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Winbond Electronics Corporation W9825G6JH-6 TR

Part No.:
W9825G6JH-6 TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
54-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9825G6JH-6 TR.pdf
Description:
IC DRAM 256MBIT PAR 54TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,301

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Product details

Overview

W9825G6JH-6 TR from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3 or 133 MHz with CAS Latency 2, supporting burst lengths of 1/2/4/8/full page, LVTTL interface, and TSOP II-54 package. It serves as main memory in embedded controllers, industrial HMIs, and legacy PC-compatible systems requiring cost-effective, pin-compatible SDRAM.

For engineers reviewing the W9825G6JH-6 TR datasheet, W9825G6JH-6 TR pinout, W9825G6JH-6 TR application, or W9825G6JH-6 TR equivalent, key selection criteria include guaranteed 166 MHz/CL3 timing at 0°C–70°C, TSOP II-54 mechanical compatibility, self-refresh current ≤2 mA, and support for auto-precharge, power-down, and clock suspend modes.

Technical Context

This SDRAM implements four independent 4M-word banks with row/column address multiplexing via A0–A12, bank selection via BS0/BS1, and command decoding synchronized to CLK rising edges. It supports both sequential and interleave burst addressing modes programmed via the Mode Register.

Functional operation requires strict initialization: 200 µs power-up delay, all-bank precharge, eight auto-refresh cycles, then Mode Register Set. Command execution depends on CS/RAS/CAS/WE logic levels sampled at CLK edges, with tRCD ≥20 ns, tRP ≥20 ns, and tRC ≥60 ns for -6 speed grade.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency166 MHz (CL3) or 133 MHz (CL2); defines maximum sustained data throughput
CAS LatencyProgrammable CL2 or CL3; determines read data valid delay after column address
Burst Length1, 2, 4, 8, or full-page; controls number of consecutive words per read/write command
Refresh Requirement8,192 cycles / 64 ms; mandates periodic refresh to retain data in dynamic cells
Supply Voltage3.3 V ± 0.3 V (VDD/VDDQ); dual-rail design separates core logic and I/O buffers
Operating Temperature0°C to 70°C; validated for commercial-grade industrial control and HMI applications

Pinout & Package

W9825G6JH-6 TR is housed in a 54-pin TSOP II (400 mil) package with 0.80 mm pitch, RoHS-compliant lead-free construction. Pin functions follow JEDEC-standard SDRAM layout with dedicated DQ0–DQ15 data lines, LDQM/UDQM byte masks, and separated VDD/VDDQ and VSS/VSSQ supplies.

Pin/TerminalCircuit RoleDesign Meaning
A0–A12Address InputMultiplexed row/column address lines; A0–A8 used for column, A0–A12 for row
BS0, BS1Bank SelectSelects one of four internal banks during ACTIVATE or READ/WRITE commands
DQ0–DQ15Data I/O16-bit bidirectional data bus; LDQM/UDQM mask lower/upper 8 bits independently
CS, RAS, CAS, WECommand ControlFour active-low control signals defining all operations (ACTIVATE, READ, WRITE, PRECHARGE, etc.)
CLK, CKEClock InterfaceCLK synchronizes all inputs; CKE enables/disables clock domain (Power Down/Self Refresh entry)
VDD, VDDQ, VSS, VSSQPower/GroundDual supply rails isolate core logic (VDD/VSS) from I/O drivers (VDDQ/VSSQ) to reduce switching noise

Key Features

FeatureDesign Value
Self Refresh ModeReduces standby current to ≤2 mA while maintaining data integrity without external refresh controller
Auto-precharge SupportAutomatically initiates bank precharge after burst completion when A10=HIGH, eliminating manual PRECHARGE command overhead
Power Down ModeDisables input receivers (except CKE) to cut dynamic power; requires exit sequence before next command
LVTTL CompatibilityMeets JEDEC JESD8-12E voltage thresholds (VIH ≥2.0 V, VIL ≤0.8 V) for direct interfacing with 3.3 V microcontrollers and FPGAs
Interleaved Bank AccessEnables continuous data streaming across banks by overlapping ACTIVATE → READ → PRECHARGE sequences

Applications

Industrial HMI MemoryLegacy PC BIOS Cache

Use Scenario: Touchscreen-based human-machine interface in factory automation panels with ARM9 or MIPS-based SoC.

IC Role / Device Role / Timing Role: Primary working memory for GUI rendering engine and real-time process data buffering.

Use Value: 166 MHz/CL3 timing ensures ≥266 MB/s peak bandwidth for smooth 640×480 frame updates; TSOP II-54 footprint matches legacy PCB layouts.

Use Scenario: Boot-time cache extension in x86-compatible industrial motherboards using Intel 440BX chipset.

IC Role / Device Role / Timing Role: Secondary SDRAM bank supplementing main memory subsystem during POST and firmware initialization.

Use Value: Pin-compatible replacement for older -5/-6 SDRAMs; supports identical tRCD/tRP/tRC timing margins required by 440BX memory controller.

Embedded Network Router BufferMedical Diagnostic Display Controller

Use Scenario: Packet buffering in low-cost Ethernet switch ASICs with integrated DDR controller.

IC Role / Device Role / Timing Role: Frame buffer for ingress/egress queue management under variable traffic load.

Use Value: Auto-precharge and burst stop enable rapid context switching between packet streams; ≤2 mA self-refresh extends uptime during low-traffic periods.

Use Scenario: Real-time image rendering pipeline in portable ultrasound devices with FPGA-based display processor.

IC Role / Device Role / Timing Role: Dual-port-accessible frame store for simultaneous acquisition and display refresh.

Use Value: Interleaved bank access hides tRP latency, sustaining >100 MB/s sustained bandwidth for 1024×768@60 Hz grayscale video output.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS4C16M16SA-6TCNSame 4M×4×16 organization, 166 MHz/CL3, TSOP II-54, but rated for -40°C to 85°C industrial temp rangeSupports extended temperature environments where W9825G6JH-6 TR's 0°C–70°C rating is insufficientSelect when ambient operating temperature exceeds 70°C or requires wider qualification margin
MT48LC16M16A2P-6A:LIdentical speed grade (-6A), same pinout and timing, but Micron-manufactured with different refresh cycle tolerance (7.8 µs vs 64 ms)Valid drop-in replacement in systems already qualified with Micron SDRAMs; requires verification of tREFI compliancePrefer when existing BOM uses Micron parts or when tighter refresh timing control is needed

Compared with AS4C16M16SA-6TCN and MT48LC16M16A2P-6A:L, W9825G6JH-6 TR offers identical electrical and mechanical compatibility for commercial-temperature designs but lacks extended-temp certification and has looser refresh interval requirements-making it optimal for cost-sensitive, thermally stable embedded applications.

Availability

W9825G6JH-6 TR is available at Aetrix Electronics and suitable for industrial HMIs, legacy PC-compatible systems, and embedded network equipment requiring stable component supply with long-lifecycle support.

Supply support for W9825G6JH-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontroller solutions since 1987.

The W9825G6JH series belongs to Winbond's legacy SDRAM product line, designed specifically for cost-optimized, pin-compatible memory upgrades in industrial and embedded computing platforms.

FAQ

What is the maximum operating frequency supported by the W9825G6JH-6 TR?

The W9825G6JH-6 TR supports two speed configurations: 166 MHz with CAS Latency 3 or 133 MHz with CAS Latency 2. These are guaranteed performance grades defined in the official datasheet revision A02. The -6 suffix explicitly denotes this dual-speed capability, and operation beyond these frequencies violates the device's AC timing specifications-including tRCD ≥20 ns and tRP ≥20 ns-potentially causing read/write failures or data corruption in the W9825G6JH-6 TR.

Does the W9825G6JH-6 TR support automatic refresh, and how is it implemented?

Yes, the W9825G6JH-6 TR requires 8,192 auto-refresh cycles every 64 ms to maintain data integrity. This is implemented via externally generated AUTO REFRESH commands issued by the memory controller at regular intervals. The device does not perform autonomous refresh; instead, it relies on the system controller to assert CS/L, RAS/L, CAS/H, and WE/H at the rising edge of CLK. The W9825G6JH-6 TR internally tracks refresh addresses and increments them per cycle, ensuring all rows are refreshed within the specified window.

Can the W9825G6JH-6 TR be used in place of the W9825G6JH-5 or W9825G6JH-75?

Yes, the W9825G6JH-6 TR is pin- and functionally compatible with W9825G6JH-5 and W9825G6JH-75, sharing identical TSOP II-54 packaging, address/command interface, and register programming model. However, timing margins differ: the -5 grade supports 200 MHz/CL3, while the -75 supports only 133 MHz/CL3. Substituting W9825G6JH-6 TR into a -5-designed system may require reducing clock frequency or adjusting CL settings to meet tRCD/tRP requirements. The W9825G6JH-6 TR remains fully compatible in -75-based designs.

What is the purpose of the LDQM and UDQM pins on the W9825G6JH-6 TR?

LDQM (Lower Data Queue Mask) and UDQM (Upper Data Queue Mask) provide byte-level write masking for the 16-bit DQ0–DQ15 bus. When sampled high during a write cycle, LDQM blocks writes to DQ0–DQ7, and UDQM blocks writes to DQ8–DQ15-enabling partial-word updates without read-modify-write overhead. During reads, asserting either DQM places the corresponding 8-bit segment in high-impedance state, allowing clean bus sharing in multi-device configurations. This functionality is integral to efficient memory management in the W9825G6JH-6 TR.

How does the W9825G6JH-6 TR handle power management during idle periods?

The W9825G6JH-6 TR supports three low-power states: Power Down Mode (CKE low, disables input receivers), Clock Suspend Mode (CKE low while bank active, halts internal clock), and Self Refresh Mode (CKE low + CS/RAS/CAS low, WE high, maintains data with internal oscillator). In Self Refresh, current draw is ≤2 mA, enabling extended battery-backed operation. All modes require specific entry/exit sequences defined in the W9825G6JH-6 TR datasheet-especially tXSR delay after Self Refresh exit-to prevent command collision or data loss.

W9825G6JH-6 TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
54-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-TSOP II

W9825G6JH-6 TR FAQ

1.How can I place an order for W9825G6JH-6 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G6JH-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G6JH-6 TR reliable?

The price and inventory of W9825G6JH-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6JH-6 TR is usually 5 days.

3.What payment methods are accepted for W9825G6JH-6 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6JH-6 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G6JH-6 TR?

W9825G6JH-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G6JH-6 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G6JH-6 TR?

For technical support, including W9825G6JH-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6JH-6 TR requirements.

6.How does Aetrix verify that W9825G6JH-6 TR is sourced from the original manufacturer or authorized distributors?

All W9825G6JH-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6JH-6 TR meets industry standards.

7.What is the process for return or replacement of W9825G6JH-6 TR?

All W9825G6JH-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6JH-6 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G6JH-6 TR part is unused and in its original packaging.

Return procedure for W9825G6JH-6 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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