Winbond Electronics Corporation W9864G6KT-6

Overview

W9864G6KT-6 from Winbond is a 16-bit wide, 4-bank synchronous DRAM organized as 1 M × 4 banks × 16 bits (16 Mbit total), operating at up to 166 MHz with CAS Latency 3, supporting sequential/interleaved burst modes and auto-precharge - used as main memory in embedded controllers, industrial HMIs, and legacy SoC-based systems requiring LVTTL-compatible SDRAM.

For engineers reviewing the W9864G6KT-6 datasheet, W9864G6KT-6 pinout, W9864G6KT-6 application, or W9864G6KT-6 equivalent, key selection criteria include its -6 speed grade (166 MHz/CL3), 0°C to 70°C industrial temperature range, TFBGA-54 (8×8 mm) package, and support for burst lengths of 1/2/4/8/full-page with programmable mode register configuration.

Technical Context

This SDRAM implements fully synchronous operation latched on the rising edge of CLK, with independent bank activation enabling interleaved access across four internal banks to hide precharge latency. It uses multiplexed address pins (A0–A11) and dual bank-select inputs (BS0/BS1) to manage row/column addressing and bank selection within a single clock cycle.

The device supports self-refresh (at ≤85°C), power-down mode (CKE-controlled), and clock suspend mode - all governed by standardized command encoding via RAS/CAS/WE/CS. Its LVTTL interface requires separate VDDQ/VSSQ supplies for I/O noise immunity, and refresh is managed via 4K cycles per 64 ms at case temperatures ≤85°C.

Key Specifications

Pinout & Package

W9864G6KT-6 is housed in a 54-ball thin fine-pitch ball grid array (TFBGA) package measuring 8 mm × 8 mm with 0.8 mm ball pitch. The package uses lead-free, RoHS-compliant materials and separates core logic (VDD/VSS) from I/O circuitry (VDDQ/VSSQ) to minimize switching noise on data lines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Compared with IS42S16160J-6BLI and MT48LC16M16A2P-6A, the W9864G6KT-6 offers guaranteed 0°C–70°C operation with self-refresh enabled across its full range, while maintaining identical pinout and command-set compatibility - making it optimal for cost-constrained, thermally stable embedded systems where second-source flexibility is secondary to qualification continuity.

Availability

W9864G6KT-6 is available at Aetrix Electronics and suitable for industrial HMI systems, legacy SoC-based gateways, and embedded video capture modules requiring stable component supply, long-lifecycle support, and RoHS-compliant manufacturing.

Supply support for W9864G6KT-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, PSRAM, and SDR/DDR SDRAM for embedded and industrial markets.

The W9864G6KT series belongs to Winbond's legacy SDR SDRAM product line, designed specifically for cost-sensitive, non-graphics embedded applications requiring reliable, pin-compatible memory with simplified controller integration and broad temperature support.

FAQ

What is the maximum operating frequency and CAS latency supported by W9864G6KT-6?

The W9864G6KT-6 is rated for a maximum clock frequency of 166 MHz with CAS Latency 3 (CL3) at 0°C to 70°C. This timing is guaranteed across the full operating temperature range and voltage (3.0–3.6 V). The device does not support CL2 operation in the -6 speed grade - CL2 is only specified for the -6I and -6J variants per the official datasheet revision A02.

Does W9864G6KT-6 support self-refresh mode, and under what conditions?

Yes, W9864G6KT-6 supports self-refresh mode, but only when the case temperature (TCASE) remains at or below 85°C. Since the -6 grade is rated for 0°C to 70°C operation, self-refresh is fully guaranteed across its entire specified temperature range. The device enters self-refresh upon issuing the dedicated command (CS/RAS/CAS/WE = L/L/L/H with CKE = L) and exits when CKE returns high after tXSR delay.

What package type and ball count does W9864G6KT-6 use?

W9864G6KT-6 uses a 54-ball thin fine-pitch ball grid array (TFBGA) package with dimensions of 8 mm × 8 mm and 0.8 mm ball pitch. It is lead-free and RoHS compliant. Ball assignments follow JEDEC-standard SDRAM pinout conventions, including dedicated VDDQ/VSSQ rails for I/O noise isolation and dual DQM signals for byte-level write masking.

Can W9864G6KT-6 be used as a direct replacement for IS42S16160J-6BLI?

W9864G6KT-6 is pin-compatible and electrically equivalent to IS42S16160J-6BLI in terms of ball assignment, DC/AC timing, and command set - both are 16Mbit, 16-bit, 4-bank SDR SDRAMs rated for 166 MHz/CL3. However, the IS42S16160J-6BLI extends temperature support to -40°C to 85°C and guarantees self-refresh at 85°C, whereas W9864G6KT-6 is qualified only to 70°C.

What is the refresh requirement for W9864G6KT-6 at its maximum operating temperature?

At its maximum rated case temperature of 70°C, W9864G6KT-6 requires 4,096 refresh cycles every 64 ms - equivalent to one refresh command every 15.625 µs per row. This is implemented via external controller or internal refresh counter; the device does not support hidden refresh. The refresh interval tightens to 16 ms (4K/16ms) only for the -6J variant at 105°C - not applicable to W9864G6KT-6.