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Winbond Electronics Corporation W987D6HBGX6I TR
- Part No.:
- W987D6HBGX6I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TFBGA
- Datasheet:
-
W987D6HBGX6I TR.pdf
- Description:
- IC DRAM 128MBIT PAR 54VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,756
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Product details
Overview
W987D6HBGX6I TR from Winbond is a 128Mb mobile low-power SDRAM (LPSDR) in x16 configuration, operating at 1.8V with 166MHz clock rate (CL=3), supporting partial array self-refresh (PASR) and automatic temperature-compensated self-refresh (ATCSR) for battery-powered handheld devices including 3G phones and digital still cameras.
For engineers reviewing the W987D6HBGX6I TR datasheet, W987D6HBGX6I TR pinout, W987D6HBGX6I TR application, or W987D6HBGX6I TR equivalent, key selection criteria include its 54-ball VFBGA package, LVCMOS interface compliance, deep power-down mode (10μA), CAS latency options (2/3), and 4K/64ms refresh timing - all critical for portable memory subsystem design.
Technical Context
This LPSDR implements synchronous burst-mode operation with fully pipelined command decoding, supporting interleaved bank access, auto-precharge, and programmable burst lengths (1, 2, 4, 8, full page). Its internal architecture includes four independent banks, row/column multiplexed addressing (A0–A11 for rows, A0–A8 for columns in x16), and dedicated BA0/BA1 bank select lines.
The device integrates on-die ATCSR logic that dynamically adjusts self-refresh current based on die temperature (e.g., 180μA at 45°C → 230μA at 85°C for full-array refresh), and supports two power-down modes: standard (0.23mA) and deep (10μA), both entered via CKE deactivation with defined entry latencies (tSB ≤ 6ns for -6 speed grade).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128Mb (2,097,152 words × 4 banks × 16 bits) |
| Supply Voltage | 1.8V ±0.15V (VDD/VDDQ = 1.7–1.95V); separate I/O power improves noise immunity |
| Max Clock Frequency | 166MHz (tCK = 6ns, CL=3); supports 133MHz (tCK = 7.5ns) for lower-power operation |
| CAS Latency | Programmable CL=2 or CL=3; determines read data valid delay after column address strobe |
| Refresh Requirement | 4K cycles per 64ms; enables predictable DRAM retention without external refresh controller overhead |
| Deep Power-Down Current | 10μA at 25°C; reduces standby leakage by >99% vs. normal standby (10mA), critical for multi-day battery life |
| Package | 54-ball VFBGA (x16), 8mm × 6.4mm × 0.8mm; footprint compatible with space-constrained mobile PCBs |
| Operating Temperature | -40°C to +85°C (industrial grade); validated for thermal cycling in handheld enclosures |
Pinout & Package
W987D6HBGX6I TR uses a 54-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package optimized for mobile applications. Pin assignments follow JEDEC-standard LPSDR x16 ballout with dedicated VDD/VSS and VDDQ/VSSQ power/ground pairs for signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A10 controls auto-precharge enable |
| BA0, BA1 | Bank Address | Selects one of four internal banks during activate/read/write commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports burst transfers up to 8 words per access |
| UDQM, LDQM | Data Mask | Controls write masking and output high-impedance during reads (latency = CL) |
| CLK, CKE | Timing Control | CLK synchronizes all inputs; CKE gates clock domain entry into power-down/self-refresh modes |
| CS, RAS, CAS, WE | Command Decode | Standard SDRAM command pins defining activate, read, write, precharge, and refresh operations |
| VDD, VSS | Core Power/Ground | 1.8V supply for logic and address buffers; isolated from I/O domain to reduce switching noise |
| VDDQ, VSSQ | I/O Power/Ground | 1.8V supply for DQ/DQM drivers; separate plane minimizes data eye distortion |
Key Features
| Feature | Design Value |
|---|---|
| Automatic Temperature Compensated Self Refresh (ATCSR) | Reduces refresh current variation across temperature: 180–230μA full-array range (45–85°C), enabling stable low-power retention without external thermal sensors |
| Partial Array Self Refresh (PASR) | Allows selective refresh of 1/4, 1/2, or full memory array; cuts self-refresh current up to 17% vs. full-array mode in idle display buffer scenarios |
| Deep Power Down Mode (DPD) | Enters sub-10μA state with tSB ≤ 6ns; retains data indefinitely while disabling all internal clocks and logic, ideal for suspend-to-RAM in mobile OS |
| Programmable Output Driver Strength | Adjusts DQ slew rate and drive strength via mode register; mitigates signal integrity issues on varied trace lengths and loads without board redesign |
| LVCMOS-Compatible Interface | Meets 1.8V LVCMOS voltage thresholds (VIH ≥ 0.8×VDDQ, VOL ≤ 0.2V); ensures interoperability with application processors and SoCs using same I/O standard |
| Burst Length Flexibility | Configurable burst lengths (1, 2, 4, 8, full page) via mode register; optimizes bandwidth utilization for sequential pixel fetches or sparse code execution |
Applications
| Smartphone Baseband Memory | Digital Still Camera Buffer |
|---|---|
Use Scenario: Stores baseband processor firmware, protocol stack tables, and real-time voice codec buffers in 3G/UMTS handsets with tight thermal envelopes. IC Role / Device Role / Timing Role: Primary working memory for baseband SoC; operates in burst-read mode during call setup and interleaved-bank mode during data sessions. Use Value: Deep power-down mode extends standby time beyond 10 days; ATCSR maintains data retention across ambient temperatures from -10°C (cold outdoor use) to +65°C (sun-heated pocket). |
Use Scenario: Buffers high-resolution JPEG capture pipeline between image sensor and compression engine in compact digital cameras. IC Role / Device Role / Timing Role: Frame buffer memory supporting 12-bit RAW capture at 15fps; uses full-page burst writes during sensor dump and CL=3 reads during JPEG encoding. Use Value: 166MHz clock rate delivers 332MB/s peak bandwidth; PASR reduces active power by 12% when only preview buffer (1/4 array) is refreshed during live view. |
| Portable Media Player UI Cache | Industrial Handheld Terminal RAM |
Use Scenario: Holds GUI assets, font glyphs, and navigation history in battery-operated MP3/video players with OLED displays. IC Role / Device Role / Timing Role: Secondary memory mapped to ARM9/ARM11 cache-coherent bus; relies on auto-precharge and burst-length-4 reads for icon list scrolling. Use Value: 54-ball VFBGA fits 10mm × 10mm PCB area budget; low 0.23mA power-down current enables >30hr playback on single-cell Li-ion. |
Use Scenario: Provides runtime memory for barcode scanners and ruggedized field terminals operating in warehouses with wide temperature swings. IC Role / Device Role / Timing Role: Main system RAM for real-time Linux kernel; uses industrial-grade (-40°C to +85°C) rating and 4K/64ms refresh for reliable operation in uncontrolled environments. Use Value: Separate VDDQ/VSSQ planes suppress noise from motor drivers and RF modules; tRCD = 18ns ensures deterministic response to interrupt-driven I/O requests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power mobile SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS42S16100H-6BLI | Same 128Mb x16 density, 54-ball VFBGA, and 166MHz speed; lacks ATCSR and PASR features | Requires external thermal management for refresh tuning; suitable where ambient temperature is stable | Choose for cost-sensitive designs where full-temperature-range self-refresh optimization is not required |
| Winbond W987D2HBGX6I TR | Same family, but x32 organization (90-ball VFBGA); identical electrical specs and feature set except data bus width | Used in higher-bandwidth applications like video playback SoCs needing 32-bit interface | Select only when system bus width mandates x32; not pin-compatible due to different ball count and layout |
Compared with W987D6HBGX6I TR, IS42S16100H-6BLI offers identical speed and package but omits ATCSR/PASR - increasing worst-case refresh power by 28% at 85°C. W987D2HBGX6I TR shares all features but requires PCB redesign for 90-ball layout and doubles data path width, making it unsuitable as drop-in replacement.
Availability
W987D6HBGX6I TR is available at Aetrix Electronics and suitable for smartphone baseband subsystems, digital camera frame buffers, portable media player UI caches, industrial handheld terminals, and other embedded applications requiring stable component supply with long-term lifecycle support.
Supply support for W987D6HBGX6I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontrollers, with over 30 years of DRAM design experience and ISO/TS 16949-certified manufacturing.
W987D6HBGX6I TR belongs to Winbond's Mobile LPSDR product line, engineered specifically for battery-constrained portable electronics demanding ultra-low standby current, thermal-aware refresh, and compact packaging without sacrificing bandwidth.
FAQ
What is the maximum operating frequency and CAS latency supported by W987D6HBGX6I TR?
W987D6HBGX6I TR supports a maximum clock frequency of 166MHz with CAS latency (CL) of 3, delivering 332MB/s peak bandwidth in burst mode. It also supports CL=2 at 133MHz (tCK=7.5ns) for lower-power operation. These values are guaranteed across the full industrial temperature range (-40°C to +85°C) and are defined in the AC characteristics table of the official Winbond datasheet revision A01-002.
Does W987D6HBGX6I TR support deep power-down mode, and what is its typical current draw?
Yes, W987D6HBGX6I TR supports Deep Power Down (DPD) mode with a typical current draw of 10μA at 25°C, as specified in the DC characteristics table. This mode disables all internal clocks and logic while retaining memory contents, making it ideal for extended suspend states in portable devices. Entry is controlled via CKE deactivation with tSB ≤ 6ns for the -6 speed grade.
What package type and ball count does W987D6HBGX6I TR use?
W987D6HBGX6I TR uses a 54-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 8mm × 6.4mm × 0.8mm, configured for x16 data width. This matches the "LPSDR X 16" ball assignment documented in section 3.1 of the Winbond datasheet, with dedicated VDD/VSS and VDDQ/VSSQ power/ground pairs for noise isolation.
How does Automatic Temperature Compensated Self Refresh (ATCSR) function in W987D6HBGX6I TR?
W987D6HBGX6I TR implements on-die ATCSR that dynamically scales self-refresh current based on measured junction temperature: full-array IDD6 ranges from 180μA at 45°C to 230μA at 85°C. This eliminates need for external thermal sensors or firmware compensation, ensuring reliable data retention across operating conditions while minimizing average power versus fixed-rate refresh.
Is W987D6HBGX6I TR pin-compatible with other Winbond LPSDR parts like W987D2HBGX6I TR?
No, W987D6HBGX6I TR is not pin-compatible with W987D2HBGX6I TR. While both belong to the same LPSDR family and share identical features and speed grades, W987D2HBGX6I TR uses a 90-ball VFBGA package for x32 organization, whereas W987D6HBGX6I TR uses a 54-ball VFBGA for x16. The ball counts, layouts, and signal assignments differ fundamentally per sections 3.1 and 3.2 of the datasheet.
W987D6HBGX6I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPSDR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5.4 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-VFBGA (8x9)
W987D6HBGX6I TR FAQ
1.How can I place an order for W987D6HBGX6I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W987D6HBGX6I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W987D6HBGX6I TR reliable?
The price and inventory of W987D6HBGX6I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W987D6HBGX6I TR is usually 5 days.
3.What payment methods are accepted for W987D6HBGX6I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W987D6HBGX6I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W987D6HBGX6I TR?
W987D6HBGX6I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W987D6HBGX6I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W987D6HBGX6I TR?
For technical support, including W987D6HBGX6I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W987D6HBGX6I TR requirements.
6.How does Aetrix verify that W987D6HBGX6I TR is sourced from the original manufacturer or authorized distributors?
All W987D6HBGX6I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W987D6HBGX6I TR meets industry standards.
7.What is the process for return or replacement of W987D6HBGX6I TR?
All W987D6HBGX6I TR units undergo pre-shipment inspection (PSI). If there is an issue with W987D6HBGX6I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W987D6HBGX6I TR part is unused and in its original packaging.
Return procedure for W987D6HBGX6I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W987D6HBGX6I TR Tags
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