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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9825G6KH-6 TR

Name: W9825G6KH-6 TR
Brand: Winbond Electronics Corporation
SKU: W9825G6KH-6 TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9825G6KH-6 TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TSOP (0.400", 10.16mm Width)

Datasheet:: W9825G6KH-6 TR.pdf

Description:: IC DRAM 256MBIT PAR 54TSOP II

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W9825G6KH-6 TR from Winbond is a 4M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V supply, TSOP II-54 package, and LVTTL interface - used as main memory in embedded controllers, industrial HMIs, and legacy PC-compatible systems requiring burst-access memory with auto-precharge and self-refresh support.

For engineers reviewing the W9825G6KH-6 TR datasheet, W9825G6KH-6 TR pinout, W9825G6KH-6 TR application, or W9825G6KH-6 TR equivalent, key selection criteria include supported burst lengths (1/2/4/8/full page), dual DQM masking, bank-interleaved access timing, and industrial temperature variants (-6I/-6J) for extended thermal operation.

Technical Context

This SDRAM implements four independent 1M-word banks with shared address/command bus and multiplexed row/column addressing. It supports programmable mode register settings for burst type (sequential/interleaved), burst length, and CAS latency - enabling optimization for throughput vs. latency trade-offs in burst-oriented data streams.

Functional operation relies on precise command sequencing: Bank Activate must precede Read/Write; Auto-precharge is triggered by A10 high during command latching; Self Refresh requires CKE low with all banks idle; and Power Down mode gates input receivers while preserving state but halting refresh - demanding external controller coordination of tREF intervals.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	4,194,304 words × 4 banks × 16 bits = 128 Mbit total capacity; enables 16-bit wide data transfers per access.
Clock Frequency	166 MHz maximum (–6 speed grade); defines 6 ns clock period - constrains minimum tCK and timing margin for controller design.
CAS Latency	CL = 3 cycles; determines fixed read data valid delay after column address strobe - critical for synchronous pipeline alignment.
Burst Length	Programmable 1, 2, 4, 8, or full-page; allows contiguous multi-word reads/writes without repeated column address setup.
Supply Voltage	3.3 V ± 0.3 V; requires stable LDO regulation - VDD and VDDQ are separated to isolate core logic from I/O noise.
Refresh Rate	8K cycles / 64 ms (≤ 85°C); mandates controller-initiated CBR refresh every 7.8 µs average interval to retain data.
Package	TSOP II-54, 400 mil, 0.80 mm pitch; RoHS-compliant lead-free construction - compatible with standard SMT reflow profiles.
Interface Standard	LVTTL-compatible inputs/outputs; matches 3.3V logic families without level translation in host controller designs.

Pinout & Package

W9825G6KH-6 TR uses a 54-pin Thin Small Outline Package (TSOP II), 400 mil body width, 0.80 mm lead pitch, with exposed pad not present. Pin functions follow JEDEC-standard SDRAM signaling, including dual DQM pins for byte masking and separate VDD/VDDQ and VSS/VSSQ supplies for noise isolation.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge when sampled high during command.
BS0, BS1	Bank Select	Encodes active bank (0–3) during row activation or column access - enables interleaved bank operations.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports burst transfers and single-word access with DQM-controlled masking.
LDQM, UDQM	I/O Mask	Lower/upper byte mask: high during read places DQ[7:0] or DQ[15:8] in Hi-Z; blocks write data with zero latency.
CLK, CKE	Timing Control	CLK synchronizes all command/address/data edges; CKE enables/disables internal clock - low enters Power Down or Self Refresh.
CS, RAS, CAS, WE	Command Decode	Four control signals sampled on CLK rising edge to decode commands (e.g., ACTIVATE, READ, WRITE, PRECHARGE).
VDD, VSS	Core Power/Ground	3.3V supply and return for internal logic and input buffers - must ramp simultaneously during power-up.
VDDQ, VSSQ	I/O Power/Ground	Separate 3.3V supply/ground for DQ drivers/receivers - reduces switching noise coupling into core logic.
NC	No Connect	Pin 40 is unconnected - must be left floating or tied to ground per board layout best practices.

Key Features

Feature	Design Value
Programmable Burst Mode	Configurable sequential or interleaved burst addressing via Mode Register - optimizes locality-aware access patterns in video or packet buffers.
Dual-Byte Write Masking	Independent LDQM/UDQM control enables 8-bit partial writes without read-modify-write - essential for mixed-width peripheral interfacing.
Auto-precharge Support	A10-driven automatic bank precharge after read/write bursts - eliminates explicit PRECHARGE command overhead in streaming applications.
Low-Power Self Refresh	IDD6 ≤ 1.5 mA (–6L grade) during Self Refresh - sustains data retention with minimal power in battery-backed or standby modes.
Industrial Temp Options	–6I (–40°C to +85°C) and –6J (–40°C to +105°C) variants available - validated for automotive infotainment and factory automation environments.
Standard LVTTL Interface	Direct compatibility with FPGA I/O banks and microcontroller SDRAM controllers - no level-shifting required in 3.3V systems.

Applications

Industrial HMI Memory Buffer	Legacy PC-Compatible BIOS Cache
Use Scenario: Touchscreen-based human-machine interface running real-time graphics rendering and event logging. IC Role / Device Role / Timing Role: Main system memory storing frame buffers, GUI assets, and runtime variables - accessed via burst reads/writes synchronized to display controller clock. Use Value: 166 MHz bandwidth and 4-bank interleaving enable concurrent display refresh and background data logging without bus contention.	Use Scenario: Motherboard BIOS firmware execution and configuration storage in x86-based industrial PCs. IC Role / Device Role / Timing Role: Shadow RAM for fast BIOS code execution and CMOS configuration backup - mapped into CPU's lower memory space with standard SDRAM controller. Use Value: CL3 latency and auto-precharge reduce instruction fetch stalls; TSOP II package ensures compatibility with legacy PCB layouts.
Embedded Network Router Packet Buffer	Medical Imaging Data Acquisition Buffer
Use Scenario: Layer-2 switch ASIC buffering incoming/outgoing Ethernet frames before forwarding decisions. IC Role / Device Role / Timing Role: Shared packet memory supporting simultaneous ingress/egress DMA channels - managed via bank-interleaved burst reads/writes. Use Value: Full-page burst capability handles jumbo frames efficiently; dual DQM masking allows selective overwrite of header fields without full-word writes.	Use Scenario: Ultrasound or X-ray acquisition system capturing high-resolution sensor data streams at 20+ MSPS. IC Role / Device Role / Timing Role: High-throughput circular buffer staging raw ADC samples prior to DSP processing - accessed via continuous burst reads. Use Value: 128 Mbit density provides >1 s of 16-bit sample storage at 20 MSPS; self-refresh maintains data integrity during processor sleep cycles.

Industrial HMI Memory Buffer

Legacy PC-Compatible BIOS Cache

Use Scenario: Touchscreen-based human-machine interface running real-time graphics rendering and event logging.

IC Role / Device Role / Timing Role: Main system memory storing frame buffers, GUI assets, and runtime variables - accessed via burst reads/writes synchronized to display controller clock.

Use Value: 166 MHz bandwidth and 4-bank interleaving enable concurrent display refresh and background data logging without bus contention.

Use Scenario: Motherboard BIOS firmware execution and configuration storage in x86-based industrial PCs.

IC Role / Device Role / Timing Role: Shadow RAM for fast BIOS code execution and CMOS configuration backup - mapped into CPU's lower memory space with standard SDRAM controller.

Use Value: CL3 latency and auto-precharge reduce instruction fetch stalls; TSOP II package ensures compatibility with legacy PCB layouts.

Embedded Network Router Packet Buffer

Medical Imaging Data Acquisition Buffer

Use Scenario: Layer-2 switch ASIC buffering incoming/outgoing Ethernet frames before forwarding decisions.

IC Role / Device Role / Timing Role: Shared packet memory supporting simultaneous ingress/egress DMA channels - managed via bank-interleaved burst reads/writes.

Use Value: Full-page burst capability handles jumbo frames efficiently; dual DQM masking allows selective overwrite of header fields without full-word writes.

Use Scenario: Ultrasound or X-ray acquisition system capturing high-resolution sensor data streams at 20+ MSPS.

IC Role / Device Role / Timing Role: High-throughput circular buffer staging raw ADC samples prior to DSP processing - accessed via continuous burst reads.

Use Value: 128 Mbit density provides >1 s of 16-bit sample storage at 20 MSPS; self-refresh maintains data integrity during processor sleep cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16400F-6BLI	Same 4M×16 organization, 166 MHz, CL3, TSOP-54; lower IDD6 (1.2 mA vs. 2 mA) in self-refresh; supports -40°C to +85°C.	Drop-in replacement for industrial HMI designs where lower self-refresh current is critical for battery life.	Select IS42S16400F-6BLI if board-level thermal management is constrained and self-refresh current must be minimized.
MT48LC4M16A2P-6A:L	Identical speed grade (166 MHz/CL3), same pinout, but requires 3.3V ± 0.3V and supports only 0°C to +70°C; higher tRC (10 ns vs. 9 ns).	Suitable for commercial-grade embedded systems where extended temperature range is not required.	Choose MT48LC4M16A2P-6A:L for cost-sensitive consumer electronics where industrial temp rating is unnecessary.

Compared with W9825G6KH-6 TR, IS42S16400F-6BLI offers lower self-refresh current for battery-critical applications, while MT48LC4M16A2P-6A:L provides identical timing and footprint at lower cost for commercial-temperature use - neither is pin-compatible with -6J/-6L variants due to differing thermal specs.

Availability

W9825G6KH-6 TR is available at Aetrix Electronics and suitable for industrial HMIs, legacy PC-compatible systems, and embedded network equipment requiring stable component supply across long-lifecycle production runs.

Supply support for W9825G6KH-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in memory ICs, flash products, and microcontrollers - serving industrial, communications, and consumer markets since 1987.

W9825G6KH-6 TR belongs to Winbond's standard SDRAM product line designed for cost-effective, high-reliability main memory in resource-constrained embedded systems requiring JEDEC-compliant timing and industrial-grade robustness.

FAQ

What is the maximum clock frequency supported by W9825G6KH-6 TR?

W9825G6KH-6 TR supports a maximum clock frequency of 166 MHz, corresponding to a 6 ns clock period (tCK). This speed grade is validated under 3.3V ± 0.3V supply and specified for operation from 0°C to +70°C. The -6 suffix explicitly denotes compliance with the 166 MHz/CL3 timing specification per JEDEC standards.

Does W9825G6KH-6 TR support CAS Latency 2?

Yes, W9825G6KH-6 TR supports both CAS Latency 2 and CAS Latency 3, as confirmed in the Features section of the datasheet. CL2 operation is enabled via Mode Register programming and is valid at lower frequencies such as 133 MHz - allowing tighter read-to-read timing in latency-sensitive applications when system clock rate permits.

What package type is used for W9825G6KH-6 TR?

W9825G6KH-6 TR is packaged in a 54-pin TSOP II (Thin Small Outline Package) with 400 mil body width and 0.80 mm lead pitch. It uses lead-free, RoHS-compliant materials and follows standard JEDEC SDRAM pinout conventions - ensuring mechanical and electrical compatibility with existing SDRAM footprints.

Can W9825G6KH-6 TR operate in Self Refresh mode at 105°C?

No, W9825G6KH-6 TR does not support Self Refresh mode above 85°C. The datasheet explicitly states "Not support self refresh function with TA > 85°C." For operation up to +105°C, the -6J variant (W9825G6KH-6J) must be selected - it guarantees self-refresh functionality at elevated temperatures with higher IDD6 (5 mA max).

How many banks does W9825G6KH-6 TR have, and why does that matter?

W9825G6KH-6 TR has four independent memory banks. This architecture enables bank interleaving - allowing one bank to be precharged while another is active - which hides precharge delays and increases effective bandwidth during sequential access. It directly supports high-efficiency burst transfers in graphics, networking, and real-time data buffering applications.

W9825G6KH-6 TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TSOP (0.400", 10.16mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TSOP II

W9825G6KH-6 TR FAQ

1.How can I place an order for W9825G6KH-6 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9825G6KH-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9825G6KH-6 TR reliable?

The price and inventory of W9825G6KH-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9825G6KH-6 TR is usually 5 days.

3.What payment methods are accepted for W9825G6KH-6 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9825G6KH-6 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9825G6KH-6 TR?

W9825G6KH-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9825G6KH-6 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9825G6KH-6 TR?

For technical support, including W9825G6KH-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9825G6KH-6 TR requirements.

6.How does Aetrix verify that W9825G6KH-6 TR is sourced from the original manufacturer or authorized distributors?

All W9825G6KH-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9825G6KH-6 TR meets industry standards.

7.What is the process for return or replacement of W9825G6KH-6 TR?

All W9825G6KH-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9825G6KH-6 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9825G6KH-6 TR part is unused and in its original packaging.

Return procedure for W9825G6KH-6 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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