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Winbond Electronics Corporation W9864G6JB-6I TR

Part No.:
W9864G6JB-6I TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW9864G6JB-6I TR.pdf
Description:
IC DRAM 64MBIT LVTTL 60VFBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,473

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Product details

Overview

W9864G6JB-6I TR from Winbond is a 1M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and industrial temperature range (–40°C to +85°C). It delivers up to 166 million words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and display subsystems.

For engineers reviewing the W9864G6JB-6I TR datasheet, W9864G6JB-6I TR pinout, W9864G6JB-6I TR application, or W9864G6JB-6I TR equivalent, key selection criteria include tRCD = 20 ns, tRP = 20 ns, self-refresh current ≤2 mA, VFBGA-60 package compatibility, and LVTTL interface timing compliance with JEDEC SDRAM standards.

Technical Context

This SDRAM implements four independent 1M-word banks with shared address/command bus and multiplexed row/column addressing. Internal refresh counter executes 4K cycles per 64 ms, and programmable Mode Register configures burst type (sequential/interleaved), length, and CAS latency.

It supports auto-precharge on read/write via A10 assertion, clock suspend mode via CKE low during active bank operation, and power-down mode with CKE gating. DQ masking uses separate LDQM/UDQM pins for byte-level write control and output tri-state management during read interruption.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization1,048,576 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency166 MHz - defines maximum data transfer rate of 332 MB/s (16-bit bus)
CAS LatencyCL = 3 - fixed 3-cycle delay between column command and first valid data output
tRCD / tRP20 ns - minimum Row-to-Column Delay and Precharge Delay, constraining bank activation timing
Refresh Rate4,096 cycles / 64 ms - requires one refresh command every 15.625 µs per bank
Supply Voltage3.3 V ± 0.3 V - mandates stable LDO regulation; incompatible with 2.5 V or 1.8 V systems
Operating Temperature–40°C to +85°C - qualified for industrial-grade embedded applications without derating
Interface StandardLVTTL - compatible with 3.3 V logic families; not LVDS, SSTL, or DDR-compatible

Pinout & Package

VFBGA-60 package, 6.4 mm × 10.1 mm body, 0.65 mm ball pitch, RoHS-compliant lead-free construction.

Pin/Terminal Circuit Role Design Meaning
A0–A11Address InputMultiplexed row/column address lines; A10 controls all-bank precharge when asserted during command
BS0, BS1Bank SelectTwo-bit encoding selects one of four internal banks during ACTIVATE or PRECHARGE
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports byte masking via LDQM (DQ0–DQ7) and UDQM (DQ8–DQ15)
CS#, RAS#, CAS#, WE#Command ControlActive-low command inputs decoded synchronously on CLK rising edge per JEDEC SDRAM protocol
CLK, CKETiming ControlCLK drives all synchronous operations; CKE enables/disables internal clock domain (Power Down/Self Refresh entry)
UDQM, LDQMData MaskAssert high to mask corresponding DQ byte during write or force DQ output to Hi-Z during read
VDD, VSSCore Power/Ground3.3 V supply and return for logic circuitry; 12 dedicated pins ensure low-noise core voltage
VDDQ, VSSQI/O Power/GroundSeparated 3.3 V supply/ground for DQ drivers to minimize switching noise coupling into core logic

Key Features

Feature Design Value
Programmable Burst LengthConfigurable 1/2/4/8/full-page bursts via Mode Register - enables optimization for sequential streaming or random access patterns
Auto-Precharge SupportA10-driven auto-precharge on read/write - eliminates explicit PRECHARGE command overhead and reduces latency in burst-heavy workloads
Self-Refresh ModeAutonomous refresh with ≤2 mA current draw - maintains data integrity during host processor sleep without external refresh controller
Interleaved Bank AccessConcurrent activation across 4 banks - hides tRCD/tRP delays and sustains >80% bus utilization under continuous access
Byte-Level Write MaskingIndependent LDQM/UDQM control - allows partial-word writes without read-modify-write cycles, critical for graphics frame buffer updates
Industrial Temp Range–40°C to +85°C operation - validated for use in automotive infotainment, industrial HMIs, and outdoor networking equipment

Applications

Graphics Frame Buffer Industrial HMI Controller

Use Scenario: Storing pixel data for TFT-LCD panels in human-machine interface devices with 800×480 resolution and 16-bit color depth.

IC Role / Device Role / Timing Role: Primary frame buffer memory interfaced directly to display controller's SDRAM port; operates in burst-length-8 sequential mode with CL3 timing.

Use Value: 128 Mbit capacity supports dual-buffered 800×480×16bpp frames; VFBGA-60 footprint minimizes PCB area in space-constrained front-panel designs.

Use Scenario: Real-time data logging and UI rendering in programmable logic controller (PLC) operator terminals exposed to factory-floor thermal cycling.

IC Role / Device Role / Timing Role: System RAM for ARM Cortex-M7-based HMI SoC; provides scratchpad and display buffer storage with guaranteed –40°C to +85°C reliability.

Use Value: Industrial-grade (-6I) qualification ensures uninterrupted operation during ambient temperature swings; self-refresh mode preserves log data during brown-out events.

Embedded Video Decoder Network Edge Router Buffer

Use Scenario: Intermediate frame storage for MPEG-4 decode pipelines in IP camera SoCs processing 720p@30fps video streams.

IC Role / Device Role / Timing Role: Line buffer and reference frame store for motion compensation engine; accessed via interleaved bank reads with burst-length-4.

Use Value: 166 MHz clock enables ≥332 MB/s sustained bandwidth needed for real-time YUV420 planar data movement; tRCD = 20 ns meets decoder pipeline timing slack.

Use Scenario: Packet buffering in Layer 3 Ethernet switches handling 1 Gbps traffic with deep queue requirements for QoS prioritization.

IC Role / Device Role / Timing Role: Shared packet memory for ingress/egress queues; managed by switch fabric controller using auto-precharge writes to maximize throughput.

Use Value: Four-bank architecture enables concurrent packet enqueue/dequeue operations; 2 mA self-refresh current extends hold time during link flap recovery sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS42S16100E-6BLISame 1M×4×16 organization, 166 MHz, CL3, but uses TSOP-54 package (not VFBGA); tRC = 60 ns vs. 63 nsRequires PCB redesign due to different footprint and height; suitable only where board space permits larger packageSelect if TSOP-54 mechanical compatibility or legacy layout reuse is required over VFBGA miniaturization
MT48LC16M16A2P-6A:G16M×16 organization (256 Mbit), same VFBGA-60, but higher density and 143 MHz max speed; CL = 2/3 configurableNot drop-in: requires address bus extension and updated initialization sequence; suited for future-proofing or capacity scalingChoose when system firmware can support larger memory map and higher refresh overhead, or when density headroom is critical

Compared with IS42S16100E-6BLI, W9864G6JB-6I TR offers identical timing and functionality in a smaller VFBGA-60 package ideal for compact designs; versus MT48LC16M16A2P-6A:G, it trades density and flexibility for lower cost and simpler initialization in fixed-capacity applications.

Availability

W9864G6JB-6I TR is available at Aetrix Electronics and suitable for graphics frame buffers, industrial HMIs, embedded video decoders, and network edge router buffers requiring stable component supply across extended temperature ranges.

Supply support for W9864G6JB-6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and trusted computing solutions since 1987.

The W9864G6JB series belongs to Winbond's industrial SDRAM product line, designed specifically for cost-sensitive, space-constrained embedded systems requiring reliable operation from –40°C to +85°C without performance compromise.

FAQ

What is the maximum operating frequency and CAS latency of the W9864G6JB-6I TR?

The W9864G6JB-6I TR is rated for 166 MHz maximum clock frequency with fixed CAS Latency 3. This means the device requires exactly three clock cycles between issuing a column read command and the appearance of the first valid data word on DQ pins. The -6I suffix confirms industrial temperature qualification and CL3 timing compliance per JEDEC standard.

Does the W9864G6JB-6I TR support self-refresh mode, and what is its typical current draw?

Yes, the W9864G6JB-6I TR supports self-refresh mode, entering it upon receipt of the Self Refresh Command (CS#, RAS#, CAS# low, WE# high, CKE low). Its typical self-refresh current is ≤2 mA, as specified in the order information table. This enables data retention during host processor sleep states without external refresh controller intervention.

What package type and ball count does the W9864G6JB-6I TR use?

The W9864G6JB-6I TR uses a VFBGA-60 package: very thin fine-pitch ball grid array with 60 solder balls arranged in a 6.4 mm × 10.1 mm body, 0.65 mm pitch, and 0.4 mm ball diameter. This package is RoHS-compliant and lead-free, optimized for high-density PCB layouts in space-constrained embedded applications.

How does auto-precharge work on the W9864G6JB-6I TR, and which pin controls it?

Auto-precharge on the W9864G6JB-6I TR is triggered by asserting A10 high during a READ or WRITE command. When enabled, the SDRAM automatically initiates precharge of the accessed bank after the burst completes - eliminating the need for a separate PRECHARGE command. This reduces command overhead and improves effective bandwidth in burst-intensive applications.

Can the W9864G6JB-6I TR be used in systems requiring LVTTL-level signaling only?

Yes, the W9864G6JB-6I TR uses LVTTL-compatible input/output signaling with 3.3 V ±0.3 V supply, matching standard 3.3 V logic families. It does not support SSTL, HSTL, or DDR-specific signaling levels. All command, address, and data signals conform to LVTTL voltage thresholds and timing, ensuring interoperability with legacy microcontrollers and FPGAs featuring LVTTL I/O banks.

W9864G6JB-6I TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Size:
64Mbit
Memory Organization:
4M x 16
Memory Interface:
LVTTL
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-VFBGA (6.4x10.1)

W9864G6JB-6I TR FAQ

1.How can I place an order for W9864G6JB-6I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9864G6JB-6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9864G6JB-6I TR reliable?

The price and inventory of W9864G6JB-6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G6JB-6I TR is usually 5 days.

3.What payment methods are accepted for W9864G6JB-6I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G6JB-6I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9864G6JB-6I TR?

W9864G6JB-6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9864G6JB-6I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9864G6JB-6I TR?

For technical support, including W9864G6JB-6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G6JB-6I TR requirements.

6.How does Aetrix verify that W9864G6JB-6I TR is sourced from the original manufacturer or authorized distributors?

All W9864G6JB-6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G6JB-6I TR meets industry standards.

7.What is the process for return or replacement of W9864G6JB-6I TR?

All W9864G6JB-6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9864G6JB-6I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9864G6JB-6I TR part is unused and in its original packaging.

Return procedure for W9864G6JB-6I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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