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Winbond Electronics Corporation W9825G6KH-5

Part No.:
W9825G6KH-5
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
54-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9825G6KH-5.pdf
Description:
IC DRAM 256MBIT PAR 54TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,722

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Product details

Overview

W9825G6KH-5 from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 200 MHz with CAS Latency 3, 3.3V supply, TSOP II-54 package, and LVTTL interface - used as main memory in embedded controllers, industrial HMIs, and legacy PC-compatible systems requiring burst-oriented, multi-bank memory access.

For engineers reviewing the W9825G6KH-5 datasheet, W9825G6KH-5 pinout, W9825G6KH-5 application, or W9825G6KH-5 equivalent, key selection criteria include CL3 timing compliance at 200 MHz, 4-bank interleaving support, programmable burst length (1–8), self-refresh capability (2 mA max), and TSOP II-54 mechanical compatibility with legacy SDRAM sockets.

Technical Context

This SDRAM implements fully synchronous operation latched on the rising edge of CLK, with independent bank activation enabling row-access hiding via interleaved reads/writes across four internal banks. It supports both sequential and interleave burst addressing modes, auto-precharge triggered by A10 high, and mode register programming for burst length, latency, and burst type.

Functional states include Power Down (CKE low), Self Refresh (CS/RAS/CAS/WE low, CKE low), Clock Suspend (CKE low during active bank), and Burst Stop (CS/WE low, RAS/CAS high). Refresh is managed via 8K cycles per 64 ms at 0°C–70°C, with DQM-controlled byte masking and separate VDDQ/VSSQ for I/O noise immunity.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency200 MHz - enables 200 million words/sec peak bandwidth (CL3, tAC = 5.0 ns)
CAS LatencyConfigurable to CL2 or CL3 - determines read data valid delay after CAS assertion
Burst LengthProgrammable 1, 2, 4, 8, or full-page - defines consecutive column accesses per command
Refresh Rate8K cycles / 64 ms @ 0°C–70°C - meets JEDEC SDRAM refresh requirements
Supply Voltage3.3V ± 0.3V - requires stable LVTTL-compatible power rail with separate VDDQ
Operating Temperature0°C to +70°C - commercial-grade thermal specification for W9825G6KH-5
Self-Refresh CurrentMax 2 mA - enables low-power retention during system sleep without external refresh controller

Pinout & Package

W9825G6KH-5 is housed in a RoHS-compliant, lead-free TSOP II-54 package (400 mil width, 0.80 mm pitch), with dedicated VDD/VSS and isolated VDDQ/VSSQ supplies for I/O noise suppression.

Pin/Terminal Circuit Role Design Meaning
A0–A12Address InputMultiplexed row/column address lines; A10 controls all-bank precharge when sampled high
BS0, BS1Bank SelectSelects one of four internal banks during activate or command execution
DQ0–DQ15Data I/O16-bit bidirectional data bus with LDQM/UDQM for byte-level write masking
CS, RAS, CAS, WECommand ControlFour control signals decoded synchronously on CLK rising edge to define operation
CLK, CKEClock InterfaceCLK provides timing reference; CKE gates clock domain entry into Power Down/Self Refresh
LDQM, UDQMI/O MaskLow-active masks lower/upper 8 bits of DQ bus during writes or forces DQ Hi-Z during reads
VDD, VSSCore Power/GroundSupplies logic and address circuitry; must ramp simultaneously with VDDQ at power-up
VDDQ, VSSQI/O Power/GroundIsolated supply/ground for DQ drivers/receivers to minimize switching noise coupling

Key Features

Feature Design Value
Programmable Mode RegisterEnables runtime configuration of burst length, CAS latency, and burst type (sequential/interleave)
Multi-Bank InterleavingFour independent banks allow overlapping activate/precharge/read/write operations to hide latency
Auto-Precharge SupportA10-high during Read/Write triggers automatic bank precharge, simplifying controller timing management
Byte-Level Write MaskingLDQM/UDQM pins enable selective 8-bit masking on 16-bit writes without additional logic
Low-Power Self-RefreshEnters autonomous refresh state with only CKE asserted low - maintains data with 2 mA max current
TSOP II Mechanical Compatibility54-pin, 400-mil footprint matches industry-standard SDRAM socket layouts for drop-in replacement

Applications

Industrial HMI Memory Legacy Embedded Controller RAM

Use Scenario: Touchscreen-based human-machine interface running real-time OS with graphics buffer and firmware overlay storage.

IC Role / Device Role / Timing Role: Primary working memory for display frame buffers and application code execution, interfaced via FPGA or microcontroller SDRAM controller.

Use Value: 4-bank interleaving sustains >150 MB/s sustained bandwidth for dual-panel UI rendering; CL3-200MHz timing ensures deterministic response under interrupt load.

Use Scenario: Programmable logic controller (PLC) with motion control firmware requiring deterministic memory access for servo loop buffers and I/O mapping tables.

IC Role / Device Role / Timing Role: Main system RAM accessed by ARM9 or MIPS-based SoC with integrated SDRAM controller, supporting burst reads for instruction fetch and writes for real-time data logging.

Use Value: Auto-precharge reduces command overhead during frequent small-block writes; 2 mA self-refresh enables safe power-loss recovery without battery backup.

PC/104-Compatible Systems Network Appliance Data Buffer

Use Scenario: Compact industrial computer using PC/104 form factor with legacy x86 CPU requiring standard SDRAM interface.

IC Role / Device Role / Timing Role: Drop-in compatible main memory replacing older SDR SDRAM modules, operating at 200 MHz with CL3 timing.

Use Value: TSOP II-54 pinout and LVTTL signaling ensure mechanical and electrical compatibility with existing PC/104 SDRAM sockets and timing constraints.

Use Scenario: Low-cost Ethernet switch or firewall appliance buffering packet headers and flow tables in real time.

IC Role / Device Role / Timing Role: High-throughput packet buffer memory accessed by network processor or DMA engine with burst-length-4 reads/writes.

Use Value: Full-page burst mode supports rapid header table initialization; separate VDDQ/VSSQ minimizes jitter-induced CRC errors in high-noise board environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS42S16400J-5BLISame 4M×4×16 organization, 200 MHz/CL3, but rated -40°C to +85°C (industrial grade)Supports wider temperature range; higher self-refresh current (3 mA)Choose for extended-temperature deployments where W9825G6KH-5's 0°C–70°C limit is insufficient
MT48LC4M16A2P-6A166 MHz/CL3 speed grade, same TSOP II-54 package and pinout, but no CL2 optionLimited to 166 MHz max; lacks CAS Latency 2 mode for tighter timing marginsAcceptable for cost-sensitive designs where 200 MHz bandwidth is not required and CL3 suffices

Compared with W9825G6KH-5, IS42S16400J-5BLI offers broader thermal reliability at higher self-refresh current, while MT48LC4M16A2P-6A trades speed for maturity and broad second-source availability - neither is pin-compatible without validation, but both match core SDRAM protocol and footprint.

Availability

W9825G6KH-5 is available at Aetrix Electronics and suitable for industrial HMIs, legacy embedded controllers, and PC/104-compatible systems requiring stable component supply, long-lifecycle support, and RoHS-compliant TSOP II packaging.

Supply support for W9825G6KH-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in memory ICs, flash products, and microcontrollers, with over 30 years of DRAM design heritage.

W9825G6KH-5 belongs to Winbond's legacy SDR SDRAM product line, engineered for cost-effective, pin-compatible memory upgrades in industrial and embedded platforms where DDR migration is impractical.

FAQ

What is the maximum operating frequency and CAS latency supported by W9825G6KH-5?

W9825G6KH-5 is rated for 200 MHz operation with CAS Latency 3, and also supports 133 MHz with CAS Latency 2. Its timing parameters - including tAC = 5.0 ns and tRCD = 20 ns - are guaranteed under these conditions at 0°C to +70°C. The device uses a programmable mode register to select between CL2 and CL3 modes, and the -5 speed grade is specifically sorted and tested to meet the 200 MHz/CL3 specification.

Does W9825G6KH-5 support self-refresh, and what is its maximum current draw in that mode?

Yes, W9825G6KH-5 supports self-refresh mode with a maximum current draw of 2 mA at 0°C to +70°C. Self-refresh is entered via the dedicated Self Refresh Command (CS/RAS/CAS/WE low, CKE low), and the device maintains data integrity autonomously without external refresh commands. Note that self-refresh is not supported above +85°C, and the -5 grade is specified only up to +70°C.

What package type and pin count does W9825G6KH-5 use?

W9825G6KH-5 uses a TSOP II-54 package: 54-pin, 400-mil body width, 0.80 mm lead pitch, RoHS-compliant and lead-free. Pin assignments follow JEDEC-standard SDRAM layout, including dedicated VDDQ/VSSQ rails for I/O noise isolation, and dual DQM pins (LDQM/UDQM) for 8-bit masking on the 16-bit DQ bus.

Can W9825G6KH-5 be used interchangeably with other 128 Mbit SDRAMs like IS42S16400J?

W9825G6KH-5 shares the same 4M×4×16 organization, TSOP II-54 package, and core SDRAM command set with IS42S16400J-series parts, but direct interchange requires validation of timing margins, voltage tolerances, and mode register encoding. While pinout is identical, differences in tRAS, tRP, and self-refresh behavior mean board-level qualification is necessary before substitution - it is not a guaranteed drop-in replacement.

What are the supported burst lengths and addressing modes for W9825G6KH-5?

W9825G6KH-5 supports burst lengths of 1, 2, 4, 8, and full-page, configurable via its mode register. It implements two burst addressing modes: sequential (linear increment) and interleave (bit-inverted pattern), selected at mode register setup. Burst behavior is consistent across read and write operations, and burst termination is supported via the Burst Stop command for full-page bursts only.

W9825G6KH-5 Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
54-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-TSOP II

W9825G6KH-5 FAQ

1.How can I place an order for W9825G6KH-5 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G6KH-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G6KH-5 reliable?

The price and inventory of W9825G6KH-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6KH-5 is usually 5 days.

3.What payment methods are accepted for W9825G6KH-5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6KH-5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G6KH-5?

W9825G6KH-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G6KH-5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G6KH-5?

For technical support, including W9825G6KH-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6KH-5 requirements.

6.How does Aetrix verify that W9825G6KH-5 is sourced from the original manufacturer or authorized distributors?

All W9825G6KH-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6KH-5 meets industry standards.

7.What is the process for return or replacement of W9825G6KH-5?

All W9825G6KH-5 units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6KH-5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G6KH-5 part is unused and in its original packaging.

Return procedure for W9825G6KH-5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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