating Temperature	–40°C to +85°C - validated for industrial-grade reliability without derating
Supply Voltage	3.3 V ± 0.3 V - compatible with standard LVTTL I/O interfaces and legacy SDRAM controllers
Refresh Rate	8,192 cycles / 64 ms - meets JEDEC JESD21-C requirement for dynamic retention
Package	TSOP II, 54-pin, 400 mil - surface-mount compatible with standard PCB assembly processes

Pinout & Package

W9825G6JH-6I TR uses a 54-pin TSOP II (400 mil) package with separate VDD/VDDQ and VSS/VSSQ rails for logic and I/O domains, plus dedicated LDQM/UDQM pins for byte-level write masking.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Input	Multiplexed row/column address lines; A0–A12 for row, A0–A8 for column
BS0, BS1	Bank Select	Selects one of four internal banks during row activation or column access
DQ0–DQ15	Data I/O	16-bit bidirectional data bus with separate output enable control via DQM
LDQM, UDQM	I/O Mask	Low-byte (DQ0–7) and high-byte (DQ8–15) write/read masking with zero-latency blocking
CLK	System Clock	Synchronizes all command latching and internal state transitions on rising edge
CKE	Clock Enable	Gates internal clock; low = power-down/self-refresh entry, high = normal operation
CS	Chip Select	Enables command decoder; asserted low to accept RAS/CAS/WE commands
RAS, CAS, WE	Command Strobes	Jointly encode all operations (activate, read, write, precharge, refresh, mode set)
VDD, VSS	Core Power/Ground	3.3 V supply and return for internal logic and command decoder
VDDQ, VSSQ	I/O Power/Ground	Isolated 3.3 V supply and return for DQ buffers to reduce switching noise coupling

Key Features

Feature	Design Value
Industrial temperature grade	Validated operation from –40°C to +85°C without performance degradation or timing margin loss
Programmable burst mode	Runtime-selectable sequential or interleave addressing to match memory controller access pattern
Auto-precharge capability	Automatic bank precharge triggered by A10 high during read/write - eliminates external precharge sequencing
Self-refresh with low current	2 mA max standby current in self-refresh - enables battery-backed or low-power hold states
LVTTL-compatible interface	VIH ≥ 2.0 V, VIL ≤ 0.8 V - interoperable with FPGA I/O banks and ASIC memory controllers
Power-down mode	CKE-driven entry/exit with tCKS setup - reduces active power during idle periods without losing state

Applications

Network Interface Card (NIC)	Industrial PLC Memory Buffer
Use Scenario: Storing packet descriptors and frame buffers in 10/100 Mbps Ethernet MAC controllers. IC Role / Device Role / Timing Role: Main working memory interfaced directly to MAC's 16-bit data bus with burst reads for descriptor fetch and burst writes for payload storage. Use Value: 166 MHz clock and CL3 latency enable sustained 332 MB/s bandwidth to keep pace with line-rate traffic without stalling the MAC pipeline.	Use Scenario: Holding real-time I/O mapping tables and ladder logic execution state in programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile shadow RAM accessed by ARM Cortex-M7 core via AXI bus bridge with auto-precharge enabled for efficient page cycling. Use Value: –40°C to +85°C rating ensures deterministic timing across factory-floor thermal swings, eliminating refresh-related data corruption risks.
Set-Top Box Video Frame Buffer	Medical Imaging Data Cache
Use Scenario: Acting as dual-port frame buffer for MPEG-2 video decode engines with simultaneous read (display) and write (decode) access. IC Role / Device Role / Timing Role: Bank-interleaved SDRAM providing concurrent access to separate display and decode pipelines using independent bank activation. Use Value: Four-bank architecture enables seamless interleaving - e.g., reading from Bank 0 while writing to Bank 1 - hiding tRP and tRCD delays.	Use Scenario: Caching raw sensor data from ultrasound transducer arrays before DSP processing in portable diagnostic devices. IC Role / Device Role / Timing Role: Low-power memory subsystem entering self-refresh during acquisition pauses to extend battery life between scans. Use Value: 2 mA self-refresh current allows >12-hour hold time on coin-cell backup, meeting IEC 62304 safety-critical power-loss requirements.

Network Interface Card (NIC)

Industrial PLC Memory Buffer

Use Scenario: Storing packet descriptors and frame buffers in 10/100 Mbps Ethernet MAC controllers.

IC Role / Device Role / Timing Role: Main working memory interfaced directly to MAC's 16-bit data bus with burst reads for descriptor fetch and burst writes for payload storage.

Use Value: 166 MHz clock and CL3 latency enable sustained 332 MB/s bandwidth to keep pace with line-rate traffic without stalling the MAC pipeline.

Use Scenario: Holding real-time I/O mapping tables and ladder logic execution state in programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM accessed by ARM Cortex-M7 core via AXI bus bridge with auto-precharge enabled for efficient page cycling.

Use Value: –40°C to +85°C rating ensures deterministic timing across factory-floor thermal swings, eliminating refresh-related data corruption risks.

Set-Top Box Video Frame Buffer

Medical Imaging Data Cache

Use Scenario: Acting as dual-port frame buffer for MPEG-2 video decode engines with simultaneous read (display) and write (decode) access.

IC Role / Device Role / Timing Role: Bank-interleaved SDRAM providing concurrent access to separate display and decode pipelines using independent bank activation.

Use Value: Four-bank architecture enables seamless interleaving - e.g., reading from Bank 0 while writing to Bank 1 - hiding tRP and tRCD delays.

Use Scenario: Caching raw sensor data from ultrasound transducer arrays before DSP processing in portable diagnostic devices.

IC Role / Device Role / Timing Role: Low-power memory subsystem entering self-refresh during acquisition pauses to extend battery life between scans.

Use Value: 2 mA self-refresh current allows >12-hour hold time on coin-cell backup, meeting IEC 62304 safety-critical power-loss requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16400F-6BLI	Same 4M×4×16 organization, 166 MHz, CL3, but uses 54-pin TSOP II with different pinout (e.g., A10 used for AP not auto-precharge control)	Requires PCB layout change due to A10/AP function reassignment and DQM placement differences	Choose only if redesigning for ISSI's extended temperature validation and tighter tRC/tRP specs
MT48LC4M16A2P-6A:J	Identical speed grade (-6A), same 166 MHz/CL3, but rated 0°C to +70°C only and lacks industrial temp guarantee	Not suitable for uncontrolled ambient deployments; requires thermal derating or heatsinking above 70°C	Select when cost is primary constraint and operating environment stays within commercial temperature range

Compared with W9825G6JH-6I TR, IS42S16400F-6BLI offers tighter AC parameters but demands board revision, while MT48LC4M16A2P-6A:J matches speed but omits industrial temperature assurance - making W9825G6JH-6I TR the sole drop-in option for ruggedized designs needing guaranteed –40°C to +85°C operation.

Availability

W9825G6JH-6I TR is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and telecom infrastructure requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.

Supply support for W9825G6JH-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, PSRAM, and SDR/DDR SDRAM for embedded systems.

The W9825G6JH series targets cost-sensitive, high-reliability applications where industrial temperature range, JEDEC-compliant timing, and TSOP II footprint compatibility are critical - particularly in networking, industrial control, and consumer electronics.

FAQ

What is the maximum clock frequency supported by W9825G6JH-6I TR?

W9825G6JH-6I TR supports a maximum clock frequency of 166 MHz, corresponding to a 6 ns clock period. This speed grade is validated under industrial temperature conditions (–40°C to +85°C) and meets CL3 timing requirements per JEDEC Standard No. 21-C. The -6I suffix explicitly guarantees this performance across the full temperature range without derating.

Does W9825G6JH-6I TR support auto-precharge functionality?

Yes, W9825G6JH-6I TR supports auto-precharge: when A10 is driven high during a READ or WRITE command, the SDRAM automatically initiates precharge of the accessed bank after the burst completes. This eliminates the need for explicit PRECHARGE commands in sequential access patterns and simplifies controller firmware.

What is the purpose of separate VDDQ and VSSQ pins on W9825G6JH-6I TR?

W9825G6JH-6I TR uses dedicated VDDQ and VSSQ pins to isolate the I/O buffer power domain from the core logic supply (VDD/VSS). This separation reduces switching noise coupling from DQ lines into sensitive internal circuitry, improving signal integrity and enabling reliable operation at 166 MHz with LVTTL signaling margins.

Can W9825G6JH-6I TR operate in self-refresh mode without external refresh commands?

Yes, W9825G6JH-6I TR supports autonomous self-refresh mode: after issuing the SELF REFRESH command (CS/RAS/CAS low, WE high, CKE low), the internal refresh counter maintains memory retention without external intervention. Current draw drops to ≤2 mA, and the device remains in this low-power state until CKE is returned high.

How many address pins does W9825G6JH-6I TR require for full memory access?

W9825G6JH-6I TR uses 13 address pins (A0–A12) multiplexed for both row and column addressing. Row addresses use all 13 bits; column addresses use A0–A8 (9 bits). Bank selection is handled separately by BS0 and BS1, making the total effective address space 4 banks × 2¹³ rows × 2⁹ columns × 16 bits = 128 Mbit.

W9825G6JH-6I TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TSOP (0.400", 10.16mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TSOP II

W9825G6JH-6I TR FAQ

1.How can I place an order for W9825G6JH-6I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G6JH-6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G6JH-6I TR reliable?

The price and inventory of W9825G6JH-6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6JH-6I TR is usually 5 days.

3.What payment methods are accepted for W9825G6JH-6I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6JH-6I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G6JH-6I TR?

W9825G6JH-6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G6JH-6I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G6JH-6I TR?

For technical support, including W9825G6JH-6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6JH-6I TR requirements.

6.How does Aetrix verify that W9825G6JH-6I TR is sourced from the original manufacturer or authorized distributors?

All W9825G6JH-6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6JH-6I TR meets industry standards.

7.What is the process for return or replacement of W9825G6JH-6I TR?

All W9825G6JH-6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6JH-6I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G6JH-6I TR part is unused and in its original packaging.

Return procedure for W9825G6JH-6I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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