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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9864G6KT-6 TR

Name: W9864G6KT-6 TR
Brand: Winbond Electronics Corporation
SKU: W9864G6KT-6 TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9864G6KT-6 TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 54-TFBGA

Datasheet:: W9864G6KT-6 TR.pdf

Description:: IC DRAM 64MBIT LVTTL 54TFBGA

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Product details

Overview

W9864G6KT-6 TR from Winbond is a 1M × 4 banks × 16-bit synchronous DRAM (SDRAM) operating at 166 MHz with CAS Latency 3, 3.3V LVTTL interface, and TFBGA-54 (8×8 mm²) package. It delivers up to 166M words/s bandwidth and supports burst lengths of 1, 2, 4, 8, or full page for high-throughput memory buffering in embedded controllers and industrial HMIs.

For engineers reviewing the W9864G6KT-6 TR datasheet, W9864G6KT-6 TR pinout, W9864G6KT-6 TR application, or W9864G6KT-6 TR equivalent, key selection criteria include its -6 speed grade (166 MHz/CL3), industrial temperature tolerance (0°C to 70°C), self-refresh capability (2 mA max), and compatibility with standard SDRAM controllers requiring LVTTL signaling and 54-ball TFBGA layout.

Technical Context

This SDRAM implements four independent 1M-word banks with interleaved access support to hide precharge latency. Its command decoder interprets RAS/CAS/WE/CS on CLK rising edges to execute bank activate, read/write, auto-precharge, self-refresh, and power-down operations - all synchronized to a single-ended 3.3V LVTTL clock input.

Internal timing is governed by programmable Mode Register settings for burst type (sequential/interleave), length, and CAS latency. Refresh is managed via 4K cycles per 64 ms (at ≤85°C case temperature), with dedicated CKE-controlled entry/exit into self-refresh and power-down modes to reduce active current to 2 mA.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	1,048,576 words × 4 banks × 16 bits = 128 Mbit total capacity
Max Clock Frequency	166 MHz - defines maximum sustained data transfer rate of 166M words/s
CAS Latency	CL = 3 - fixed 3-clock delay between column address strobe and first valid read data
Burst Length	1, 2, 4, 8, or full page - determines contiguous data words fetched per read/write command
Supply Voltage	3.3 V ± 0.3 V - requires stable LVTTL-compatible power rail; VDD and VDDQ are separate
Refresh Requirement	4K cycles / 64 ms @ TCASE ≤ 85°C - mandates periodic refresh controller intervention to retain data
Operating Temperature	0°C to 70°C - validated performance range for commercial-grade operation without derating
Package	TFBGA-54 (8×8 mm², 0.8 mm pitch) - surface-mount footprint compatible with automated PCB assembly

Pinout & Package

W9864G6KT-6 TR uses a 54-ball thin fine-pitch ball grid array (TFBGA) package with 8×8 mm² body size, RoHS-compliant lead-free finish, and 0.8 mm ball pitch. Power and ground pins are distributed across corners and edges to minimize noise coupling; VDDQ/VSSQ are isolated for I/O signal integrity.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A10 controls all-bank precharge when high during command
BS0, BS1	Bank Select	2-bit encoding selects one of four internal banks for activation or access
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; LDQM/UDQM mask lower/upper byte during writes or tri-state reads
/CS, /RAS, /CAS, /WE	Command Control	Active-low control signals decoded on CLK rising edge to initiate bank activate, read, write, precharge, etc.
CLK, CKE	Clock Interface	CLK synchronizes all inputs; CKE enables/disables clock domain - low enters power-down or self-refresh
LDQM, UDQM	Data Mask	Input/output masks for lower (DQ0–DQ7) and upper (DQ8–DQ15) bytes; high blocks write or forces Hi-Z on read

Key Features

Feature	Design Value
Interleaved Bank Access	Enables continuous data flow across four banks by overlapping activate/precharge/read cycles - hides tRP/tRC delays
Programmable Burst Mode	Supports sequential or interleave addressing for burst lengths 1–8 or full page - optimizes cache-line fetch efficiency
Auto-Precharge	Automatically initiates bank precharge after read/write completion when A10 is asserted - reduces software overhead
Low-Power Self-Refresh	Retains data with only 2 mA supply current while disabling external clocks - essential for battery-backed standby
LVTTL-Compatible I/O	3.3V signaling with separate VDDQ/VSSQ rails - ensures noise-immune DQ timing in mixed-signal PCB environments

Applications

Industrial HMI Memory Buffer	Embedded Controller Main Memory
Use Scenario: Touchscreen-based human-machine interface running real-time graphics rendering and event logging. IC Role / Device Role / Timing Role: Primary working memory for frame buffer, GUI assets, and runtime variables - accessed via burst reads/writes synchronized to display controller clock. Use Value: 166 MHz bandwidth and 4-bank interleaving sustain >120 fps UI updates without CPU stalling; CL3 latency ensures deterministic response to touch interrupts.	Use Scenario: Programmable logic controller (PLC) executing cyclic scan routines with local data tables and I/O image storage. IC Role / Device Role / Timing Role: Volatile program/data memory mapped directly to ARM Cortex-M7 bus - configured as 16-bit wide SDRAM interface with auto-refresh management. Use Value: 128 Mbit density provides ample space for firmware overlays and historical diagnostics; TFBGA-54 footprint enables compact, high-density industrial PCB layout.
Network Edge Router Packet Buffer	Medical Imaging Data Cache
Use Scenario: Low-power edge gateway aggregating sensor telemetry and forwarding packets over Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Temporary packet staging buffer between MAC layer and TCP/IP stack - managed via DMA with burst-length-4 writes and reads. Use Value: Full-page burst capability handles jumbo frames efficiently; power-down mode cuts idle current to extend battery life in portable deployments.	Use Scenario: Portable ultrasound device capturing real-time B-mode scan lines and storing raw RF data before DSP processing. IC Role / Device Role / Timing Role: High-speed acquisition memory interfaced to ADC controller - accepts back-to-back 16-bit samples at ≥20 MSPS using interleaved bank reads. Use Value: 4K/64 ms refresh rate guarantees data retention during brief power interruptions; industrial temp rating supports operation in clinical environments.

Industrial HMI Memory Buffer

Embedded Controller Main Memory

Use Scenario: Touchscreen-based human-machine interface running real-time graphics rendering and event logging.

IC Role / Device Role / Timing Role: Primary working memory for frame buffer, GUI assets, and runtime variables - accessed via burst reads/writes synchronized to display controller clock.

Use Value: 166 MHz bandwidth and 4-bank interleaving sustain >120 fps UI updates without CPU stalling; CL3 latency ensures deterministic response to touch interrupts.

Use Scenario: Programmable logic controller (PLC) executing cyclic scan routines with local data tables and I/O image storage.

IC Role / Device Role / Timing Role: Volatile program/data memory mapped directly to ARM Cortex-M7 bus - configured as 16-bit wide SDRAM interface with auto-refresh management.

Use Value: 128 Mbit density provides ample space for firmware overlays and historical diagnostics; TFBGA-54 footprint enables compact, high-density industrial PCB layout.

Network Edge Router Packet Buffer

Medical Imaging Data Cache

Use Scenario: Low-power edge gateway aggregating sensor telemetry and forwarding packets over Ethernet/Wi-Fi.

IC Role / Device Role / Timing Role: Temporary packet staging buffer between MAC layer and TCP/IP stack - managed via DMA with burst-length-4 writes and reads.

Use Value: Full-page burst capability handles jumbo frames efficiently; power-down mode cuts idle current to extend battery life in portable deployments.

Use Scenario: Portable ultrasound device capturing real-time B-mode scan lines and storing raw RF data before DSP processing.

IC Role / Device Role / Timing Role: High-speed acquisition memory interfaced to ADC controller - accepts back-to-back 16-bit samples at ≥20 MSPS using interleaved bank reads.

Use Value: 4K/64 ms refresh rate guarantees data retention during brief power interruptions; industrial temp rating supports operation in clinical environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS42S16100E-6BLI	Same 1M×4×16 organization, 166 MHz/CL3, but 54-ball TFBGA with different ball map (Micron pinout)	Requires PCB layout revision due to non-identical pin assignment - especially DQ, BS, and control signal locations	Select if sourcing flexibility is prioritized over drop-in replacement; verify timing margins under same VDD/VDDQ conditions.
MT48LC16M16A2P-6A	16M×16 organization (256 Mbit), higher density, same 166 MHz/CL3 spec, but 54-ball TSOP-II package	Not pin-compatible; TSOP-II requires larger board area and lacks TFBGA thermal/mechanical advantages	Choose for legacy designs already using TSOP-II footprints or where higher memory capacity justifies re-layout.

Compared with IS42S16100E-6BLI and MT48LC16M16A2P-6A, W9864G6KT-6 TR offers identical speed-grade performance in a compact TFBGA package optimized for space-constrained industrial PCBs, while requiring no voltage translation or interface adaptation for standard SDRAM controllers.

Availability

W9864G6KT-6 TR is available at Aetrix Electronics and suitable for industrial HMI, embedded controller, and medical imaging applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for W9864G6KT-6 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory, flash, and logic ICs, with global distribution and industrial-grade reliability certification.

W9864G6KT-6 TR belongs to Winbond's standard SDRAM product line designed for cost-sensitive, high-volume embedded systems requiring proven 3.3V SDRAM interoperability and extended temperature operation.

FAQ

What is the maximum operating frequency and CAS latency supported by W9864G6KT-6 TR?

W9864G6KT-6 TR is rated for 166 MHz operation with CAS Latency 3 (CL3) at 3.3 V and 0°C to 70°C case temperature. This timing is guaranteed per the -6 speed grade specification and must be maintained in system-level timing budgeting - including setup/hold margins for /RAS, /CAS, and /WE relative to CLK.

Does W9864G6KT-6 TR support self-refresh mode, and what is the typical current draw?

Yes, W9864G6KT-6 TR supports self-refresh mode with a maximum current draw of 2 mA at 0°C to 70°C ambient. Self-refresh is entered via the dedicated command (CS/RAS/CAS/WE = L/L/L/H with CKE = L) and retains data without external clock or controller intervention - critical for low-power standby states.

What package type and ball count does W9864G6KT-6 TR use?

W9864G6KT-6 TR uses a 54-ball thin fine-pitch ball grid array (TFBGA) package measuring 8 mm × 8 mm with 0.8 mm ball pitch. It is lead-free and RoHS compliant, and its pinout follows Winbond's standard SDRAM mapping - confirmed in the official datasheet section 4 (Ball Configuration) and section 5 (Ball Description).

How many banks and what memory organization does W9864G6KT-6 TR implement?

W9864G6KT-6 TR implements four independently addressable banks organized as 1,048,576 words × 4 banks × 16 bits, totaling 128 Mbit (16 MB) of memory. Each bank contains 256 rows × 4096 columns × 16 bits, enabling efficient interleaved access to hide precharge and activate delays in high-bandwidth applications.

Can W9864G6KT-6 TR be used in systems requiring extended temperature operation beyond 70°C?

No - W9864G6KT-6 TR is specified only for 0°C to 70°C case temperature. For extended temperature support, Winbond offers the W9864G6KT-6I (-40°C to 85°C) and W9864G6KT-6J (-40°C to 105°C) variants, which differ in screening, self-refresh current (5 mA for -6J), and refresh interval (4K/16 ms above 85°C). W9864G6KT-6 TR must not be operated outside its rated range.

W9864G6KT-6 TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 54-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM

Memory Size:: 64Mbit

Memory Organization:: 4M x 16

Memory Interface:: LVTTL

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-TFBGA (8x8)

W9864G6KT-6 TR FAQ

1.How can I place an order for W9864G6KT-6 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9864G6KT-6 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9864G6KT-6 TR reliable?

The price and inventory of W9864G6KT-6 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9864G6KT-6 TR is usually 5 days.

3.What payment methods are accepted for W9864G6KT-6 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9864G6KT-6 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9864G6KT-6 TR?

W9864G6KT-6 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9864G6KT-6 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9864G6KT-6 TR?

For technical support, including W9864G6KT-6 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9864G6KT-6 TR requirements.

6.How does Aetrix verify that W9864G6KT-6 TR is sourced from the original manufacturer or authorized distributors?

All W9864G6KT-6 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9864G6KT-6 TR meets industry standards.

7.What is the process for return or replacement of W9864G6KT-6 TR?

All W9864G6KT-6 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9864G6KT-6 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9864G6KT-6 TR part is unused and in its original packaging.

Return procedure for W9864G6KT-6 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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