Winbond Electronics Corporation W9864G2JH-6I
- Part No.:
- W9864G2JH-6I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 86-TFSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9864G2JH-6I.pdf
- Description:
- IC DRAM 64MBIT LVTTL 86TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9864G2JH-6I from Winbond is a 512K × 4 banks × 32-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (−40°C to +85°C), used as main memory in embedded controllers and legacy industrial systems requiring burst-access memory with LVTTL interface.
For engineers reviewing the W9864G2JH-6I datasheet, W9864G2JH-6I pinout, W9864G2JH-6I application, or W9864G2JH-6I equivalent, key selection criteria include TSOP-II-86 package compatibility, 4K/64ms refresh requirement, programmable burst length (1–8), self-refresh current ≤2 mA, and bank interleaving support for latency hiding in real-time control firmware.
Technical Context
This SDRAM implements four independent 512K×32-bit banks with row/column address multiplexing via A0–A10 and BS0/BS1, supporting sequential or interleave burst addressing modes controlled by the Mode Register. It uses LVTTL-compatible inputs and separate VDDQ/VSSQ rails for I/O noise immunity.
Functional operation relies on command decoding synchronized to CLK rising edges, with CKE-gated power-down and self-refresh entry, and auto-precharge triggered by A10 high during read/write. All banks must be precharged before Mode Register Set, and eight CBR refresh cycles are required post-initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 4 banks × 32 bits = 64 Mbit total capacity |
| Max Clock Frequency | 166 MHz - defines maximum sustained data throughput of 533 MB/s (166M × 32-bit) |
| CAS Latency | CL = 3 - fixed 3-clock delay between column address strobe and first valid DQ output |
| Burst Length | Programmable 1, 2, 4, 8, or full-page - determines consecutive column accesses per command |
| Refresh Requirement | 4,096 cycles / 64 ms - mandates refresh controller scheduling every 15.625 µs per row |
| Supply Voltage | 3.3 V ± 0.3 V - requires stable LDO regulation; not compatible with 2.5 V or 1.8 V systems |
| Operating Temperature | −40°C to +85°C - qualified for industrial environments without derating |
| Self-Refresh Current | ≤2 mA - enables low-power retention during system sleep with internal oscillator active |
Pinout & Package
W9864G2JH-6I is packaged in a RoHS-compliant, lead-free 86-pin TSOP II (Thin Small Outline Package, Type II) with standard 0.5 mm pitch and 12.0 mm × 20.0 mm body dimensions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Input | Multiplexed row/column address lines; A10 controls all-bank precharge when sampled during PRE command |
| BS0, BS1 | Bank Select | 2-bit encoding selects one of four internal banks for activation or access |
| DQ0–DQ31 | Data I/O | 32-bit bidirectional data bus; DQM0–DQM3 mask individual byte lanes during write/read |
| CS, RAS, CAS, WE | Command Control | Four active-low control signals decoded synchronously on CLK rising edge to execute operations |
| CLK, CKE | Timing Interface | CLK provides synchronous edge sampling; CKE gates clock domain entry into power-down/self-refresh |
| VDD, VSS | Core Power/Ground | 3.3 V supply and return for logic circuitry and input buffers |
| VDDQ, VSSQ | I/O Power/Ground | Isolated 3.3 V rail and ground for DQ/DQM drivers to minimize switching noise coupling |
| DQM0–DQM3 | Data Mask | Per-byte write enable/disable; high during read forces DQ Hi-Z after CL+2 latency |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Burst Mode | Selectable sequential or interleave addressing per burst - enables optimized cache-line fetch patterns in MCU-based systems |
| Auto-Precharge Support | A10-driven automatic bank precharge after read/write - reduces manual command overhead and improves bandwidth in burst-heavy workloads |
| Multi-Bank Interleaving | Four independent banks allow overlapping activate/precharge/read cycles - hides tRCD and tRP delays in pipelined memory access |
| LVTTL-Compatible Interface | 3.3 V logic thresholds with 20 mA drive strength - ensures direct interfacing with legacy microcontrollers and FPGAs without level shifters |
| Industrial Temperature Range | −40°C to +85°C operation with guaranteed timing - eliminates thermal derating concerns in uncontrolled enclosures |
| Low-Power Self-Refresh | 2 mA max current during self-refresh - supports battery-backed suspend modes in portable industrial HMI units |
Applications
| Industrial PLC Memory | Legacy Medical Device Buffer |
|---|---|
Use Scenario: Real-time ladder logic execution in DIN-rail mounted programmable logic controllers requiring deterministic memory access. IC Role / Device Role / Timing Role: Main program/data RAM interfaced directly to ARM7 or ColdFire MCU with synchronous bus controller. Use Value: 166 MHz clock and CL3 latency deliver predictable 18 ns read turnaround, enabling sub-millisecond scan cycle times without external wait-state insertion. | Use Scenario: Data buffering for ECG waveform acquisition and display in Class II medical instruments with long product lifecycles. IC Role / Device Role / Timing Role: Frame buffer and FIFO storage between ADC subsystem and LCD controller. Use Value: Four-bank architecture allows concurrent sample capture (Bank 0) and display refresh (Bank 1), eliminating frame tearing in 60 Hz GUI rendering. |
| Automotive Body Control Module | Point-of-Sale Terminal Main Memory |
Use Scenario: Non-safety-critical memory for HVAC, lighting, and door module firmware in passenger vehicles. IC Role / Device Role / Timing Role: Executable code and variable storage for 32-bit automotive microcontrollers operating in under-hood environments. Use Value: −40°C to +85°C qualification and 2 mA self-refresh current ensure reliable boot-from-flash and fail-safe state retention during cold cranking or thermal soak. | Use Scenario: Core memory in embedded Linux terminals handling payment processing, receipt printing, and barcode scanning. IC Role / Device Role / Timing Role: Primary SDRAM for ARM9-based SoC running lightweight Yocto OS and Java-based POS applications. Use Value: TSOP-II-86 footprint matches legacy PCB layouts; 524K×4×32 organization provides sufficient heap space for multi-threaded JVM without requiring DDR migration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16400J-6BLI | 16M×16 organization (same 256 Mbit density), 166 MHz/CL3, 86-pin TSOP-II, but uses different bank addressing (2 banks × 16M×16) | Requires bus-width reconfiguration (16-bit vs 32-bit DQ) and revised address mapping in memory controller firmware | Choose only if redesigning PCB and updating memory controller initialization sequence for 16-bit interface |
| MT48LC4M32B2P-6A:J | Same 512K×4×32 organization and 166 MHz/CL3 rating, but 86-pin TSOP-II with different pinout (e.g., DQM placement, VDDQ assignment) | Not pin-compatible; requires PCB layout revision and signal routing changes due to incompatible DQ/DQM grouping | Consider only for new designs where Micron's documentation and long-term availability outweigh migration effort |
Compared with IS42S16400J-6BLI and MT48LC4M32B2P-6A:J, W9864G2JH-6I offers native 32-bit bus alignment and Winbond's documented industrial qualification path, reducing firmware porting effort and enabling drop-in replacement on existing TSOP-II-86 footprints designed for 32-bit SDR SDRAM interfaces.
Availability
W9864G2JH-6I is available at Aetrix Electronics and suitable for industrial PLCs, legacy medical devices, automotive body control modules, and point-of-sale terminals requiring stable component supply across extended product lifecycles.
Supply support for W9864G2JH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontrollers, with over 30 years of DRAM design heritage and global manufacturing scale.
W9864G2JH-6I belongs to Winbond's legacy SDR SDRAM product line, engineered for cost-sensitive, long-lifecycle industrial and embedded applications where pin compatibility, temperature robustness, and firmware stability outweigh bandwidth demands of modern DDR interfaces.
FAQ
What is the maximum operating frequency and CAS latency of the W9864G2JH-6I?
The W9864G2JH-6I is rated for a maximum clock frequency of 166 MHz with CAS Latency 3. This means the device requires exactly three clock cycles between issuing a column address strobe (CAS) and the appearance of valid data on DQ pins. The -6I suffix specifically denotes industrial-grade qualification at this speed grade, with guaranteed timing performance across the full −40°C to +85°C temperature range. No overclocking or CL2 operation is supported.
Does the W9864G2JH-6I support both sequential and interleave burst modes?
Yes, the W9864G2JH-6I supports both sequential and interleave burst addressing modes, which are selected via the Mode Register during initialization. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleave mode toggles specific address bits (A0, A1, A2 depending on burst length) to optimize access patterns for certain cache architectures. The W9864G2JH-6I implements this using internal address counters and does not require external logic to generate interleaved sequences.
What is the refresh requirement for the W9864G2JH-6I, and how is it implemented?
The W9864G2JH-6I requires 4,096 refresh cycles every 64 ms, equating to one refresh command every 15.625 µs on average. Refresh is implemented via externally initiated Auto-Refresh (CBR) commands issued by the memory controller, or internally during Self-Refresh mode when CKE is held low. During Self-Refresh, the W9864G2JH-6I uses an internal oscillator to autonomously issue refresh cycles without external clock or command input, drawing ≤2 mA current.
Can the W9864G2JH-6I be used in a 16-bit data bus configuration?
No, the W9864G2JH-6I is a fixed 32-bit wide device with 32 dedicated DQ pins (DQ0–DQ31) and no configurable bus width. It cannot be operated in 16-bit mode without external data masking or truncation, which would violate timing and functionality requirements. Systems requiring 16-bit SDRAM must select a part with native 16-bit organization (e.g., x16) such as IS42S16400J-6BLI, which has different pinout, bank structure, and initialization behavior than the W9864G2JH-6I.
What package type and pin count does the W9864G2JH-6I use?
The W9864G2JH-6I uses an 86-pin TSOP II (Thin Small Outline Package, Type II) with 0.5 mm pitch, measuring 12.0 mm × 20.0 mm. It is lead-free and RoHS compliant. Pin functions include 32 data lines (DQ0–DQ31), four data masks (DQM0–DQM3), eleven address lines (A0–A10), two bank selects (BS0, BS1), four command inputs (CS, RAS, CAS, WE), plus CLK, CKE, VDD, VSS, VDDQ, VSSQ, and NC pins - all matching JEDEC-standard SDR SDRAM TSOP-II mechanical and electrical specifications.
W9864G2JH-6I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 86-TFSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 64Mbit
- Memory Organization:
- 2M x 32
- Memory Interface:
- LVTTL
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 86-TSOP II
W9864G2JH-6I FAQ
1.How can I place an order for W9864G2JH-6I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9864G2JH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9864G2JH-6I reliable?
The price and inventory of W9864G2JH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G2JH-6I is usually 5 days.
3.What payment methods are accepted for W9864G2JH-6I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G2JH-6I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9864G2JH-6I?
W9864G2JH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9864G2JH-6I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9864G2JH-6I?
For technical support, including W9864G2JH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G2JH-6I requirements.
6.How does Aetrix verify that W9864G2JH-6I is sourced from the original manufacturer or authorized distributors?
All W9864G2JH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G2JH-6I meets industry standards.
7.What is the process for return or replacement of W9864G2JH-6I?
All W9864G2JH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9864G2JH-6I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9864G2JH-6I part is unused and in its original packaging.
Return procedure for W9864G2JH-6I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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