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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9864G6IH-6

Name: W9864G6IH-6
Brand: Winbond Electronics Corporation
SKU: W9864G6IH-6
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9864G6IH-6

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TSOP (0.400", 10.16mm Width)

Datasheet:: W9864G6IH-6.pdf

Description:: IC DRAM 64MBIT PAR 54TSOP II

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W9864G6IH-6 from Winbond Electronics is a 1M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, supporting burst lengths of 1/2/4/8/full page and LVTTL interface. It delivers up to 332 MB/s bandwidth and is used as main memory in embedded controllers, industrial HMIs, and legacy communication baseband modules requiring JEDEC-compliant SDRAM timing.

For engineers reviewing the W9864G6IH-6 datasheet, W9864G6IH-6 pinout, W9864G6IH-6 application, or W9864G6IH-6 equivalent, key selection criteria include tRCD = 20 ns, tRP = 20 ns, self-refresh current ≤2 mA, TSOP II-54 package compatibility, and support for auto-precharge and interleave-bank access in resource-constrained systems.

Technical Context

This SDRAM implements four independent 1M-word banks with shared address/command bus and separate DQ I/O buffers powered by VDDQ/VSSQ. Its internal architecture includes programmable mode register control for burst type (sequential/interleave), CAS latency (2 or 3), and burst length-enabling optimization for sequential streaming or random-access workloads.

It supports full JEDEC SDRAM command set including Bank Activate, Read/Write with auto-precharge, Burst Stop, Self Refresh, and Power Down modes. Timing compliance requires tRAS ≥ 42 ns, tRC ≥ 62 ns, and tREF = 64 ms for 4K refresh cycles, with CKE-controlled clock gating for dynamic power management.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	1,048,576 words × 4 banks × 16 bits = 16 Mbit total capacity
Max Clock Frequency	166 MHz - defines maximum sustained data transfer rate of 332 MB/s (166 MHz × 2 bytes)
CAS Latency	CL = 3 - imposes 3-clock-cycle delay between column address strobe and first valid read data output
Burst Length	1, 2, 4, 8, or full-page - determines number of consecutive column accesses per READ/WRITE command
tRCD / tRP	20 ns each - minimum Row-to-Column Delay and Precharge Delay, critical for bank activation timing
Refresh Requirement	4,096 cycles per 64 ms - mandates periodic refresh to retain data; supported via Auto-Refresh or Self-Refresh
Supply Voltage	3.0–3.6 V (VDD/VDDQ) - compatible with standard 3.3 V logic rails; no 2.7 V operation for -6 grade
Operating Temperature	0°C to +70°C - commercial-grade thermal range suitable for non-automotive industrial environments

Pinout & Package

W9864G6IH-6 is packaged in a 54-pin TSOP II (Type II), 400-mil body, RoHS-compliant lead-free package with separate VDDQ/VSSQ power/ground pins for I/O noise isolation.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge when high during PRECHARGE command
BS0, BS1	Bank Select	Selects one of four internal banks during ACTIVATE or READ/WRITE commands
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; LDQM/UDQM control lower/upper byte masking during writes and output tri-state during reads
CS, RAS, CAS, WE	Command Control	JEDEC-standard command inputs decoded on CLK rising edge; define all operations including REFRESH and MODE REGISTER SET
CLK, CKE	Timing Control	CLK synchronizes all inputs; CKE enables/disables internal clock - low entry into Power Down or Self Refresh
VDD, VDDQ, VSS, VSSQ	Power Distribution	VDD/VSS power core logic; VDDQ/VSSQ isolate I/O drivers to reduce switching noise on data bus
NC	No Connect	Pins 36 and 40 - must be left floating or tied to ground; no internal connection

Key Features

Feature	Design Value
Interleaved Bank Access	Enables continuous data flow across banks without row precharge penalty - reduces effective latency in multi-page workloads
Programmable Burst Mode	Supports both sequential and interleave addressing - allows matching of burst pattern to memory controller's access stride
Auto-Precharge	Automatically initiates bank precharge after burst completion when A10 = high - eliminates explicit PRECHARGE command overhead
Low-Power Self Refresh	Draws ≤2 mA during Self Refresh - maintains data retention with minimal external support while system is idle
LVTTL-Compatible Interface	Operates with standard 3.3 V logic thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) - interfaces directly with legacy microcontrollers and FPGAs
TSOP II Mechanical Fit	54-pin, 400-mil width footprint - matches industry-standard SDRAM socket layouts for drop-in replacement in existing PCBs

Applications

Industrial HMI Memory Buffer	Legacy Baseband Processor Cache
Use Scenario: Touchscreen-based human-machine interface in factory automation panels running real-time OS with limited external memory bandwidth. IC Role / Device Role / Timing Role: Primary working memory for GUI frame buffer and application code execution; synchronized to system clock with CL3 timing. Use Value: 166 MHz operation meets display refresh throughput requirements while TSOP II package enables compact layout in space-constrained front-panel designs.	Use Scenario: Data buffering in 3G TD-SCDMA baseband processors where DDR was not yet adopted and SDRAM remains cost-optimized. IC Role / Device Role / Timing Role: Off-chip memory for channel estimation and turbo decoding buffers; accessed via burst-4 interleaved reads to hide tRCD latency. Use Value: Interleave-mode burst access sustains >90% bus utilization during signal processing pipelines without requiring memory controller redesign.
Embedded Network Router Packet Buffer	Medical Diagnostic Imaging Controller
Use Scenario: Store-and-forward packet buffering in low-cost Layer 3 switches handling 100 Mbps Ethernet traffic with deterministic latency. IC Role / Device Role / Timing Role: Shared packet memory pool managed by MIPS-based SoC; uses auto-precharge to minimize command overhead during burst write/read cycles. Use Value: tRP = 20 ns and tRCD = 20 ns allow tight scheduling of back-to-back packet writes, reducing average queuing delay under bursty traffic loads.	Use Scenario: Real-time image reconstruction buffer in portable ultrasound devices using FPGA-based beamforming engines. IC Role / Device Role / Timing Role: Frame-aligned line buffer for echo data before FFT processing; operates in self-refresh during standby to preserve image context. Use Value: ≤2 mA self-refresh current extends battery life during clinical pauses without compromising data integrity across imaging sessions.

Industrial HMI Memory Buffer

Legacy Baseband Processor Cache

Use Scenario: Touchscreen-based human-machine interface in factory automation panels running real-time OS with limited external memory bandwidth.

IC Role / Device Role / Timing Role: Primary working memory for GUI frame buffer and application code execution; synchronized to system clock with CL3 timing.

Use Value: 166 MHz operation meets display refresh throughput requirements while TSOP II package enables compact layout in space-constrained front-panel designs.

Use Scenario: Data buffering in 3G TD-SCDMA baseband processors where DDR was not yet adopted and SDRAM remains cost-optimized.

IC Role / Device Role / Timing Role: Off-chip memory for channel estimation and turbo decoding buffers; accessed via burst-4 interleaved reads to hide tRCD latency.

Use Value: Interleave-mode burst access sustains >90% bus utilization during signal processing pipelines without requiring memory controller redesign.

Embedded Network Router Packet Buffer

Medical Diagnostic Imaging Controller

Use Scenario: Store-and-forward packet buffering in low-cost Layer 3 switches handling 100 Mbps Ethernet traffic with deterministic latency.

IC Role / Device Role / Timing Role: Shared packet memory pool managed by MIPS-based SoC; uses auto-precharge to minimize command overhead during burst write/read cycles.

Use Value: tRP = 20 ns and tRCD = 20 ns allow tight scheduling of back-to-back packet writes, reducing average queuing delay under bursty traffic loads.

Use Scenario: Real-time image reconstruction buffer in portable ultrasound devices using FPGA-based beamforming engines.

IC Role / Device Role / Timing Role: Frame-aligned line buffer for echo data before FFT processing; operates in self-refresh during standby to preserve image context.

Use Value: ≤2 mA self-refresh current extends battery life during clinical pauses without compromising data integrity across imaging sessions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same 1M×4×16 organization, 166 MHz, CL3, TSOP II-54; tRCD/tRP = 20 ns; supports 2.5 V VDDQ option	Broader voltage flexibility (2.5–3.3 V I/O) suits mixed-voltage designs; identical timing and pinout	Preferred when board already uses 2.5 V I/O rails or requires extended voltage margin
MT48LC16M16A2P-6A:L	16 Mbit SDRAM, 166 MHz, CL3, TSOP II-54; tRCD/tRP = 22 ns; higher max self-refresh current (3 mA)	Slightly relaxed timing margins; wider availability in distribution channels; same JEDEC command set	Recommended for new designs prioritizing long-term supply continuity over minimal timing headroom

Compared with W9864G6IH-6, IS42S16100E-6BLI offers identical timing but added I/O voltage flexibility, while MT48LC16M16A2P-6A:L trades 2 ns of timing margin for broader logistics support - both require no PCB changes but differ in power rail compatibility and lifecycle risk profile.

Availability

W9864G6IH-6 is available at Aetrix Electronics and suitable for industrial HMI, legacy telecom baseband, and medical imaging controller applications requiring stable component supply and long-lifecycle support.

Supply support for W9864G6IH-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontrollers, with leadership in serial flash, SDR/DDR SDRAM, and voice/audio SoCs.

W9864G6IH-6 belongs to Winbond's legacy parallel SDRAM product line designed for cost-sensitive, non-graphics embedded systems where JEDEC-compliant timing and TSOP II compatibility are essential.

FAQ

What is the maximum operating frequency and CAS latency supported by W9864G6IH-6?

W9864G6IH-6 is rated for 166 MHz operation with CAS Latency 3 (CL3). This means the device requires exactly three clock cycles between issuing a READ command and the appearance of the first valid data on DQ pins. The -6 speed grade does not support CL2 operation; only -5 and -7/-7S grades offer dual-latency capability per datasheet Table 3.

Does W9864G6IH-6 support both sequential and interleave burst addressing modes?

Yes, W9864G6IH-6 supports both sequential and interleave burst modes, configured via the Mode Register Set command. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleave mode toggles specific address bits (A0–A2 depending on burst length) to optimize cache-line-like access patterns. Both modes are fully functional at 166 MHz with CL3 timing.

What are the power supply requirements for W9864G6IH-6?

W9864G6IH-6 requires VDD and VDDQ between 3.0 V and 3.6 V, with recommended nominal 3.3 V. Unlike the -7/-7S variants, the -6 grade does not support 2.7 V operation. VDD powers core logic; VDDQ separately powers I/O buffers to reduce noise coupling - both must be decoupled with 0.1 µF ceramics near respective pins.

How many refresh cycles does W9864G6IH-6 require, and what is the interval?

W9864G6IH-6 requires 4,096 refresh cycles every 64 ms (tREF), equating to one refresh command every 15.625 µs on average. These may be issued as distributed Auto-Refresh commands or as a burst of 4,096 cycles before entering/exiting Self Refresh mode. Failure to meet this interval risks data retention loss in any bank.

Is W9864G6IH-6 pin-compatible with other Winbond SDRAMs like W9864G6JH-6?

W9864G6IH-6 is not pin-compatible with W9864G6JH-6. While both are 16 Mbit SDRAMs in TSOP II-54 packages, W9864G6JH-6 uses a different internal bank organization (2M × 2 banks × 16 bits) and has distinct pin assignments for A10/AP and BS0/BS1 functions. Direct substitution would cause command decoding errors and memory corruption.

W9864G6IH-6 Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TSOP (0.400", 10.16mm Width)

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 64Mbit

Memory Organization:: 4M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TSOP II

W9864G6IH-6 FAQ

1.How can I place an order for W9864G6IH-6 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9864G6IH-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9864G6IH-6 reliable?

The price and inventory of W9864G6IH-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G6IH-6 is usually 5 days.

3.What payment methods are accepted for W9864G6IH-6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G6IH-6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9864G6IH-6?

W9864G6IH-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9864G6IH-6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9864G6IH-6?

For technical support, including W9864G6IH-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G6IH-6 requirements.

6.How does Aetrix verify that W9864G6IH-6 is sourced from the original manufacturer or authorized distributors?

All W9864G6IH-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G6IH-6 meets industry standards.

7.What is the process for return or replacement of W9864G6IH-6?

All W9864G6IH-6 units undergo pre-shipment inspection (PSI). If there is an issue with W9864G6IH-6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9864G6IH-6 part is unused and in its original packaging.

Return procedure for W9864G6IH-6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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