Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W9864G6JB-6I

Part No.:
W9864G6JB-6I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW9864G6JB-6I.pdf
Description:
IC DRAM 64MBIT LVTTL 60VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,732

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W9864G6JB-6I from Winbond is a 1M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (–40°C to +85°C). It delivers up to 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and display subsystems.

For engineers reviewing the W9864G6JB-6I datasheet, W9864G6JB-6I pinout, W9864G6JB-6I application, or W9864G6JB-6I equivalent, key selection criteria include its VFBGA-60 package, LVTTL interface compatibility, self-refresh capability, programmable mode register, and industrial-grade thermal reliability for long-lifecycle industrial HMI and network edge devices.

Technical Context

This SDRAM implements four independent 1M-word banks with interleaved access to hide precharge latency. Its command decoder synchronizes all operations-including Bank Activate, Read/Write, Auto-precharge, and Self Refresh-to the rising edge of CLK, with CKE enabling/disabling clock domain entry into Power Down or Clock Suspend modes.

The device uses multiplexed address pins (A0–A11) for row/column addressing, BS0/BS1 for bank selection, and UDQM/LDQM for per-byte write masking and output tri-state control. Mode Register configuration defines burst type (sequential/interleave), length, and CAS latency-enabling optimization for sequential streaming or random-access patterns in real-time video frame buffers.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization1,048,576 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency166 MHz - enables 332 MB/s peak data rate with 16-bit bus
CAS LatencyCL = 3 - fixed timing delay between column address strobe and first valid read data
Burst LengthProgrammable 1/2/4/8/full page - determines consecutive column accesses per command
Supply Voltage3.3 V ± 0.3 V - compatible with standard LVTTL I/O domains and legacy 3.3V system rails
Operating Temperature–40°C to +85°C - qualified for industrial environments without derating
Refresh Requirement4,096 cycles / 64 ms - ensures data retention without host intervention during self-refresh

Pinout & Package

VFBGA-60 package (6.4 mm × 10.1 mm, 0.65 mm ball pitch, lead-free RoHS-compliant).

Pin/Terminal Circuit Role Design Meaning
A0–A11Address InputMultiplexed row/column address lines; A10 controls all-bank vs. bank-specific precharge
BS0, BS1Bank SelectBinary-encoded selection of one of four internal memory banks for activation or access
DQ0–DQ15Data I/O16-bit bidirectional data bus with separate VDDQ/VSSQ for noise isolation
UDQM, LDQMData MaskUpper/lower byte write enable and output disable control with zero-latency masking
CLK, CKETiming ControlSystem clock input and clock enable; CKE low enters Power Down or Self Refresh
CS#, RAS#, CAS#, WE#Command StrobesActive-low command inputs decoded synchronously on CLK rising edge

Key Features

Feature Design Value
Self Refresh ModeAutonomous refresh during CKE-low state preserves data with no external clock or commands
Auto-prechargeAutomatic bank precharge triggered by A10-high during Read/Write, reducing command overhead
Interleaved Burst AccessConcurrent activation across banks enables continuous data flow without tRC stalls
LVTTL-Compatible InterfaceDirect connection to 3.3V microcontrollers, FPGAs, and SoCs without level-shifting
Programmable Mode RegisterRuntime configuration of burst type (sequential/interleave), length, and CAS latency

Applications

Industrial HMI Display Buffer Network Edge Router Packet Buffer

Use Scenario: Storing and streaming real-time graphical UI frames in panel-mounted HMIs with ARM Cortex-A8/A9 processors.

IC Role / Device Role / Timing Role: Primary frame buffer memory synchronized to display controller pixel clock and CPU AXI bus.

Use Value: 166 MHz operation and 4-bank interleaving sustain >120 fps rendering at 800×480 resolution with minimal CPU wait states.

Use Scenario: Temporary storage of ingress/egress Ethernet packets in Layer 3 switches before classification and forwarding.

IC Role / Device Role / Timing Role: Shared packet buffer accessed concurrently by MAC and switching fabric logic.

Use Value: Full-page burst reads/writes and auto-precharge reduce command latency, improving throughput under 100 Mbps sustained traffic.

Medical Imaging Data Cache Automated Test Equipment (ATE) Pattern Memory

Use Scenario: Capturing and staging raw sensor data from ultrasound transducer arrays prior to DSP processing.

IC Role / Device Role / Timing Role: High-bandwidth intermediate memory between ADC interface and FPGA-based beamformer.

Use Value: CL3 timing and 16-bit bus match typical 12–14 bit ADC sample widths, minimizing bus width conversion overhead.

Use Scenario: Storing test vectors and expected response patterns for high-speed digital IC validation at 100+ MHz.

IC Role / Device Role / Timing Role: Deterministic-access pattern memory synchronized to ATE timing generator clock.

Use Value: Industrial temperature rating ensures stable timing margins across environmental chambers during burn-in testing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS42S16100E-6BLISame 1M×4×16 organization, 166 MHz, CL3, but 54-ball TSOP-II package (not VFBGA)Requires PCB redesign for through-hole or larger footprint; lacks VFBGA space efficiencySelect when board layout prioritizes reworkability over miniaturization and thermal performance is less constrained.
MT48LC16M16A2P-6A:G16M×16 organization (256 Mbit), same VFBGA-60, 166 MHz/CL3, but higher density and different refresh timingNot drop-in: requires address/data bus remapping and updated initialization sequence for larger arrayChoose only if system demands >128 Mbit capacity and firmware can accommodate extended mode register programming.

Compared with W9864G6JB-6I, IS42S16100E-6BLI trades package compactness for assembly flexibility, while MT48LC16M16A2P-6A:G increases capacity at the cost of non-interchangeable timing and initialization-neither offers pin-to-pin or functional drop-in replacement without hardware or software adaptation.

Availability

W9864G6JB-6I is available at Aetrix Electronics and suitable for industrial HMI, network edge infrastructure, medical imaging subsystems, and automated test equipment requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9864G6JB-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.

The W9864G6JB series belongs to Winbond's industrial-grade SDRAM product line, designed specifically for reliable, low-power, high-bandwidth memory buffering in harsh-environment embedded systems where long-term supply stability and thermal robustness are critical.

FAQ

What is the maximum operating frequency and CAS latency of the W9864G6JB-6I?

The W9864G6JB-6I operates at a maximum clock frequency of 166 MHz with a fixed CAS latency of 3. This timing is guaranteed across its full industrial temperature range (–40°C to +85°C), and the device must be initialized via Mode Register Set to lock CL3 before normal operation. The W9864G6JB-6I does not support dynamic CAS latency switching.

Does the W9864G6JB-6I support self-refresh mode, and how is it activated?

Yes, the W9864G6JB-6I supports autonomous self-refresh mode. It is activated by asserting CS#, RAS#, CAS#, and WE# low while holding CKE low on the rising edge of CLK. Once entered, the device maintains data integrity without external clocks or commands for the duration of the 64 ms refresh interval, exiting only when CKE is returned high and tXSR delay is observed. The W9864G6JB-6I draws ≤2 mA in this state.

What package type and ball count does the W9864G6JB-6I use?

The W9864G6JB-6I uses a VFBGA-60 package measuring 6.4 mm × 10.1 mm with 0.65 mm ball pitch and 0.4 mm ball diameter. It is lead-free and RoHS compliant. Ball assignments include 12 address pins (A0–A11), 16 data I/Os (DQ0–DQ15), dual DQM lines, four command strobes (CS#, RAS#, CAS#, WE#), CLK, CKE, two bank selects (BS0/BS1), and dedicated VDD/VSS/VDDQ/VSSQ supplies.

How does auto-precharge work on the W9864G6JB-6I, and what is the role of A10?

Auto-precharge on the W9864G6JB-6I is triggered when A10 is driven high during a Read or Write command. This causes the active bank to begin precharging automatically before burst completion-reducing command overhead. For reads, precharge starts tCL clocks before burst end; for writes, it begins two clocks after final data input (tWR). The W9864G6JB-6I requires tRP ≥ 18 ns after auto-precharge initiation before reactivation.

Is the W9864G6JB-6I compatible with standard LVTTL logic levels?

Yes, the W9864G6JB-6I uses LVTTL-compatible input thresholds and drive strengths: VIH = 2.0 V min, VIL = 0.8 V max, VOH = VDD–0.4 V min, VOL = 0.4 V max at IOH/IOL = ±20 µA. Its VDDQ-supplied DQ outputs and VDD-supplied command/address inputs meet JEDEC Standard No. 15 for 3.3V SDRAM, ensuring interoperability with common microcontrollers, FPGAs, and ASICs without level shifters.

W9864G6JB-6I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
64Mbit
Memory Organization:
4M x 16
Memory Interface:
LVTTL
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-VFBGA (6.4x10.1)

W9864G6JB-6I FAQ

1.How can I place an order for W9864G6JB-6I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9864G6JB-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9864G6JB-6I reliable?

The price and inventory of W9864G6JB-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G6JB-6I is usually 5 days.

3.What payment methods are accepted for W9864G6JB-6I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G6JB-6I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9864G6JB-6I?

W9864G6JB-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9864G6JB-6I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9864G6JB-6I?

For technical support, including W9864G6JB-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G6JB-6I requirements.

6.How does Aetrix verify that W9864G6JB-6I is sourced from the original manufacturer or authorized distributors?

All W9864G6JB-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G6JB-6I meets industry standards.

7.What is the process for return or replacement of W9864G6JB-6I?

All W9864G6JB-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9864G6JB-6I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9864G6JB-6I part is unused and in its original packaging.

Return procedure for W9864G6JB-6I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W9864G6JB-6I Tags

  • W9864G6JB-6I
  • W9864G6JB-6I PDF
  • W9864G6JB-6I Datasheet
  • W9864G6JB-6I Specifications
  • W9864G6JB-6I Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W9864G6JB-6I
  • Buy W9864G6JB-6I
  • W9864G6JB-6I Price
  • W9864G6JB-6I Distributor
  • W9864G6JB-6I Supplier
  • W9864G6JB-6I Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER