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Winbond Electronics Corporation W9864G6KH-6 TR
- Part No.:
- W9864G6KH-6 TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9864G6KH-6 TR.pdf
- Description:
- IC DRAM 64MBIT PAR 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,879
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Product details
Overview
W9864G6KH-6 TR from Winbond is a 1M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V ±0.3V supply, and TSOP II-54 package. It delivers 332 MB/s peak bandwidth and supports burst lengths of 1, 2, 4, 8, or full page in sequential or interleave mode for embedded main memory applications.
For engineers reviewing the W9864G6KH-6 TR datasheet, W9864G6KH-6 TR pinout, W9864G6KH-6 TR application, or W9864G6KH-6 TR equivalent, key selection criteria include tRCD = 20 ns, tRP = 20 ns, self-refresh current ≤2 mA, LVTTL interface compatibility, and industrial-grade timing stability across 0°C to 70°C operation.
Technical Context
This SDRAM implements four independent 1M-word banks with programmable mode register control for burst length, CAS latency, and burst type. Its internal architecture uses multiplexed row/column addressing with A0–A11, bank-select inputs BS0/BS1, and dual DQM masking for byte-level write control.
Functional operation relies on precise command decoding via RAS/CAS/WE/CS on CLK rising edges, supporting auto-precharge, self-refresh, power-down, and clock-suspend modes. Timing compliance requires tRC ≥ 50 ns, tRAS ≥ 42 ns, and tREFI = 64 ms for 4K refresh cycles - all guaranteed at 166 MHz/CL3 under 3.3V supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 4 banks × 16 bits = 128 Mbit total capacity |
| Clock Frequency | 166 MHz maximum - defines 6 ns clock period for timing margin validation |
| CAS Latency | CL = 3 - fixes 3-cycle delay between read command and first valid data output |
| Burst Length | Programmable 1/2/4/8/full page - determines consecutive column accesses per command |
| Supply Voltage | 3.3V ±0.3V - constrains external regulator design and noise budget for VDD/VDDQ rails |
| Refresh Requirement | 4,096 cycles / 64 ms - mandates refresh controller interval ≤15.625 µs per row |
| Operating Temperature | 0°C to 70°C - validates thermal derating for commercial-grade PCB layouts |
Pinout & Package
Package: TSOP II-54, 400 mil, RoHS-compliant lead-free construction with separate VDDQ/VSSQ rails for I/O noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A10 controls all-bank precharge when high |
| BS0, BS1 | Bank Select | Selects one of four internal banks during ACTIVATE or READ/WRITE commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; LDQM/UDQM mask lower/upper byte writes |
| CLK, CKE | Timing Control | CLK synchronizes all commands; CKE gates internal clock for power-down/self-refresh entry |
| CS, RAS, CAS, WE | Command Decode | Combination defines operation (e.g., ACTIVATE = CS/L, RAS/L, CAS/H, WE/H) |
| LDQM, UDQM | Data Mask | Tri-states DQ outputs during reads or blocks write data per byte lane with zero latency |
Key Features
| Feature | Design Value |
|---|---|
| Interleaved Bank Access | Enables continuous data streaming by overlapping activate/precharge across 4 banks, hiding tRP/tRC penalties |
| Auto-Precharge Support | Automatically initiates bank precharge after read/write burst completion when A10=H, reducing manual command overhead |
| LVTTL-Compatible Interface | Direct connection to 3.3V microcontrollers/FPGAs without level-shifting circuitry |
| Self-Refresh Mode | Maintains data integrity with ≤2 mA current draw while external clocks are halted - critical for low-power suspend states |
| Programmable Burst Type | Configurable sequential or interleave addressing via mode register - optimizes cache line access patterns |
Applications
| Industrial HMI Display Controller | Network Router Packet Buffer |
|---|---|
Use Scenario: Real-time rendering of GUI layers and video overlays in factory-floor HMIs with ARM-based SoCs. IC Role / Device Role / Timing Role: Primary frame buffer memory interfaced to display controller's SDRAM port with CL3 timing. Use Value: 166 MHz bandwidth sustains 1024×768@60Hz RGB output with alpha blending; TSOP II footprint enables compact 4-layer PCB layout. | Use Scenario: Temporary storage of ingress/egress Ethernet packets in multi-port edge routers before forwarding decisions. IC Role / Device Role / Timing Role: Shared packet buffer accessed concurrently by multiple MAC controllers via bank interleaving. Use Value: Four independent banks allow simultaneous read (from one port) and write (to another) with tRRD = 15 ns bank-to-bank switching. |
| Digital Copier Image Processing Engine | Medical Ultrasound Beamformer Memory |
Use Scenario: Line-by-line buffering of scanned document images prior to JPEG compression and network transmission. IC Role / Device Role / Timing Role: High-throughput scan-line memory with burst-length-8 sequential reads aligned to 128-bit bus width. Use Value: Full-page burst capability eliminates address setup overhead per scan line; tRCD = 20 ns ensures deterministic latency for real-time DMA transfers. | Use Scenario: Storage of time-aligned echo samples during real-time B-mode image acquisition in portable ultrasound systems. IC Role / Device Role / Timing Role: Low-latency acquisition buffer synchronized to ADC sampling clock via SDRAM CLK input. Use Value: Self-refresh current ≤2 mA extends battery life during standby; CL3 timing guarantees sub-20 ns read response for beam steering calculations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS42S16100E-6BLI | Same 1M×4×16 organization, 166 MHz/CL3, but 54-pin TSOP II with identical pinout and timing | Qualified for extended temperature (-40°C to 85°C); higher tRC = 55 ns vs. 50 ns | Drop-in replacement where industrial temp range or marginally relaxed timing is acceptable |
| MT48LC16M16A2P-6A:G | 16M×16 configuration (256 Mbit), 166 MHz/CL3, 66-pin TSOP II - not pin-compatible | Higher density for systems requiring >128 Mbit; different address mapping (A0–A12) | Select only when board redesign accommodates extra pins and revised address routing |
Compared with W9864G6KH-6 TR, IS42S16100E-6BLI offers identical pinout and timing with extended temperature support, while MT48LC16M16A2P-6A:G provides greater density at the cost of non-interchangeable packaging and layout changes.
Availability
W9864G6KH-6 TR is available at Aetrix Electronics and suitable for industrial HMI displays, network packet buffering, digital copier image processing, medical ultrasound beamforming, and embedded vision systems requiring stable component supply across commercial temperature ranges.
Supply support for W9864G6KH-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, DDR SDRAM, and mobile RAM products.
The W9864G6KH series belongs to Winbond's legacy SDR SDRAM product line, designed specifically for cost-sensitive, high-reliability embedded systems requiring standardized LVTTL timing and industrial-grade thermal performance.
FAQ
What is the maximum clock frequency supported by the W9864G6KH-6 TR?
The W9864G6KH-6 TR is rated for a maximum clock frequency of 166 MHz with CAS Latency 3. This speed grade is validated under 3.3V ±0.3V supply and 0°C to 70°C ambient conditions, with timing parameters including tRCD = 20 ns and tRP = 20 ns. Operation beyond this frequency violates AC specifications and may result in data corruption or command misinterpretation.
Does the W9864G6KH-6 TR support both sequential and interleaved burst modes?
Yes, the W9864G6KH-6 TR supports both sequential and interleaved burst addressing modes, configured via the Mode Register Set command. Sequential mode increments column addresses linearly (e.g., n, n+1, n+2), while interleave mode toggles address bits starting from A0. The W9864G6KH-6 TR implements this using internal address counters that respond to burst-length settings of 1, 2, 4, 8, or full page.
How does the auto-precharge function operate in the W9864G6KH-6 TR?
In the W9864G6KH-6 TR, auto-precharge is triggered when A10 is driven high during a READ or WRITE command. For reads, precharge begins before burst completion based on CAS Latency; for writes, it starts two cycles after final data input (tWR). The W9864G6KH-6 TR then enforces tDAL = tWR + tRP before reactivation, preventing premature bank access and ensuring data retention integrity.
What is the purpose of LDQM and UDQM pins on the W9864G6KH-6 TR?
LDQM (Lower Data Queue Mask) and UDQM (Upper Data Queue Mask) on the W9864G6KH-6 TR provide byte-level write masking for the 16-bit DQ bus. When sampled high during a write cycle, LDQM blocks DQ0–DQ7 writes with zero latency; UDQM blocks DQ8–DQ15. During reads, they place corresponding DQ lanes in high-impedance state after CAS Latency + 2 cycles, enabling clean bus sharing in multi-device systems.
Can the W9864G6KH-6 TR be used in systems requiring extended temperature operation?
No, the W9864G6KH-6 TR is specified for 0°C to 70°C operation only. For extended temperature support, Winbond offers the W9864G6KH-6I variant, which is tested and guaranteed across -40°C to 85°C with identical 166 MHz/CL3 timing and 2 mA self-refresh current. Substituting W9864G6KH-6 TR in industrial environments outside its rated range risks timing violations and data retention failure.
W9864G6KH-6 TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
W9864G6KH-6 TR FAQ
1.How can I place an order for W9864G6KH-6 TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9864G6KH-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9864G6KH-6 TR reliable?
The price and inventory of W9864G6KH-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G6KH-6 TR is usually 5 days.
3.What payment methods are accepted for W9864G6KH-6 TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G6KH-6 TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9864G6KH-6 TR?
W9864G6KH-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9864G6KH-6 TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9864G6KH-6 TR?
For technical support, including W9864G6KH-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G6KH-6 TR requirements.
6.How does Aetrix verify that W9864G6KH-6 TR is sourced from the original manufacturer or authorized distributors?
All W9864G6KH-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G6KH-6 TR meets industry standards.
7.What is the process for return or replacement of W9864G6KH-6 TR?
All W9864G6KH-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9864G6KH-6 TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9864G6KH-6 TR part is unused and in its original packaging.
Return procedure for W9864G6KH-6 TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9864G6KH-6 TR Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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