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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9864G6JT-6 TR

Name: W9864G6JT-6 TR
Brand: Winbond Electronics Corporation
SKU: W9864G6JT-6 TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9864G6JT-6 TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TFBGA

Datasheet:: W9864G6JT-6 TR.pdf

Description:: IC DRAM 64MBIT LVTTL 54TFBGA

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Product details

Overview

W9864G6JT-6 TR from Winbond is a 1M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and TFBGA-54 (8×8 mm²) packaging. It delivers up to 166M words/second bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and industrial HMIs.

For engineers reviewing the W9864G6JT-6 TR datasheet, W9864G6JT-6 TR pinout, W9864G6JT-6 TR application, or W9864G6JT-6 TR equivalent, key selection criteria include CL3 timing compliance at 166 MHz, self-refresh capability (2 mA max), TFBGA-54 ball mapping, and support for interleaved bank access to hide precharge latency in real-time display buffers and network packet buffers.

Technical Context

This SDRAM implements a four-bank architecture with programmable mode register control over burst length (1–8, full page), burst type (sequential/interleave), and CAS latency (2 or 3). Its command interface uses LVTTL signaling with dedicated /CS, /RAS, /CAS, /WE, CKE, and dual DQM pins for precise read/write masking.

It supports critical low-power modes including Power Down (CKE-driven), Self Refresh (CKE low + /CS//RAS//CAS high, /WE high), and Auto-precharge (A10 high during Read/Write), with 4K refresh cycles per 64 ms and tRCD = 20 ns, tRP = 20 ns, and tRC = 60 ns at 166 MHz.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	1,048,576 words × 4 banks × 16 bits - provides 8 MiB total capacity with bank-interleaving for concurrent page access.
Clock Frequency	166 MHz - enables 166M words/sec peak bandwidth; requires stable 3.3V ±0.3V supply and matched trace routing.
CAS Latency	CL = 3 - defines 3-clock-cycle delay between column address strobe and first valid data output; fixed for -6 speed grade.
Burst Length	1, 2, 4, 8, or full page - selectable via mode register; determines consecutive column accesses per command without new address input.
Refresh Requirement	4K cycles / 64 ms - mandates periodic auto-refresh or self-refresh to retain data; critical for battery-backed or low-power suspend use.
Operating Temperature	0°C to 70°C - validated for commercial-grade applications including industrial HMIs and networking edge devices.
Package	TFBGA-54 (8×8 mm², 0.8 mm pitch) - RoHS-compliant lead-free package with VDDQ/VSSQ separation for I/O noise immunity.

Pinout & Package

W9864G6JT-6 TR uses a 54-ball TFBGA package (8×8 mm², 0.8 mm pitch) with separate VDDQ/VSSQ supplies for I/O buffers and dedicated LDQM/UDQM pins for byte-level write masking. Ball assignments follow JEDEC-standard SDRAM layout with multiplexed address inputs (A0–A11) and bank select (BS0/BS1).

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A10 controls all-bank vs. single-bank precharge when sampled during /PRE command.
BS0, BS1	Bank Select	Selects one of four internal banks during ACTIVE or READ/WRITE commands; enables true bank interleaving.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports burst reads/writes with automatic column counter increment or interleave addressing.
/CS, /RAS, /CAS, /WE	Command Control	Four active-low control signals defining all operations (e.g., /RAS+/CAS+/WE = WRITE); decoded synchronously on CLK rising edge.
LDQM, UDQM	Data Mask	Low-active masks for lower/upper 8 bits; places DQ outputs in Hi-Z during reads or blocks writes with zero latency.
CLK, CKE	Timing Control	CLK synchronizes all inputs; CKE gates internal clock - low enables Power Down, Self Refresh, or Clock Suspend modes.

Key Features

Feature	Design Value
Interleaved Bank Access	Enables seamless switching between four banks to hide tRP/tRCD delays - essential for sustained throughput in video frame buffers.
Programmable Burst Mode	Supports sequential or interleave addressing per burst - allows optimization for linear streaming (e.g., audio playback) or random-access patterns.
Auto-precharge	Automatically initiates bank precharge after burst completion when A10 is high - reduces software overhead in interrupt-driven buffer management.
Separate I/O Power (VDDQ/VSSQ)	Isolates data path power/ground from core logic - improves signal integrity and reduces crosstalk on 16-bit DQ bus in noisy industrial environments.
Self Refresh with 2 mA Max Current	Maintains data retention during host sleep without external refresh controller - enables low-power standby in portable HMI and gateway devices.

Applications

Industrial HMI Display Buffer	Network Packet Buffer
Use Scenario: Storing rendered GUI frames and touch event queues in a PLC operator panel with VGA resolution and 60 Hz update rate. IC Role / Device Role / Timing Role: Primary frame buffer memory; accepts burst writes from ARM Cortex-M7 DMA and burst reads by parallel RGB interface controller. Use Value: 4-bank interleaving sustains >130 MB/s effective bandwidth across mixed read/write traffic, eliminating frame tearing during simultaneous display refresh and button polling.	Use Scenario: Temporary storage of Ethernet II frames in a managed switch ASIC's ingress pipeline before classification and forwarding. IC Role / Device Role / Timing Role: High-speed packet staging memory; interfaces to MAC layer via 16-bit SDR bus synchronized to 166 MHz reference clock. Use Value: CL3 timing and full-page burst support enable sub-100 ns average access latency for 1518-byte frames, meeting cut-through switching latency budgets.
Embedded Media Decoder Buffer	Real-Time Data Logger Memory
Use Scenario: Holding decoded MPEG-2 video macroblocks in a digital signage player before HDMI transmission. IC Role / Device Role / Timing Role: Intermediate decode buffer; receives burst writes from hardware decoder engine and burst reads by pixel clock domain converter. Use Value: Programmable burst length (8) and interleave mode align with 64-byte cache line transfers, minimizing bus arbitration stalls during 1080p60 playback.	Use Scenario: Capturing sensor telemetry (voltage, temperature, vibration) at 10 kHz in an oil-field RTU with deterministic logging intervals. IC Role / Device Role / Timing Role: Circular buffer memory; written continuously by ADC DMA and read asynchronously by ARM core for SD card offload. Use Value: Self-refresh mode (2 mA) preserves buffer contents during 5-second brownout events, ensuring no loss of critical 30-second pre-fault waveform snapshots.

Industrial HMI Display Buffer

Network Packet Buffer

Use Scenario: Storing rendered GUI frames and touch event queues in a PLC operator panel with VGA resolution and 60 Hz update rate.

IC Role / Device Role / Timing Role: Primary frame buffer memory; accepts burst writes from ARM Cortex-M7 DMA and burst reads by parallel RGB interface controller.

Use Value: 4-bank interleaving sustains >130 MB/s effective bandwidth across mixed read/write traffic, eliminating frame tearing during simultaneous display refresh and button polling.

Use Scenario: Temporary storage of Ethernet II frames in a managed switch ASIC's ingress pipeline before classification and forwarding.

IC Role / Device Role / Timing Role: High-speed packet staging memory; interfaces to MAC layer via 16-bit SDR bus synchronized to 166 MHz reference clock.

Use Value: CL3 timing and full-page burst support enable sub-100 ns average access latency for 1518-byte frames, meeting cut-through switching latency budgets.

Embedded Media Decoder Buffer

Real-Time Data Logger Memory

Use Scenario: Holding decoded MPEG-2 video macroblocks in a digital signage player before HDMI transmission.

IC Role / Device Role / Timing Role: Intermediate decode buffer; receives burst writes from hardware decoder engine and burst reads by pixel clock domain converter.

Use Value: Programmable burst length (8) and interleave mode align with 64-byte cache line transfers, minimizing bus arbitration stalls during 1080p60 playback.

Use Scenario: Capturing sensor telemetry (voltage, temperature, vibration) at 10 kHz in an oil-field RTU with deterministic logging intervals.

IC Role / Device Role / Timing Role: Circular buffer memory; written continuously by ADC DMA and read asynchronously by ARM core for SD card offload.

Use Value: Self-refresh mode (2 mA) preserves buffer contents during 5-second brownout events, ensuring no loss of critical 30-second pre-fault waveform snapshots.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same 1M×4×16 organization, 166 MHz, CL3, TFBGA-54; but rated –40°C to 85°C (industrial grade) and specifies tRC = 63 ns vs. 60 ns.	Valid for extended-temperature deployments (e.g., outdoor base stations), but requires validation of tighter tRC margin in high-frequency designs.	Choose IS42S16100E-6BLI if operating beyond 70°C or requiring longer lifecycle availability; verify tRC timing closure in PCB layout.
MT48LC16M16A2P-6A	Same density and speed, but TSOP-54 package (not pin-compatible); tRCD = 22 ns (vs. 20 ns) and no VDDQ/VSSQ separation.	Suitable for cost-sensitive legacy designs using through-hole or standard SMT footprint, but lacks I/O noise isolation for high-noise industrial boards.	Choose MT48LC16M16A2P-6A only for TSOP-based redesigns where board space permits larger package and EMI sensitivity is low.

Compared with IS42S16100E-6BLI and MT48LC16M16A2P-6A, W9864G6JT-6 TR offers tighter tRCD/tRC timing and dedicated VDDQ/VSSQ for robust operation in electrically noisy industrial PCBs, while maintaining drop-in compatibility with other 54-ball TFBGA SDRAM footprints.

Availability

W9864G6JT-6 TR is available at Aetrix Electronics and suitable for industrial HMI display buffers, network packet staging, and embedded media decoder applications requiring stable component supply across multi-year production cycles.

Supply support for W9864G6JT-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontrollers, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.

W9864G6JT-6 TR belongs to Winbond's W9864G6J SDRAM product line, designed specifically for cost-optimized, high-reliability embedded systems requiring commercial-grade timing performance and RoHS-compliant packaging.

FAQ

What is the maximum operating frequency and CAS latency supported by W9864G6JT-6 TR?

W9864G6JT-6 TR is rated for 166 MHz operation with CAS Latency 3 (CL3) at 3.3V ±0.3V supply. It does not support CL2 at this speed grade; CL2 is only specified for the -6I variant under industrial temperature conditions. The device requires tRCD ≥ 20 ns and tRC ≥ 60 ns at 166 MHz, and these parameters must be met in PCB layout and controller timing configuration for reliable operation.

Does W9864G6JT-6 TR support self-refresh mode, and what is its typical current draw?

Yes, W9864G6JT-6 TR supports self-refresh mode, entering it when /CS, /RAS, /CAS are low, /WE is high, and CKE is low on the CLK rising edge. Its maximum self-refresh current is 2 mA at 70°C, enabling data retention during host processor sleep without external refresh circuitry - a key enabler for low-power industrial logging and HMI standby modes.

What package type and ball count does W9864G6JT-6 TR use, and is it RoHS compliant?

W9864G6JT-6 TR uses a 54-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package measuring 8 mm × 8 mm with 0.8 mm ball pitch. It is manufactured with lead-free materials and fully complies with RoHS Directive 2011/65/EU, as confirmed in the official Winbond datasheet revision A03.

How does the burst length setting affect address sequencing in W9864G6JT-6 TR?

In W9864G6JT-6 TR, burst length (1, 2, 4, 8, or full page) is programmed via the mode register and determines how many consecutive column addresses are accessed per READ/WRITE command. Sequential mode increments A0–A2 (for BL=8), while interleave mode toggles specific address bits - both modes eliminate need for external address generation during bursts, reducing controller overhead in video and packet processing.

Can W9864G6JT-6 TR be used in place of W9864G6JT-6I, and what are the key differences?

W9864G6JT-6 TR and W9864G6JT-6I share identical electrical specifications and timing (166 MHz/CL3), but differ in temperature rating: -6 TR is commercial grade (0°C to 70°C), while -6I is industrial grade (–40°C to 85°C). They are pin- and functionally compatible, but substituting -6 TR in extended-temperature environments risks timing violation or data retention failure outside its rated range.

W9864G6JT-6 TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TFBGA

Packaging:: Tray

Product Status:: Not For New Designs

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 64Mbit

Memory Organization:: 4M x 16

Memory Interface:: LVTTL

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TFBGA (8x8)

W9864G6JT-6 TR FAQ

1.How can I place an order for W9864G6JT-6 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9864G6JT-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9864G6JT-6 TR reliable?

The price and inventory of W9864G6JT-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G6JT-6 TR is usually 5 days.

3.What payment methods are accepted for W9864G6JT-6 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G6JT-6 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9864G6JT-6 TR?

W9864G6JT-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9864G6JT-6 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9864G6JT-6 TR?

For technical support, including W9864G6JT-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G6JT-6 TR requirements.

6.How does Aetrix verify that W9864G6JT-6 TR is sourced from the original manufacturer or authorized distributors?

All W9864G6JT-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G6JT-6 TR meets industry standards.

7.What is the process for return or replacement of W9864G6JT-6 TR?

All W9864G6JT-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9864G6JT-6 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9864G6JT-6 TR part is unused and in its original packaging.

Return procedure for W9864G6JT-6 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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