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Winbond Electronics Corporation W9825G6KH-6I
- Part No.:
- W9825G6KH-6I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9825G6KH-6I.pdf
- Description:
- IC DRAM 256MBIT PAR 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,105
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Product details
Overview
W9825G6KH-6I from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS latency 3, 3.3V supply, TSOP II-54 package, and industrial temperature range (–40°C to +85°C). It delivers up to 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and legacy PC systems.
For engineers reviewing the W9825G6KH-6I datasheet, W9825G6KH-6I pinout, W9825G6KH-6I application, or W9825G6KH-6I equivalent, key selection criteria include its 166 MHz / CL3 timing compliance, TSOP II-54 mechanical footprint, self-refresh current limit of 2 mA, LVTTL interface compatibility, and support for auto-precharge and interleaved bank access in memory subsystems requiring deterministic latency and low-power retention.
Technical Context
This SDRAM implements four independent 1M-word banks with shared address/command bus and multiplexed row/column addressing. Internal refresh counter and mode register control enable programmable burst type (sequential/interleaved), CAS latency (2 or 3), and precharge behavior - critical for optimizing throughput in burst-oriented data paths.
It uses standard LVTTL signaling with separate VDDQ/VSSQ rails for I/O noise immunity, supports clock suspend and power-down modes for dynamic power management, and requires strict tRCD ≥ 20 ns, tRP ≥ 20 ns, and tRC ≥ 60 ns timing margins during bank activation and precharge cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum command rate and data transfer bandwidth |
| CAS Latency | CL = 3 - fixed 3-clock delay from column command to first valid DQ output |
| Burst Length | 1, 2, 4, 8, or full page - determines consecutive column accesses per command |
| Operating Voltage | 3.3 V ± 0.3 V - requires stable LVTTL-compatible supply with separate VDDQ rail |
| Temperature Range | –40°C to +85°C - qualified for industrial environments without derating |
| Refresh Requirement | 8K cycles / 64 ms - mandates periodic CBR refresh to retain data |
| Self-Refresh Current | 2 mA max - sets minimum power budget for battery-backed retention mode |
Pinout & Package
TSOP II-54 package, 400 mil width, 0.80 mm pitch, RoHS-compliant lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Multiplexed row/column address lines; A10 controls all-bank vs. bank-select precharge |
| BS0, BS1 | Bank Select | Encode active bank (0–3) during row activation or column access |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with LDQM/UDQM masking per byte lane |
| CS, RAS, CAS, WE | Command Control | Four active-low signals defining all operations via truth table on CLK rising edge |
| CLK, CKE | Clock Interface | CLK synchronizes all inputs; CKE gates internal clock and enables power-down/self-refresh entry |
| LDQM, UDQM | I/O Mask | Byte-level write mask and read output disable with zero-latency assertion |
| VDD, VSS | Core Power/Ground | 3.3 V supply and return for logic circuitry and input buffers |
| VDDQ, VSSQ | I/O Power/Ground | Isolated 3.3 V rail and ground for DQ drivers/receivers to reduce switching noise |
| NC | No Connect | Pin 40 is unconnected - must be left floating or tied to VSS per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Mode Register | Enables runtime configuration of burst length, CAS latency, and burst type - eliminates hard-coded timing constraints in controller firmware |
| Interleaved Bank Access | Allows back-to-back reads/writes across banks (e.g., Bank 0 read → Bank 1 activate) to hide tRCD and tRP delays and sustain >90% bus utilization |
| Auto-Precharge | Automatically initiates bank precharge after burst completion when A10=HIGH - reduces software overhead and prevents accidental open-row conflicts |
| Low-Power Modes | Power-down (CKE low) and self-refresh (CKE+RAS+CAS+WE low) cut active current by >80%, enabling standby operation with <2 mA draw |
| LVTTL-Compatible I/O | Supports direct interface with legacy microcontrollers and FPGAs without level-shifting - simplifies PCB routing and reduces BOM count |
Applications
| Industrial HMI Controller Memory | Legacy PC BIOS/UEFI Cache Buffer |
|---|---|
Use Scenario: Real-time display update and touch response buffering in factory-floor HMIs operating continuously at –40°C to +85°C. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-M7-based controller, serving as frame buffer and command queue with deterministic 166 MHz access. Use Value: TSOP II-54 footprint ensures drop-in replacement for aging SDRAMs; CL3 timing guarantees sub-20 ns read latency under worst-case temperature. | Use Scenario: Non-volatile BIOS code shadowing and runtime variable storage in x86-based industrial motherboards. IC Role / Device Role / Timing Role: High-bandwidth, low-latency RAM for caching flash-resident firmware and supporting fast POST execution sequences. Use Value: Full-page burst mode enables rapid 4 KB block loads from SPI flash; auto-precharge minimizes inter-access dead time during sequential instruction fetch. |
| Medical Imaging Data FIFO | Network Appliance Packet Buffer |
Use Scenario: Temporary storage of raw sensor frames from ultrasound transducer arrays before DSP processing. IC Role / Device Role / Timing Role: Dual-port-capable buffer interfaced via FPGA logic, accepting parallel 16-bit pixel streams at 166 MHz. Use Value: Separate VDDQ/VSSQ rails suppress DQ noise during simultaneous analog acquisition and digital transfer - preserving SNR in sensitive imaging paths. | Use Scenario: Store-and-forward buffering of Ethernet packets in managed switches with deep packet inspection engines. IC Role / Device Role / Timing Role: Shared memory resource for ingress/egress traffic shaping, supporting concurrent read-modify-write on packet headers. Use Value: Interleaved bank architecture allows simultaneous header read (Bank 0) and payload write (Bank 1), sustaining line-rate 1 Gbps throughput without arbitration stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16400J-6BLI | Same 4M×4×16 organization, 166 MHz/CL3, TSOP II-54, but with 3.3 V ± 0.15 V tighter tolerance and 1.8 V VDDQ option | Requires stricter voltage regulation; supports dual-voltage I/O for mixed-signal SoC interfaces | Select if system already uses IS42S16400J-6BLI and needs identical timing margins and layout reuse |
| MT48LC4M16A2P-6A:J | Identical speed grade and pinout, but Micron's version specifies tRC = 60 ns (vs. Winbond's 65 ns) and lower IDD2 active current (120 mA vs. 135 mA) | Better suited for thermally constrained enclosures where power density matters more than absolute timing margin | Choose when thermal design limits exceed 135 mA peak draw or when sourcing from Micron-dedicated supply chains |
Compared with W9825G6KH-6I, IS42S16400J-6BLI offers tighter voltage specs and optional VDDQ scaling, while MT48LC4M16A2P-6A:J provides lower active current and slightly tighter tRC - both require validation of board-level signal integrity due to minor AC parameter variances despite identical pinout and function.
Availability
W9825G6KH-6I is available at Aetrix Electronics and suitable for industrial HMIs, legacy PC BIOS modules, medical imaging FIFOs, and network appliance packet buffers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9825G6KH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in memory ICs, flash storage, and security solutions, with over 30 years of DRAM design heritage.
The W9825G6KH series targets cost-sensitive, reliability-critical embedded systems needing JEDEC-compliant SDRAM in mature, widely supported packages - emphasizing industrial longevity over cutting-edge bandwidth.
FAQ
What is the maximum operating frequency and CAS latency supported by W9825G6KH-6I?
W9825G6KH-6I is rated for 166 MHz clock frequency with CAS latency 3 (CL3) at –40°C to +85°C. It also supports 133 MHz / CL2 operation, but CL3 is the guaranteed timing mode for its -6I speed grade. The device does not support CL2 at 166 MHz - that combination is only specified for -5/-5I grades. All timing parameters in the datasheet assume CL3 operation unless explicitly noted otherwise for alternate modes.
Does W9825G6KH-6I support self-refresh mode, and what is its maximum current draw in that state?
Yes, W9825G6KH-6I supports self-refresh mode with a maximum IDD6 current of 2 mA at –40°C ≤ TA ≤ +85°C. This value is specified in the Order Information table and confirmed in Section 2 Features. Self-refresh is disabled above +85°C per datasheet note, so it must not be used in high-temperature industrial applications exceeding that limit. The 2 mA figure represents worst-case draw under full retention conditions and is critical for battery-backed backup design.
What package type and pin count does W9825G6KH-6I use, and is it RoHS compliant?
W9825G6KH-6I uses a TSOP II-54 package, 400 mil width, 0.80 mm pitch, with lead-free materials and full RoHS compliance as stated in Section 2 Features. Pin 40 is NC (no connect) and must remain unconnected. The package matches JEDEC MO-143AC mechanical standards, ensuring compatibility with standard SMT reflow profiles and pick-and-place tooling used for legacy memory components.
Can W9825G6KH-6I be used interchangeably with W9825G6KH-6 in a design?
W9825G6KH-6I and W9825G6KH-6 share identical electrical specifications and pinout, but differ in temperature qualification: W9825G6KH-6I operates from –40°C to +85°C, while W9825G6KH-6 is rated only from 0°C to +70°C. Substituting W9825G6KH-6I for W9825G6KH-6 is safe and improves thermal margin; substituting the reverse risks functional failure below 0°C or above 70°C. No PCB or firmware changes are needed for the swap.
What are the key timing parameters required to initialize W9825G6KH-6I after power-up?
Initialization of W9825G6KH-6I requires: (1) 200 µs stabilization delay after VDD/VDDQ reach 3.3 V, (2) precharge-all command, (3) mode register set command (with valid burst/CAS settings), and (4) eight auto-refresh cycles before normal operation. These steps are mandatory per Section 7.1 and ensure reliable memory state. Skipping any step - especially the eight CBR refreshes - may cause data corruption or command lockup during early operation.
W9825G6KH-6I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
W9825G6KH-6I FAQ
1.How can I place an order for W9825G6KH-6I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9825G6KH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9825G6KH-6I reliable?
The price and inventory of W9825G6KH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6KH-6I is usually 5 days.
3.What payment methods are accepted for W9825G6KH-6I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6KH-6I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9825G6KH-6I?
W9825G6KH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9825G6KH-6I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9825G6KH-6I?
For technical support, including W9825G6KH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6KH-6I requirements.
6.How does Aetrix verify that W9825G6KH-6I is sourced from the original manufacturer or authorized distributors?
All W9825G6KH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6KH-6I meets industry standards.
7.What is the process for return or replacement of W9825G6KH-6I?
All W9825G6KH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6KH-6I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9825G6KH-6I part is unused and in its original packaging.
Return procedure for W9825G6KH-6I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9825G6KH-6I Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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