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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9864G6KH-6I

Name: W9864G6KH-6I
Brand: Winbond Electronics Corporation
SKU: W9864G6KH-6I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9864G6KH-6I

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TSOP (0.400", 10.16mm Width)

Datasheet:: W9864G6KH-6I.pdf

Description:: IC DRAM 64MBIT PAR 54TSOP II

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W9864G6KH-6I from Winbond is a 1M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, supporting LVTTL interface and industrial temperature range (−40°C to +85°C). It delivers 332 MB/s peak bandwidth, uses TSOP II-54 package, and supports burst lengths of 1/2/4/8/full-page in sequential or interleave mode for embedded main memory applications.

For engineers reviewing the W9864G6KH-6I datasheet, W9864G6KH-6I pinout, W9864G6KH-6I application, or W9864G6KH-6I equivalent, key selection considerations include industrial-grade thermal reliability, programmable mode register configuration, auto-precharge timing compliance (tRP = 15 ns), and TSOP II pin compatibility with legacy SDRAM-based controllers in networking and industrial HMI designs.

Technical Context

This SDRAM implements four independent 1M-word banks with shared address/command bus and separate DQ I/O buffers powered by VDDQ/VSSQ for noise isolation. Row activation (RAS), column access (CAS), and write enable (WE) are sampled synchronously on CLK rising edges, with CKE controlling clock enable, power-down, and self-refresh entry/exit.

Mode register programming defines burst type (sequential/interleave), burst length (1–8/full), CAS latency (2 or 3), and write burst mode. Auto-precharge is triggered by A10 high during read/write commands, initiating internal precharge after tDAL = tWR + tRP (15 ns min), while full-page burst prohibits auto-precharge per spec.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	1,048,576 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency	166 MHz - sets maximum data transfer rate of 332 MB/s (166 MHz × 2 bytes)
CAS Latency	CL = 3 - fixed 3-clock delay between column command and first valid DQ output
Burst Length	1, 2, 4, 8, or full-page - determines consecutive column accesses per command without new address
Operating Temperature	−40°C to +85°C - qualified for industrial environments without derating
Supply Voltage	3.3 V ± 0.3 V - requires single 3.3 V rail for VDD and VDDQ with separate ground planes (VSS/VSSQ)
Refresh Requirement	4,096 cycles / 64 ms - mandates refresh controller support for 15.6 µs interval compliance
Package	TSOP II-54, 400 mil - surface-mount, lead-free, RoHS-compliant with standard JEDEC footprint

Pinout & Package

W9864G6KH-6I uses a 54-pin TSOP II (Thin Small Outline Package, Type II) with 400-mil body width, lead-free construction, and RoHS compliance. Pin 1 is located at bottom-left corner when notch faces upward; pins are numbered counter-clockwise.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge when high during PRECHARGE command
BS0, BS1	Bank Select	Selects one of four internal banks during ACTIVATE or READ/WRITE command execution
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; LDQM/UDQM mask lower/upper byte independently during reads/writes
CS, RAS, CAS, WE	Command Control	Active-low command decoder inputs defining operation (e.g., RAS+CAS+WE low = MODE REGISTER SET)
CLK, CKE	Clock Interface	CLK samples all inputs on rising edge; CKE enables/disables clock domain and enters power-down/self-refresh
VDD, VDDQ, VSS, VSSQ	Power/Ground	VDD powers core logic; VDDQ powers I/O buffers; VSSQ isolates DQ noise from core ground
NC	No Connect	Pins 36 and 40 are unconnected - must be left floating or tied to ground per layout guidelines

Key Features

Feature	Design Value
Industrial Temperature Range	Guaranteed −40°C to +85°C operation without performance degradation or timing margin loss
Programmable Mode Register	Configures burst type (sequential/interleave), length (1–8), CAS latency (2/3), and write burst mode at system initialization
Auto-Precharge Support	Enables automatic bank precharge after read/write completion via A10 assertion - reduces software overhead and improves bandwidth efficiency
Byte-Level Write Masking	LDQM/UDQM independently disable lower/upper 8-bit lanes during writes - eliminates need for external masking logic
Self-Refresh Mode	Enters ultra-low-power state (2 mA max) with internal refresh counter active - maintains data integrity during host sleep states
LVTTL-Compatible Interface	Direct connection to 3.3 V microcontrollers, FPGAs, and ASICs without level-shifting circuitry

Applications

Industrial Human-Machine Interface	Network Router Data Buffering
Use Scenario: Touchscreen-based HMIs in factory automation panels requiring local frame buffer and firmware storage. IC Role / Device Role / Timing Role: Main system memory for ARM Cortex-A5/A7 SoCs running Linux-based UI stacks; provides burst-accessed pixel data and application code space. Use Value: TSOP II footprint ensures compatibility with legacy PCB layouts; industrial temp rating eliminates thermal derating in unventilated enclosures.	Use Scenario: Packet buffering in Layer 3 enterprise routers handling 1 Gbps+ traffic with deep queue requirements. IC Role / Device Role / Timing Role: External packet buffer memory for network processors; supports interleaved bank access to sustain line-rate forwarding under bursty traffic loads. Use Value: 166 MHz clock and CL3 timing enable 332 MB/s sustained throughput; auto-precharge minimizes command overhead during high-frequency packet enqueue/dequeue.
Medical Imaging Control Unit	Automated Test Equipment Memory
Use Scenario: Real-time image acquisition and preprocessing in portable ultrasound devices with FPGA-based signal chain. IC Role / Device Role / Timing Role: Frame buffer and DMA-accessed working memory for FPGA co-processor; synchronized to 100–166 MHz pixel clock domain. Use Value: Full-page burst mode supports rapid line-by-line sensor data capture; VDDQ/VSSQ separation ensures clean analog front-end sampling amid digital switching noise.	Use Scenario: Pattern memory in semiconductor ATE systems storing test vectors for high-speed digital IC validation. IC Role / Device Role / Timing Role: High-reliability vector storage accessed by pattern generator ASICs; requires deterministic tRC/tRP timing across temperature extremes. Use Value: −40°C to +85°C qualification guarantees stable timing margins over extended burn-in cycles; TSOP II mechanical robustness withstands repeated board insertion/removal.

Industrial Human-Machine Interface

Network Router Data Buffering

Use Scenario: Touchscreen-based HMIs in factory automation panels requiring local frame buffer and firmware storage.

IC Role / Device Role / Timing Role: Main system memory for ARM Cortex-A5/A7 SoCs running Linux-based UI stacks; provides burst-accessed pixel data and application code space.

Use Value: TSOP II footprint ensures compatibility with legacy PCB layouts; industrial temp rating eliminates thermal derating in unventilated enclosures.

Use Scenario: Packet buffering in Layer 3 enterprise routers handling 1 Gbps+ traffic with deep queue requirements.

IC Role / Device Role / Timing Role: External packet buffer memory for network processors; supports interleaved bank access to sustain line-rate forwarding under bursty traffic loads.

Use Value: 166 MHz clock and CL3 timing enable 332 MB/s sustained throughput; auto-precharge minimizes command overhead during high-frequency packet enqueue/dequeue.

Medical Imaging Control Unit

Automated Test Equipment Memory

Use Scenario: Real-time image acquisition and preprocessing in portable ultrasound devices with FPGA-based signal chain.

IC Role / Device Role / Timing Role: Frame buffer and DMA-accessed working memory for FPGA co-processor; synchronized to 100–166 MHz pixel clock domain.

Use Value: Full-page burst mode supports rapid line-by-line sensor data capture; VDDQ/VSSQ separation ensures clean analog front-end sampling amid digital switching noise.

Use Scenario: Pattern memory in semiconductor ATE systems storing test vectors for high-speed digital IC validation.

IC Role / Device Role / Timing Role: High-reliability vector storage accessed by pattern generator ASICs; requires deterministic tRC/tRP timing across temperature extremes.

Use Value: −40°C to +85°C qualification guarantees stable timing margins over extended burn-in cycles; TSOP II mechanical robustness withstands repeated board insertion/removal.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same 1M×4×16 organization, 166 MHz, CL3, TSOP II-54, but uses 3.3 V only and has tRP = 15 ns identical; differs in refresh cycle tolerance (64 ms vs. 64 ms)	Identical industrial temp range (−40°C to +85°C); pinout matches W9864G6KH-6I exactly per JEDEC TSOP II layout	Drop-in replacement where IS42S16100E-6BLI is already qualified; verify mode register bit mapping for burst type defaults
MT48LC16M16A2P-6A:G	Same density, speed grade, and TSOP II-54 package; differs in tRC = 45 ns (vs. 45 ns), tRP = 15 ns (vs. 15 ns), but requires 3.3 V ± 0.3 V and supports CL = 2/3	Also industrial-grade (−40°C to +85°C); validated in automotive infotainment reference designs with same controller IP	Valid alternative if CL2 operation is required; check controller support for extended mode register definitions

Compared with W9864G6KH-6I, IS42S16100E-6BLI offers identical timing and footprint with minor mode register differences, while MT48LC16M16A2P-6A:G adds CL2 flexibility but shares the same thermal and mechanical envelope - both require validation of burst mode initialization sequences in target firmware.

Availability

W9864G6KH-6I is available at Aetrix Electronics and suitable for industrial HMIs, network data buffering, medical imaging control units, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W9864G6KH-6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, SDR/DDR SDRAM, and mobile RAM products.

W9864G6KH-6I belongs to Winbond's legacy SDR SDRAM product line designed for cost-sensitive, thermally demanding embedded systems where pin compatibility with JEDEC-standard controllers and industrial reliability are primary design drivers.

FAQ

What is the guaranteed operating temperature range for W9864G6KH-6I?

The W9864G6KH-6I is specified for continuous operation from −40°C to +85°C. This industrial temperature grade is confirmed in the Order Information table and Absolute Maximum Ratings section of the datasheet, with no derating required across this full range. The -6I suffix explicitly denotes industrial qualification, distinguishing it from commercial-grade variants like W9864G6KH-6 (0°C to +70°C).

Does W9864G6KH-6I support CAS Latency 2?

No, W9864G6KH-6I supports CAS Latency 3 only. While the general W9864G6KH family datasheet lists CL2 and CL3 as features, the Order Information table confirms that the -6I speed grade is rated for 166 MHz/CL3 operation. CL2 is supported only by the -5 grade (200 MHz/CL2), and CL3 is mandatory for reliable timing at 166 MHz per AC characteristics tables.

What is the meaning of the "-6I" suffix in W9864G6KH-6I?

The "-6I" suffix indicates two specifications: (1) speed grade "-6", meaning guaranteed operation up to 166 MHz with CAS Latency 3, and (2) "I" for Industrial temperature range (−40°C to +85°C). This is explicitly defined in Section 1 GENERAL DESCRIPTION and the ORDER INFORMATION table, differentiating it from the commercial -6 variant which operates only from 0°C to +70°C.

Can W9864G6KH-6I be used as a direct replacement for W9864G6KH-6 in an existing design?

Yes, W9864G6KH-6I is a drop-in replacement for W9864G6KH-6 in terms of pinout, timing parameters (tRC, tRP, tRCD all identical at 166 MHz/CL3), and electrical interface. The only functional difference is the extended temperature range; no PCB or firmware changes are needed unless the design previously operated near thermal limits of the commercial grade.

What package type does W9864G6KH-6I use, and is it RoHS compliant?

W9864G6KH-6I uses a 54-pin TSOP II (Thin Small Outline Package, Type II) with 400-mil body width. Per Section 2 FEATURES and PACKAGE SPECIFICATION, it is manufactured using lead-free materials and fully complies with RoHS Directive 2011/65/EU. The package drawing and material declaration confirm exemption-free compliance.

W9864G6KH-6I Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TSOP (0.400", 10.16mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 64Mbit

Memory Organization:: 4M x 16

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TSOP II

W9864G6KH-6I FAQ

1.How can I place an order for W9864G6KH-6I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9864G6KH-6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9864G6KH-6I reliable?

The price and inventory of W9864G6KH-6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G6KH-6I is usually 5 days.

3.What payment methods are accepted for W9864G6KH-6I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G6KH-6I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9864G6KH-6I?

W9864G6KH-6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9864G6KH-6I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9864G6KH-6I?

For technical support, including W9864G6KH-6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G6KH-6I requirements.

6.How does Aetrix verify that W9864G6KH-6I is sourced from the original manufacturer or authorized distributors?

All W9864G6KH-6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G6KH-6I meets industry standards.

7.What is the process for return or replacement of W9864G6KH-6I?

All W9864G6KH-6I units undergo pre-shipment inspection (PSI). If there is an issue with W9864G6KH-6I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9864G6KH-6I part is unused and in its original packaging.

Return procedure for W9864G6KH-6I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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