Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W9864G2JH-6I

Part No.:
W9864G2JH-6I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
86-TFSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9864G2JH-6I.pdf
Description:
IC DRAM 64MBIT LVTTL 86TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,490

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W9864G2JH-6I from Winbond is a 512K × 4 banks × 32-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (−40°C to +85°C), used as main memory in embedded controllers and legacy industrial systems requiring burst-access memory with LVTTL interface.

For engineers reviewing the W9864G2JH-6I datasheet, W9864G2JH-6I pinout, W9864G2JH-6I application, or W9864G2JH-6I equivalent, key selection criteria include TSOP-II-86 package compatibility, 4K/64ms refresh requirement, programmable burst length (1–8), self-refresh current ≤2 mA, and bank interleaving support for latency hiding in real-time control firmware.

Technical Context

This SDRAM implements four independent 512K×32-bit banks with row/column address multiplexing via A0–A10 and BS0/BS1, supporting sequential or interleave burst addressing modes controlled by the Mode Register. It uses LVTTL-compatible inputs and separate VDDQ/VSSQ rails for I/O noise immunity.

Functional operation relies on command decoding synchronized to CLK rising edges, with CKE-gated power-down and self-refresh entry, and auto-precharge triggered by A10 high during read/write. All banks must be precharged before Mode Register Set, and eight CBR refresh cycles are required post-initialization.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization524,288 words × 4 banks × 32 bits = 64 Mbit total capacity
Max Clock Frequency166 MHz - defines maximum sustained data throughput of 533 MB/s (166M × 32-bit)
CAS LatencyCL = 3 - fixed 3-clock delay between column address strobe and first valid DQ output
Burst LengthProgrammable 1, 2, 4, 8, or full-page - determines consecutive column accesses per command
Refresh Requirement4,096 cycles / 64 ms - mandates refresh controller scheduling every 15.625 µs per row
Supply Voltage3.3 V ± 0.3 V - requires stable LDO regulation; not compatible with 2.5 V or 1.8 V systems
Operating Temperature−40°C to +85°C - qualified for industrial environments without derating
Self-Refresh Current≤2 mA - enables low-power retention during system sleep with internal oscillator active

Pinout & Package

W9864G2JH-6I is packaged in a RoHS-compliant, lead-free 86-pin TSOP II (Thin Small Outline Package, Type II) with standard 0.5 mm pitch and 12.0 mm × 20.0 mm body dimensions.

Pin/TerminalCircuit RoleDesign Meaning
A0–A10Address InputMultiplexed row/column address lines; A10 controls all-bank precharge when sampled during PRE command
BS0, BS1Bank Select2-bit encoding selects one of four internal banks for activation or access
DQ0–DQ31Data I/O32-bit bidirectional data bus; DQM0–DQM3 mask individual byte lanes during write/read
CS, RAS, CAS, WECommand ControlFour active-low control signals decoded synchronously on CLK rising edge to execute operations
CLK, CKETiming InterfaceCLK provides synchronous edge sampling; CKE gates clock domain entry into power-down/self-refresh
VDD, VSSCore Power/Ground3.3 V supply and return for logic circuitry and input buffers
VDDQ, VSSQI/O Power/GroundIsolated 3.3 V rail and ground for DQ/DQM drivers to minimize switching noise coupling
DQM0–DQM3Data MaskPer-byte write enable/disable; high during read forces DQ Hi-Z after CL+2 latency

Key Features

FeatureDesign Value
Programmable Burst ModeSelectable sequential or interleave addressing per burst - enables optimized cache-line fetch patterns in MCU-based systems
Auto-Precharge SupportA10-driven automatic bank precharge after read/write - reduces manual command overhead and improves bandwidth in burst-heavy workloads
Multi-Bank InterleavingFour independent banks allow overlapping activate/precharge/read cycles - hides tRCD and tRP delays in pipelined memory access
LVTTL-Compatible Interface3.3 V logic thresholds with 20 mA drive strength - ensures direct interfacing with legacy microcontrollers and FPGAs without level shifters
Industrial Temperature Range−40°C to +85°C operation with guaranteed timing - eliminates thermal derating concerns in uncontrolled enclosures
Low-Power Self-Refresh2 mA max current during self-refresh - supports battery-backed suspend modes in portable industrial HMI units

Applications

Industrial PLC MemoryLegacy Medical Device Buffer

Use Scenario: Real-time ladder logic execution in DIN-rail mounted programmable logic controllers requiring deterministic memory access.

IC Role / Device Role / Timing Role: Main program/data RAM interfaced directly to ARM7 or ColdFire MCU with synchronous bus controller.

Use Value: 166 MHz clock and CL3 latency deliver predictable 18 ns read turnaround, enabling sub-millisecond scan cycle times without external wait-state insertion.

Use Scenario: Data buffering for ECG waveform acquisition and display in Class II medical instruments with long product lifecycles.

IC Role / Device Role / Timing Role: Frame buffer and FIFO storage between ADC subsystem and LCD controller.

Use Value: Four-bank architecture allows concurrent sample capture (Bank 0) and display refresh (Bank 1), eliminating frame tearing in 60 Hz GUI rendering.

Automotive Body Control ModulePoint-of-Sale Terminal Main Memory

Use Scenario: Non-safety-critical memory for HVAC, lighting, and door module firmware in passenger vehicles.

IC Role / Device Role / Timing Role: Executable code and variable storage for 32-bit automotive microcontrollers operating in under-hood environments.

Use Value: −40°C to +85°C qualification and 2 mA self-refresh current ensure reliable boot-from-flash and fail-safe state retention during cold cranking or thermal soak.

Use Scenario: Core memory in embedded Linux terminals handling payment processing, receipt printing, and barcode scanning.

IC Role / Device Role / Timing Role: Primary SDRAM for ARM9-based SoC running lightweight Yocto OS and Java-based POS applications.

Use Value: TSOP-II-86 footprint matches legacy PCB layouts; 524K×4×32 organization provides sufficient heap space for multi-threaded JVM without requiring DDR migration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS42S16400J-6BLI16M×16 organization (same 256 Mbit density), 166 MHz/CL3, 86-pin TSOP-II, but uses different bank addressing (2 banks × 16M×16)Requires bus-width reconfiguration (16-bit vs 32-bit DQ) and revised address mapping in memory controller firmwareChoose only if redesigning PCB and updating memory controller initialization sequence for 16-bit interface
MT48LC4M32B2P-6A:JSame 512K×4×32 organization and 166 MHz/CL3 rating, but 86-pin TSOP-II with different pinout (e.g., DQM placement, VDDQ assignment)Not pin-compatible; requires PCB layout revision and signal routing changes due to incompatible DQ/DQM groupingConsider only for new designs where Micron's documentation and long-term availability outweigh migration effort

Compared with IS42S16400J-6BLI and MT48LC4M32B2P-6A:J, W9864G2JH-6I offers native 32-bit bus alignment and Winbond's documented industrial qualification path, reducing firmware porting effort and enabling drop-in replacement on existing TSOP-II-86 footprints designed for 32-bit SDR SDRAM interfaces.

Availability

W9864G2JH-6I is available at Aetrix Electronics and suitable for industrial PLCs, legacy medical devices, automotive body control modules, and point-of-sale terminals requiring stable component supply across extended product lifecycles.

Supply support for W9864G2JH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontrollers, with over 30 years of DRAM design heritage and global manufacturing scale.

W9864G2JH-6I belongs to Winbond's legacy SDR SDRAM product line, engineered for cost-sensitive, long-lifecycle industrial and embedded applications where pin compatibility, temperature robustness, and firmware stability outweigh bandwidth demands of modern DDR interfaces.

FAQ

What is the maximum operating frequency and CAS latency of the W9864G2JH-6I?

The W9864G2JH-6I is rated for a maximum clock frequency of 166 MHz with CAS Latency 3. This means the device requires exactly three clock cycles between issuing a column address strobe (CAS) and the appearance of valid data on DQ pins. The -6I suffix specifically denotes industrial-grade qualification at this speed grade, with guaranteed timing performance across the full −40°C to +85°C temperature range. No overclocking or CL2 operation is supported.

Does the W9864G2JH-6I support both sequential and interleave burst modes?

Yes, the W9864G2JH-6I supports both sequential and interleave burst addressing modes, which are selected via the Mode Register during initialization. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleave mode toggles specific address bits (A0, A1, A2 depending on burst length) to optimize access patterns for certain cache architectures. The W9864G2JH-6I implements this using internal address counters and does not require external logic to generate interleaved sequences.

What is the refresh requirement for the W9864G2JH-6I, and how is it implemented?

The W9864G2JH-6I requires 4,096 refresh cycles every 64 ms, equating to one refresh command every 15.625 µs on average. Refresh is implemented via externally initiated Auto-Refresh (CBR) commands issued by the memory controller, or internally during Self-Refresh mode when CKE is held low. During Self-Refresh, the W9864G2JH-6I uses an internal oscillator to autonomously issue refresh cycles without external clock or command input, drawing ≤2 mA current.

Can the W9864G2JH-6I be used in a 16-bit data bus configuration?

No, the W9864G2JH-6I is a fixed 32-bit wide device with 32 dedicated DQ pins (DQ0–DQ31) and no configurable bus width. It cannot be operated in 16-bit mode without external data masking or truncation, which would violate timing and functionality requirements. Systems requiring 16-bit SDRAM must select a part with native 16-bit organization (e.g., x16) such as IS42S16400J-6BLI, which has different pinout, bank structure, and initialization behavior than the W9864G2JH-6I.

What package type and pin count does the W9864G2JH-6I use?

The W9864G2JH-6I uses an 86-pin TSOP II (Thin Small Outline Package, Type II) with 0.5 mm pitch, measuring 12.0 mm × 20.0 mm. It is lead-free and RoHS compliant. Pin functions include 32 data lines (DQ0–DQ31), four data masks (DQM0–DQM3), eleven address lines (A0–A10), two bank selects (BS0, BS1), four command inputs (CS, RAS, CAS, WE), plus CLK, CKE, VDD, VSS, VDDQ, VSSQ, and NC pins - all matching JEDEC-standard SDR SDRAM TSOP-II mechanical and electrical specifications.

W9864G2JH-6I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
86-TFSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
64Mbit
Memory Organization:
2M x 32
Memory Interface:
LVTTL
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
86-TSOP II

W9864G2JH-6I FAQ

1.How can I place an order for W9864G2JH-6I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9864G2JH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9864G2JH-6I reliable?

The price and inventory of W9864G2JH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G2JH-6I is usually 5 days.

3.What payment methods are accepted for W9864G2JH-6I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G2JH-6I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9864G2JH-6I?

W9864G2JH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9864G2JH-6I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9864G2JH-6I?

For technical support, including W9864G2JH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G2JH-6I requirements.

6.How does Aetrix verify that W9864G2JH-6I is sourced from the original manufacturer or authorized distributors?

All W9864G2JH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G2JH-6I meets industry standards.

7.What is the process for return or replacement of W9864G2JH-6I?

All W9864G2JH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9864G2JH-6I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9864G2JH-6I part is unused and in its original packaging.

Return procedure for W9864G2JH-6I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W9864G2JH-6I Tags

  • W9864G2JH-6I
  • W9864G2JH-6I PDF
  • W9864G2JH-6I Datasheet
  • W9864G2JH-6I Specifications
  • W9864G2JH-6I Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W9864G2JH-6I
  • Buy W9864G2JH-6I
  • W9864G2JH-6I Price
  • W9864G2JH-6I Distributor
  • W9864G2JH-6I Supplier
  • W9864G2JH-6I Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER